NiCuZn铁氧体和银内电极的共烧行为

NiCuZn铁氧体正作为磁介质广泛地应用于低烧多层片式电感，因此有必要对其与银内电极的共烧行为进行研究。该文主要介绍NiCuZn铁氧体／银内电极多层复合体共烧过程中的烧结收缩、界面反应、扩散对介质性能的影响。尖晶石结构中存在相当数量的空位，这为银离子提供了一定的溶解度，因此在共烧过程中银对铁氧体的相组成影响较小。银对铁氧体性能的影响体现在两个方面。一方面是由于银具有相对低的烧结温度，从而在烧结过程中起到助烧剂的作用，促进致密化过程，提高烧结体的密度和磁导率；另一方面，银促使铁氧体中的铜在晶界处析出，导致晶界处应力，使磁导率降低，晶粒生长也被一定程度地抑制。     

采用5V单电源供电的通信收发器LMS202E/LMS485及其应用

介绍了采用单5V电源工作的RS-232通信双收发器LMS202E和高速双向数据通信差分总线收发器LMS485的主要特性 ,给出了它们的典型应用电路。     

TMS320F240串口通信特征及其应用

主要论述了TMS320F240串行外设接口模块的特点，并通过与MCS5l单片机通信，实现液晶显示。     

NCFW专家系统的汉语接口

NCFW系统是适合于花岗岩与变质岩地区的勘探地下水专家系统，系统的人机交互既可用菜单（亦称项目单）方式，亦可用汉语对话方式。这两种方式既可混合使用亦能灵活切换。本文着重描述了汉语接口的设计思想、实现中采用关键技术以及系统运行实例。     

高速数字光电耦合器HCPL-260L/060L及其应用

HCPL-260L/060L是美国安捷伦科技有限公司推出的高速数字光电耦合器。该器件的逻辑电平与LVTTL/LVCMOS兼容 ,并具有输出使能端。文中详细介绍了HCPL -260L/060L的引脚功能、内部结构、主要特点、使用要求和注意事项 ,给出了它与LVTTL器件的典型接口电路及隔离的3.3VRS232接口电路。     

Oscillatory crack tip triangular elements for finite element analysis of interface cracks

In this paper a special crack tip element has been developed in which displacements and stresses have the same behaviour as those of bi‐material interface cracks with open tips. The element degenerates into a traditional triangular quarter point element in cases of homogeneous cracks. An isoparametric co‐ordinate system (ρ, t) is defined in this study, and numerical techniques using these co‐ordinates to evaluate Jacobian matrices, shape function derivatives, and element stiffness matrices are developed. Also, equations calculating the complex stress intensity factor using displacements are obtained in this study. Numerical results are in good agreement with known analytical solutions in two examples. Copyright © 2003 John Wiley & Sons, Ltd.     

Efficient model reduction in non-linear dynamics using the Karhunen-Loève expansion and dual-weighted-residual methods

 We look at the task of computing the time-evolution of a non-linear system for a long time, in our case under random external influences. Our specific example is the fatigue evaluation of a wind turbine. To facilitate such a computation, we look at a reduction of the computational effort by projecting everything on a low-dimensional basis. In this case we take the Karhunen-Loève basis generated from running the model a little while under the random loading. It is important that the error which is caused by this reduction process can be controlled. We estimate the error by dual or adjoint methods. This in turn allows the process of model reduction to be performed adaptively. Dedicated to the memory of Prof. Mike Crisfield, for his cheerfulness and cooperation as a colleague and friend over many years.     

A new curvature technique calculation for surface tension contribution in PLIC-VOF method

The volume of fluid (VOF) methods have been used for numerous numerical simulations. Among these techniques used to define the moving interface, the piecewise linear interface reconstruction (PLIC-VOF) is one of the most accurate. A study of the superficial tension impact on two-phase flow with free surface is presented. A new method based on direct staggered grid is developped to include surface tension in PLIC-VOF. The new numerical curvature calculation method doesn't need smoothed colour function and leads to less “spurious current”. This technique is applied to the calculus of surface tension force in the case of the rise of air bubble in viscous liquid and the fall of liquid drop in the same liquid on free surface. Droplets, thin layer and capillarity waves are observed after the free surface rupture for different Bond number. The influence of surface tension calculus is then obvioused and when the drop hit the free surface, wavelets propagate toward the virtual boundaries imposed.     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.     

SDI接口数字监视设备的设计与实现

介绍了一种对SDV(串行数字视频)信号进行解码的设备设计方案，提出了该系统的总体构架，并对该系统的硬件设计、软件设计进行了全面的论述。设计的产品具有较高的性能价格比，已进入了推广阶段。