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IH工艺在微机械中的应用 总被引:3,自引:1,他引:3
介绍了微机械加工中的一项崭新技术--IH工艺,即集成聚合物固化立体光刻。这一技术是具有大纵横比的真三维立体加工工艺,而且可以加工聚合物和金属等多种材料。最后作者把IH工艺同LIGA工艺等传统工艺方法加以类比,提出了IH工艺的应用前景。 相似文献
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In Kyeong Yoo Changwook Moon Wonbong Choi Sangbo Kim Eunju Bae Seokjae Chung 《组合铁电体》2013,141(1-4):17-24
Abstract Electron beam patterns of ferroelectric switching emission, dielectric emission, and field emission were studied by patterning images on electron beam resist. It was observed that the pyroelectric emission is most acceptable for an 1:1 electron projection lithography application. Effects of the initial kinetic energy of electrons and distance between the emitter and the collector on pattern resolution were discussed. An 1:1 electron projection lithography was demonstrated by patterned emitter. 相似文献
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In semiconductor manufacturing, wafer quality control strongly relies on product monitoring and physical metrology. However, the involved metrology operations, generally performed by means of scanning electron microscopes, are particularly cost-intensive and time-consuming. For this reason, in common practice a small subset only of a productive lot is measured at the metrology stations and it is devoted to represent the entire lot. Virtual Metrology (VM) methodologies are used to obtain reliable predictions of metrology results at process time, without actually performing physical measurements. This goal is usually achieved by means of statistical models and by linking process data and context information to target measurements. Since semiconductor manufacturing processes involve a high number of sequential operations, it is reasonable to assume that the quality features of a given wafer (such as layer thickness and critical dimensions) depend on the whole processing and not on the last step before measurement only. In this paper, we investigate the possibilities to enhance VM prediction accuracy by exploiting the knowledge collected in the previous process steps. We present two different schemes of multi-step VM, along with dataset preparation indications. Special emphasis is placed on regression techniques capable of handling high-dimensional input spaces. The proposed multi-step approaches are tested on industrial production data. 相似文献