超细铁粉和氧化铁颗粒的研究

用透射电镜和图像分析仪等研究了超细铁粉和γ-Fe_2O_3粉末的结构、形貌、粒子的平均尺寸以及粒度分布。研究结果表明,多数超细铁粉粒子近似呈球形,并且,铁粉粒子由两相组成,粒子的核心部分是金屑a-Fe,表面的包裹层为氧化物层,它由Fe_3O_4和7-Fe_O_3的混合物组成。氧化层的平均厚度大约占整个粒子直径的20％左右。羰基铁粉粒子(含氧化层)的平均直径为16nm。直径在4～24nm范围的粒子数占总粒子数的91％,而7-Fe_2O_3粉末既有雪茄状粒子,也有小球状粒子。分析表明,球状粒子的平均直径为113nm,雪茄状粒子的平均直径(按<长 宽>/2计算)为148nm。由于超细铁粉粒子很细,且有磁性,制备电镜试样时分散比较困难。本文比较了几种分散方法后,使用了一种较好的分散方法——超声喷管分散法。     

Cohesive stresses and size effect in quasi-brittle materials

A novel approach to the derivation of Bažant’s size effect law is presented. Contrarily to the original Lagrangian derivation which hinged on energetic consideration, a Newtonian approach based on local stress intensity factors is presented. Through this approach, it is shown that Bažant’s size effect law is the first (and dominant) term in a series expansion for the nominal stress. Furthermore, analytical expressions forB are derived for selected specimen geometries.     

优化印制电路板地线设计

印制电路板地线是印制电路板设计的一个基本问题，本文详细分析了印制电路板地线对电路的干扰，介绍了减小地线对电路干扰的方法，阐述了印制电路板地线的设计规则，将其应用到实际的印制电路板设计中，可大大提高印制电路板的抗干扰能力，实现电磁兼容。     

Trade-off analysis on cost and manufacturing technology of an electronic product: Case study

A trade-off analysis on the cost and system packaging metrics of an electronic product aimed at the commercial/retail industry has been carried out. By comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete components, denser PCB wiring technology, double sided IC package surface mount, surface mount connectors, and improved plastics for the product housing. The analysis concluded that PCB area reduction of 40%, using a single PCB instead of three boards, reduction in board cost of over 50% and product weight reduction of over 28% are possible using available technologies.     

面向表面组装工艺技术的PCB焊盘设计

尽管电子设计类软件已相当先进和方便，而且更新速度也很快，但是仍然无法满足各个层次的设计人员的需求，特别是适合各种元素封装形式的焊盘设计库并不能让设计和制造者满意，为了在此方面对PCB设计有所帮助，从印制电路板焊盘的设计方法入手，针对表面组装工艺技术特点，分析了PCB焊盘对PCA可靠性的影响因素，并根据相关的质量要求提出了较为简便的设计方案。     

高层印制线路板正面临的对位挑战

封装工业正在推动着印制线路板技术水平朝着半导体要求的方向发展。高密度印制线路板正广泛用于网络路由器、自动测试设备和服务器领域。高密度要求(>150 IO/cm~2)正成为客户的普通需求。为满足现有的高密度封装要求,由于线宽、线距和通孔孔径正接近传统制作极限,普遍的方法就是不断增加印制线路板的层数。这些特征正驱动着印制线路板在基材、图像转移、蚀刻、电镀、阻焊、测试流程和对位系统的变化。此文主要讲述了印制线路板特性的变化趋势和利用对位模式和雷利分布去预测满足高级对位要求的能力以及印制线路板各流程中有关对准度的控制要点。     

A note on calculating autocovariances of long-memory processes

In this paper, we consider a method (splitting) for calculating the auto- covariances of fractional integrated processes (ARFIMA) and generalized integrated processes (GARMA). The splitting method does not require any restriction on the autoregressive roots, and allows fast calculation of the autocovariances of these processes.     

Inherent emf relaxation of electrochemical cells with nanocrystalline Ag electrodes

The open circuit voltage of the electrochemical cell Ag (nano)|solid silver electrolyte|Ag (macro) is found to be inherently unstable. Even under conditions which support the morphological stability of the arrangement of nanocrystalline silver, the particles grow significantly as soon as they function as electrodes; i.e. when they are in contact with a silver electrolyte and connected electronically at the same time. The process is shown to be due to electrochemical Ostwald ripening with the interfacial transfer of Ag⁺ through the Ag/electrolyte interface being the rate limiting step. Its activation energy is 0.01 eV. The decay is in good agreement with modelling results.     

Estimation of Load Capacity of Pipe Piles in Sand Based on Cone Penetration Test Results

Pipe piles can be classified as either closed- or open-ended piles. In the present paper, the load capacity of both closed- and open-ended piles is related to cone penetration resistance qc through an experimental program using calibration chamber model pile load tests and field pile load tests. A total of 36 calibration chamber pile load tests and two full-scale field pile load tests were analyzed. All the test piles were instrumented for separate measurement of each component of pile load capacity. Based on the test results, the normalized base resistance qb/qc was obtained as a function of the relative density DR for closed-ended piles, and of both the relative density DR and the incremental filling ratio (IFR) for open-ended piles. A relationship between the IFR and the relative density DR is proposed as a function of the pile diameter and driving depth. The relationship between IFR and DR allows the estimation of IFR and thus of the pile load capacity of open-ended piles at the design stage, before pile driving operations.     

浅谈开关电源中的平面变压器

与传统变压器相比较,使用平面变压器可以提高开关电源的功率密度,减小开关电源中磁性元件的体积。因此,近年来平面变压器被广泛地研究。文章介绍了平面变压器的结构,将平面变压器与传统变压器进行比较,分析综述了平面变压器在当今开关电源发展应用的优势和前景,并进一步说明了平面变压器中绕组间距选择,绕组交叉技术及PCB绕组设计等要点。