双色中波红外图像差异纹理特征分析方法研究

针对双色中波红外图像特征空间维数高,不易于对其双波段成像差异进行综合分析的问题,提出了一种基于赋权思想及雷达图的双波段图像差异纹理特征的分析方法.该方法首先构造一个特征选择矩阵,利用其选择出能够满足双波段图像差异分布规律的有效纹理特征;然后利用赋权思想将差异不显著的纹理特征去除;最后采用雷达图对保留下的差异特征进行高维显示,并由雷达图中多边形的形状信息得到维数较少的图形特征.实验数据表明,降维后的特征能够综合反映双波段图像的纹理差异幅度,为后期差异特征驱动的多级融合方法探索奠定了基础.     

高工作温度碲镉汞红外探测器研究进展

高工作温度碲镉汞红外探测器作为最近来发展起来的新型探测器,在保证性能不变的基础上,实现了尺寸小、重量轻、功耗低等功能,成为军事侦察、无人机、无人平台的重要探测器件。本文阐述了高工作温度碲镉汞红外探测器的基本原理,重点介绍了碲镉汞P-on-N红外探测器的器件结构设计,并且对美国Raytheon、法国Sofradir、德国AIM、美国Teledyne、美国DRS等公司的研究进展进行了综述性介绍。     

Control and growth of middle wave infrared (MWIR) Hg<Subscript>(1−x)</Subscript>Cd<Subscript>x</Subscript>Te on Si by molecular beam epitaxy

Middle wave infrared (MWIR) HgCdTe p-on-n double-layer heterojunctions (DLHJs) for infrared detector applications have been grown on 100-mm Si (112) substrates by molecular beam epitaxy (MBE) for large format 2,560×512 focal plane arrays (FPAs). In order to meet the performance requirements needed for these FPAs, cutoff and doping uniformity across the 100-mm wafer are crucial. Reflection high-energy electron diffraction (RHEED), secondary ion mass spectrometry (SIMS), Fourier transform infrared spectrometry (FTIR), x-ray, and etch pit density (EPD) were monitored to assess the reproducibility, uniformity, and quality of detector material grown. Material properties demonstrated include x-ray full width half maximum (FWHM) as low as 64 arc-sec, typical etch pit densities in mid-10⁶ cm⁻², cutoff uniformity below 5% across the full wafer, and typical density of macrodefects <1000 cm⁻². The detector quality was established by using test structure arrays (TSAs), which include miniarray diodes with the similar pitch as the detector array for easy measurement of critical parameters such as diode I-V characteristics and detector quantum efficiency. Typical I-V curves show excellent R₀A products and strong reverse breakdown characteristics. Detector quantum efficiency was measured to be in the 60–70% range without an antireflection coating.     

HgCdTe <Emphasis Type="Italic">p</Emphasis>-on-<Emphasis Type="Italic">n</Emphasis> Focal-Plane Array Fabrication Using Arsenic Incorporation During MBE Growth

Extrinsic p-type doping during molecular-beam epitaxy (MBE) growth represents an essential generic toolbox for advanced heterostructures based on the HgCdTe material system: PiN diodes, mesa avalanche photodiodes (APD) or third-generation multispectral focal-plane arrays. Today, arsenic appears to be the best candidate to fulfill this role and our group is actively working on its incorporation during MBE growth, using an original radio frequency (RF) plasma source for arsenic. Such a cell is supposed to deliver a monatomic As flux, and as expected we observed high As electrical activation rates after annealing short-wave (SW), mid-wave (MW), and long-wave (LW) layers. At last, a couple of technological runs have been carried out in the MW range in order to validate the approach on practical devices. p-on-n focal-plane arrays (FPA) have been fabricated using a mesa delineated technology on an As-on-In doped metallurgical heterojunction layer grown on a lattice-matched CdZnTe layer (320 × 256, 30 μm pitch, 5 μm cutoff at 77 K). Observed diodes exhibit very interesting electro-optical characteristics: large shunt impedance, high quantum efficiency, and no noticeable excess noise. The resulting focal-plane arrays were observed to be very uniform, leading to high operabilities. Noise equivalent temperature difference (NETD) distributions are very similar to those observed with the As ion-implanted p-on-n technology, fabricated in our laboratory as well. In our opinion, those excellent results demonstrate the feasibility of our MBE in situ arsenic doping process. Good electrical activation rates and high-quality layers can be obtained. We believe that such an approach allows precise control of the p-doping profile in the HgCdTe layer, which is necessary for advanced structure designs.     

MBE growth and device processing of MWIR HgCdTe on large area Si substrates

The traditional substrate of choice for HgCdTe material growth has been lattice matched bulk CdZnTe material. However, as larger array sizes are required for future devices, it is evident that current size limitations of bulk substrates will become an issue and therefore large area Si substrates will become a requirement for HgCdTe growth in order to maintain the cost-efficiency of future systems. As a result, traditional substrate mounting methods that use chemical compounds to adhere the substrate to the substrate holder may pose significant technical challenges to the growth and fabrication of HgCdTe on large area Si substrates. For these reasons, non-contact (indium-free) substrate mounting was used to grow mid-wave infrared (MWIR) HgCdTe material on 3″ CdTe/Si substrates. In order to maintain a constant tepilayer temperature during HgCdTe nucleation, reflection high-energy electron diffraction (RHEED) was implemented to develop a substrate temperature ramping profile for HgCdTe nucleation. The layers were characterized ex-situ using Fourier transform infrared (FTIR) and etch pit density measurements to determine structural characteristics. Dislocation densities typically measured in the 9 10⁶ cm⁻² to 1 10⁷ cm⁻² range and showed a strong correlation between ramping profile and Cd composition, indicating the uniqueness of the ramping profiles. Hall and photoconductive decay measurements were used to characterize the electrical properties of the layers. Additionally, both single element and 32 32 photovoltaic devices were fabricated from these layers. A RA value of 1.8 10⁶-cm² measured at −40 mV was obtained for MWIR material, which is comparable to HgCdTe grown on bulk CdZnTe substrates.     

