Sub‐Millimeter‐Scale Monolayer p‐Type H‐Phase VS2

2D H‐phase vanadium disulfide (VS₂) is expected to exhibit tunable semiconductor properties as compared with its metallic T‐phase structure, and thus is of promise for future electronic applications. However, to date such 2D H‐phase VS₂ nanostructures have not been realized in experiment likely due to the polymorphs of vanadium sulfides and thermodynamic instability of H‐phase VS₂. Preparation of H‐phase VS₂ monolayer with lateral size up to 250 µm, as a new member in the 2D transition metal dichalcogenides (TMDs) family, is reported. A unique growth environment is built by introducing the molten salt‐mediated precursor system as well as the epitaxial mica growth platform, which successfully overcomes the aforementioned growth challenges and enables the evolution of 2D H‐phase structure of VS₂. The honeycomb‐like structure of H‐phase VS₂ with broken inversion symmetry is confirmed by spherical aberration‐corrected scanning transmission electron microscopy and second harmonic generation characterization. The phase structure is found to be ultra‐stable up to 500 K. The field‐effect device study further demonstrates the p‐type semiconducting nature of the 2D H‐phase VS₂. The study introduces a new phase‐stable 2D TMDs materials with potential features for future electronic devices.     

低损耗高集成度氮化硅阵列波导光栅波分(解)复用器

氮化硅平台阵列波导光栅(AWG)波分(解)复用器具有损耗低、集成度高、温度敏感性低等优势。基于联合微电子中心有限责任公司(CUMEC)的氮化硅集成光子工艺平台,从波导传输损耗、阵列波导与平板波导模式转换损耗、截断损耗、泄漏损耗等方面对氮化硅基AWG波光(解)复用器插入损耗进行了优化,并采用标准CMOS工艺完成低损耗C波段AWG密集波分(解)复用器制备。该氮化硅基AWG密集波分(解)复用器输出通道数为16,输出通道频率间隔200 GHz。测试结果表明,该AWG波分(解)复用器的平均插入损耗为2.34 dB,1 dB带宽为0.44 nm,3 dB带宽为0.76 nm,串扰约为-28 dB。芯片尺寸为850μm×1700μm,较平面光波导(PLC)基AWG大大减小。     

湿化学法合成先驱体制备氮化硼纤维的研究

以硼酸和三聚氰胺为原料,采用湿化学法合成先驱体,在氮气气氛中制备出氮化硼(BN)纤维。用中和滴定法、红外吸收光谱(IR)、X射线衍射(XRD)、扫描电镜(SEM)对合成的先驱体及制得的BN纤维的氮含量、形貌及结构进行分析。结果表明合成温度1,700℃,保温时间3 h,氮气流量2 L/min时制得的BN纤维的氮含量为53.46%,达到理论值的95%。先驱体分子中存在B—N、N—H、C—O—C、—(B—N)—结构单元。用扫描电镜观察制得的BN纤维直径为2~10 靘,长径比为40~50。     

固体铝电解电容器用导电高分子制备工艺进展

依据近年的相关专利,综述了用于固体铝电解电容器的导电高分子的最新制备工艺,介绍了导电高分子固体铝电解电容器的结构,详细描述了制备导电高分子的两种主要方法——化学聚合和电化学聚合——及其进展历程。介绍了新颖掺杂剂的发现与使用,对各种工艺的特点进行了评述。     

InGaAs／AlGaAs 941 nm高功率半导体激光二极管阵列

利用金属有机化合物气相淀积(MOCVD)技术生长了InGaAs／GaAs／AlGaAs分别限制应变单量子阱激光器材料。利用该材料制成半导体激光器线阵的峰值波长为941nm，光谱的半高全宽(FWHM)为3．3nm，在400μs、50Hz的输入电流下，输出峰值功率达到67．9W，斜率效率高达0．85W／A(64％)。     

Reliability studies of MOCVD TiSiN and EnCoRe Ta(N)/Ta

Passivated single damascene copper SiO₂ damascene lines were evaluated in combination with TiSiN and Ta(N)/Ta diffusion barriers. Leakage current, breakdown and time-dependent dielectric breakdown properties were investigated on a wafer level basis for temperatures ranging between room temperature and 150 °C. It is found that the leakage performance of the wafers with a TiSiN barrier is better at room temperature, but at 150 °C the performance levels out with Ta(N)/Ta. Time-dependent dielectric breakdown measurements at 150 °C show that the lifetime of the interconnect is higher with the selected Ta(N)/Ta barrier than for TiSiN.     

锆酸铅薄膜的生长特性与表面化学态

以醋酸铅和异丙醇锆为原料，乙二醇甲醚为溶剂。通过溶胶-凝胶法和快速退火工艺在Pt(111)／Ti／SiO2／Si(100)基片成功地制备出不开裂的钙钛矿PbZrO3薄膜。用XRD和原子力显微镜测量了薄膜随退火温度变化的结构和表面形貌特征，用XPS测试了650℃退火PbZrO3薄膜的表面化学态。     

PECVD法低温沉积多晶硅薄膜的研究

在玻璃衬底上采用常规的PKCVD法在低温(≤400℃)条件下制得大颗较(直径＞100nm)、择优取向(220)明显的多晶硅薄膜。选用的反应气体为SiF4和H2混合气体。加入少量的SiH4后，沉积速率提高了近10倍。分析认为，在低温时促使多晶硅结构形成的反应基元应是SiFmHn(m n≤3)，而不可能是SiHn(n≤3)基团。     

纳米二氧化铈化学共沉淀法制备及结构表征

采用化学共沉淀法制备了稀土氧化物CeO2纳米粉末材料,并用XRD、SEM和TEM对其结构特性进行了表征。分析结果表明,化学共沉淀法制备的CeO2纳米粉末颗粒细小均匀,形状完整,CeO2粉末粒子尺寸在20 nm左右。粉末的电子衍射分析发现,CeO2纳米粉末具有完整的晶格。     

半导体元件清洗技术浅谈

随着社会的进步和科学技术的迅猛发展,对洗净技术的要求也越来越高。清洗方式多种多样,但最主要的是突出在喷射清洗和超声波清洗两大方面,应用于全国各行各业,并且也得到了明显进步。