Pull-in-based μg-resolution accelerometer: Characterization and noise analysis

The pull-in time (t_pi) of electrostatically actuated parallel-plate microstructures enables the realization of a high-sensitivity accelerometer that uses time measurement as the transduction mechanism. The key feature is the existence of a metastable region that dominates pull-in behavior, thus making pull-in time very sensitive to external accelerations. Parallel-plate MEMS structures have been designed and fabricated using a SOI micromachining process (SOIMUMPS) for the implementation of the accelerometer. This paper presents the experimental characterization of the microdevices, validating the concept and the analytical models used. The accelerometer has a measured sensitivity of 0.25 μs/μg and a bandwidth that is directly related to the pull-in time, BW = 1/2t_pi ≈ 50 Hz. These specifications place this sensor between the state of the art accelerometers found both in the literature and commercially. More importantly, the resolution of the measurement method used is very high, making the mechanical-thermal noise the only factor limiting the resolution. The in-depth noise analysis to the system supports these conclusions. The total measured noise floor of 400 μg (100 μs) is mainly due to the contribution of the environmental noise, due to lack of isolation of the experimental setup from the building vibrations (estimated mechanical thermal noise of 2.8 μg/√Hz). The low requirements of the electronic readout circuit makes this an interesting approach for high-resolution accelerometers.     

飞行仿真环境中惯性测量单元建模

准确的惯性测量单元(IMU)模型对飞行仿真至关重要,模型的准确性直接影响仿真试验的可靠性.为了在飞行仿真试验中能够提供有效的角速度和线加速度数据,需要建立准确的惯性测量单元仿真模型.在推导陀螺和加速度计数学模型的基础上,提出了建立陀螺及加速度计的仿真模型方法.为提高模型准确性,考虑了IMU误差影响.通过模拟AD公司的M...     

基于MEMS加速度计的混凝土内部缺陷检测系统

针对冲击回波法进行混凝土内部缺陷检测时,传统的单点有线检测方式存在精度低、检测复杂的问题,提出了一种基于MEMS三轴加速度计的快速检测算法,同时搭建了相应的硬件系统.该系统节点采用MEMS加速度计作为拾振器,利用FPGA作为无线传感器网络节点的控制核心,通过2.4 GHz ISM频段与上位机进行无线通信.经实验测试,系...     

一种用于微喷的感应加热器设计与仿真

提出了一种用于热微喷头的感应加热器新结构。进行了相关的结构和工艺设计,在MEMS工艺环境下制作出了可以非接触加热,工艺结构简单,使用寿命长的微感应加热器。使用ANSYS对微感应加热器进行了建模和仿真分析,结果显示:感应加热器的最大加热功率可达到5 mW以上,满足设计要求,同时得到了感应加热器的功率影响因素。     

Study of symmetric microstructures for CMOS multilayer residual stress

This study presents a fabrication-based approach to improve the curl-up effect in complementary metal oxide semiconductor (CMOS) multilayer large-area planar structures. Control of the residual stress of CMOS multilayer microstructures is necessary for development of microelectromechanical systems (MEMS) sensors such as accelerometers and micromirrors. In this work, 3D symmetric geometry can be used to overcome effectively the residual stresses in CMOS multilayer microstructures. To demonstrate this concept, a symmetric multilayer flat-plane is fabricated and release-etched using an isotropic plasma etching process. The isotropic etch characteristics and lateral undercut can be controlled using a chamber pressure of 0.47 ± 0.2 Torr. A flat-plane structure with an area of 500 μm × 500 μm is fabricated using multilayer materials, including four metal and three silicon dioxide layers. Based on this approach, the measured results show the residual stress effect can be minimized in CMOS multilayer microstructures, and furthermore the curl-up effect of flat-plane is less than 2 μm across the 500 μm × 500 μm area.     

A MEMS affinity glucose sensor using a biocompatible glucose-responsive polymer

We present a MEMS affinity sensor that can potentially allow long-term continuous monitoring of glucose in subcutaneous tissue for diabetes management. The sensing principle is based on detection of viscosity changes due to affinity binding between glucose and poly(acrylamide-ran-3-acrylamidophenylboronic acid) (PAA-ran-PAAPBA), a biocompatible, glucose-specific polymer. The device uses a magnetically driven vibrating microcantilever as a sensing element, which is fabricated from Parylene and situated in a microchamber. A solution of PAA-ran-PAAPBA fills the microchamber, which is separated from the surroundings by a semi-permeable membrane. Glucose permeates through the membrane and binds reversibly to the phenylboronic acid moiety of the polymer. This results in a viscosity change of the sensing solution, which is obtained by measuring the damped cantilever vibration using an optical lever setup, allowing determination of the glucose concentration. Experimental results demonstrate that the device is capable of detecting glucose at physiologically relevant concentrations from 27 mg/dL to 324 mg/dL. The glucose response time constant of the sensor is approximately 3 min, which can be further improved with device design optimization. Excellent reversibility and stability are observed in sensor responses, as highly desired for long-term, stable continuous glucose monitoring.     

基于九轴MEMS定位系统误差分析与补偿算法研究

基于九轴MEMS定位系统,对由陀螺仪零偏造成的位移平面偏转误差进行分析与补偿。通过实验与推导,首次给出偏差的定量分析和误差传播的数学模型。为估计偏差,设计了一种新的状态向量中仅包含陀螺仪零偏的、简化扩展卡尔曼滤波（ SEKF）技术,克服了无加速度计辅助条件下的偏差估计问题,降低了计算量,能够很好地满足位移实时估计需求。硬件实验证明：经过偏差补偿的九轴MEMS定位系统,能够准确估计有限范围内周期性运动的位移,幅值定位精确度达到90%。该系统可用于无人机、机器人定位等领域。     

基于旋转谐振结构的单芯片二维电场传感器

提出并研制了一种二维电场检测传感芯片,将四个电场测量微型单元和旋转式驱动微结构集成在3. 5 mm ×3. 5 mm的敏感结构上,实现了单芯片的电场二维测量.介绍了传感器的工作原理、敏感结构的设计,以及基于绝缘体上硅( SOI)工艺的单芯片微型二维电场传感器制备工艺技术.成功研制出传感器原理样机,研究了微型二维电场传感器的标定方法,开发了用于电场二维标定的测试装置,并在室温常压下对传感器进行了二维标定.实验结果表明:该传感器能够有效减小电场的轴间耦合干扰,测量误差优于7. 04%,线性度可达到1. 25%.     

基于AR模型的MEMS陀螺误差补偿方法研究

针对MEMS(Microelectro Mechanical Systems）陀螺具有成本低、体积小但误差较大的问题,探讨MEMS陀螺的误差补偿方法。基于AR模型方法,采集MEMS陀螺原始信号,对原始信号进行预处理,利用预处理后的数据建立陀螺的AR(Auto Regressive)模型,辨识出模型参数。利用该模型对陀螺信号进行误差补偿,计算出陀螺的较精确值。通过对某MEMS陀螺误差补偿的静态和动态试验表明,提出的方法能够有效地减小误差,提高陀螺的测量精度。     

新型MEMS三维振动传感器的有限元分析

针对目前多维振动传感器的需求,研制了一种基于MEMS技术的仿昆虫纤毛三维振动传感器。首先,介绍了振动传感器的仿生机理和工作原理;然后,推导了振动传感器的力学模型并建立了有限元模型;最后,对该传感器进行了静、动态特性分析,并通过实验验证最终得出该传感器的灵敏度为274.18μV/gn、维间耦合小于等于0.612 5%、测量范围为±25 gn、共振频率为2 342.6 Hz、抗冲击能力为100 gn。