Imaging one-dimensional and two-dimensional planar photodiode detectors fabricated by ion milling molecular beam epitaxy CdHgTe

Imaging one-dimensional (1-D) and two-dimensional (2-D) arrays of mid-wavelength infrared (MWIR) and long-wavelength infrared (LWIR) planar photodiodes were fabricated by ion milling of vacancy-doped molecular beam epitaxy Cd_xHg_1−xTe layers. Sixty-four-element 1-D arrays of 26×26 μm² or 26×56 μm² diodes were processed. Zero-bias resistance-area values (R₀A) at 77 K of 4×10⁶ Θcm² at cutoff wavelength λ_CO=4.5 μm were measured, as well as high quantum efficiencies. To avoid creating a leakage current during ball bonding to the 1-D array diodes, a ZnS layer was deposited on top of the CdTe passivation layer, as well as extra electroplated Au on the bonding pads. The best measured noise equivalent temperature difference (NETD) on a LWIR array was 8 mK, with a median of 14 mK for the 42 operable diodes. The best measured NETD on a MWIR array was 18 mK. Two-D arrays showed reasonably good uniformity of R₀A and zero-bias current (I₀) values. The first 64×64 element 2-D array of 16×16 μm² MWIR diodes has been hybridized to read-out electronics and gave median NETD of 60 mK.     

Metal-Organic Chemical Vapor Deposition of Hg<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Cd<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Te Fully Doped Heterostructures Without Postgrowth Anneal for Uncooled MWIR and LWIR Detectors

Uncertainty in precursor pulse delays and shapes has been found to be an important factor in Hg_1−x Cd _x Te metal-organic chemical vapor deposition (MOCVD) growth using the interdiffused multilayer process (IMP). Herein, metal-organic concentration changes in the growth zone are examined using an in␣situ infrared (IR) absorption gas monitoring system, and modifications to the interdiffused multilayer process are applied for in␣situ control of stoichiometry, improved morphology, minimized process length, and consumption of precursors. Dimethylcadmium (DMCd) introduction during IMP flush stages in HgTe was used for stoichiometry control. The final stage of heterostructure formation was optimized to prevent Hg outdiffusion. As a result, vacancy concentration was reduced far below the equilibrium level at the growth conditions so the background of n-type doping was revealed. Acceptor doping with arsine (AsH₃) and trisdimethylaminoarsenic (TDMAAs) was examined over a wide range of compositions, and doping levels of 5 × 10¹⁵ cm⁻³ to 5 × 10¹⁷ cm⁻³ were obtained. The presence of both arsenic dopants significantly increased the CdTe growth rate. This caused an increase of Cd mole fraction in the grown material. Doped heterostructures can be grown without any postgrowth anneal and used for mid- and long-wavelength infrared (MWIR and LWIR) devices operating at near-ambient temperatures. Student paper; supervisors are A. Rogalski, J. Piotrowski and J. Szmidt     

中波红外多光谱成像技术研究

多光谱成像技术结合成像和光谱测量技术,同时探测目标的光谱和几何特征,在目标识别和抑制背景杂波方面具有技术优势。研制了一套工作于中波红外波段的四通道多光谱成像系统。利用窄带滤光片和面阵探测器技术,构建了基于时序扫描的凝视成像型红外多光谱成像系统。根据红外探测器性能参数,对各个光谱通道的温度灵敏度进行了估算。在系统设计时通过合理地滤光片布局,尽量延长各个光谱通道的信号积分时间,以提高各个光谱通道温度灵敏度。利用研制的中波多光谱成像系统,对室外进行了成像,并对各个通道的成像结果进行了比较分析。     

32×32双色红外探测器同步读出电路设计

双色（中短波）同步工作模式的红外探测器,其输出光电流信号为中波信号和中短波混合信号。文中提出了一种电压信号相减的电路结构,可在中波和中短波信号同步积分后,将两个波段的积分电压信号进行相减,得到单独的短波信号,实现信号分离的过程,并对32×32规模的电路进行了仿真验证,电路在仿真中有良好的性能。     

双色中波红外图像的分割支持度变换融合

提出了基于形态学分割和支持度变换的双色中波红外图像的融合方法.通过腐蚀膨胀操作、加权叠加实现两幅细分波段图像的局部处理,消除了第一细分波段图像的太阳照射饱和区,然后利用支持度变换对图像进行融合,将两幅图像的细节信息综合起来,使图像更清晰.实验结果表明:同小波包变换融合方法相比,经本文算法融合后的图像有效消除了太阳照射造成的饱和区,太阳影响参数降低了60.05%,局部标准偏差和局部粗糙度分别增加了2.59%和3.39%,处理时间缩短了66.77%,证明了融合方法的有效性.