电源对介质阻挡放电(DBD)激发准分子(XeCl*)辐射的影响

本文对电源参数如电压幅值、频率及正负电压对介质阻挡放电激发准分子XeCl 紫外 (30 8nm)辐射的影响进行了实验研究。结果表明 ,UV辐射随电压幅度的增加而增强 ,但效率下降 ;提高频率 ,增加了放电次数 ,导致UV辐射的增强 ;此外 ,在较高的频率下 ,电压上升沿变陡 ,使得电子获得的能量主要用于原子的激发和电离。正、负电压放电的不对称源于电极结构的不对称而引起的放电过程的差异 ,负电压内电极可向放电管中馈入更多的能量 ;比较发光光谱可判断生成准分子的等离子体化学过程没有明显的差别     

增塑对UV固化型高分子固体电解质性能的影响

将合成的大分子量的聚乙二醇丙烯酸酯(PEGDA)齐聚物与光引发刑、LiClO4组成光敏体系，与一定比例的碳酸乙烯酯(EC)、碳酸丙烯酯(PC)或其混合物进行混合，经紫外光辐照制得了一种新型的高分子固体电解质膜，考察了增塑刑种类和用量对光固化速率、电导率和机械性能的影响。结果表明，增塑是提高UV固化型高分子固体电解质导电性能的有效方法，在机械性能满足使用要求的条件下，增塑的UV固化型固体电解质的电导率可以高达10^-4S／cm左右。     

A study on UV-curable coatings for HD-DVD: Primer and top coats

This study relates to the development of coatings for optical discs in high-density digital versatile disc systems (HD-DVD or blue lay disk) that use a high numerical aperture of 0.85 at 405 nm wavelength and have a protective top layer over a primer layer for protection against damage and dust. Ultraviolet-curable raw materials of two acrylic monofunctional monomers ( isobornylacrylate, IBA and tetrahydrofurfurylacrylate, THFA) and two kinds of urethaneacrylate oligomers (OUMD and OUME) have been easily mixed with photoinitiators. Curing rate of these materials was characterized by FT-IR. In case of top coats, VTES (vinyltriethoxysilane) and acrylic acid were added to enhance the abrasion resistance. These two kinds of UV-curable resinous materials having no solvent were synthesized and investigated as means for making a blue ray disk having good optical and mechanical properties. In addition, dynamic characteristics including reflectivity, fluctuation of RF signal and noise level were also investigated.     

辐射剂量对环氧树脂电子束固化行为的影响

分析了电子束剂量对环氧树脂体系辐射固化行为的影响规律。研究结果表明，电子束辐射过程中，温度由树脂辐射体系表面向内部逐渐降低，随着辐射剂量提高，树脂体系温度上升，辐射表面与内部的温度梯度加大，高辐射剂量下的温度变化缓慢。树脂辐射固化层厚度以及在相同厚度的固化程度均随辐射剂量增加，但增幅逐渐变小，树脂辐射固化度沿固化深度会加速下降。     

Measuring and modeling the rheological data of diglycidylether of bisphenol‐A during polymerization for finite element analyses

Finite element analyses (FEA) of thermosets are often performed on the basis of rheological data for fully cured resin. For the FEA of thermosets during curing, a material model is established and a technique is demonstrated, which allows the rheological data of the linear viscoelastic material to be derived. As the moduli are sensitive to conversion, all measured properties are related to temperature and conversion. Therefore the basis for the rheological data has to be a suitable reaction kinetic. Based on the kinetics shear and compression properties are measured independently and modeled mathematically with the focus to gain a formulation, which is suitable for FEA. The considered time constants are in the range between one second and one month as these times are relevant for the investigated relaxation times. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 1868–1872, 2003     

桐油改性酚醛树脂的结构及固化过程的研究

通过桐油与苯酚在酸性催化剂存在下反应，然后再在碱性催化剂存在与甲醛反应制得了一种热固性桐油改性酚醛树脂。利用红外光谱，差示扫描量热法分析技术对改性树脂的结构及固化反应过程进行了研究。     

Synthesis and characterization of novel copolymers with the trimethylsilyl group for deep‐UV photoresists

N‐(4‐Acetoxyphenyl) maleimide (APMI) and three kinds of comonomers bearing a trimethylsilyl group were copolymerized at 60°C in the presence of azobisisobutyronitrile (AIBN) as an initiator in 1,4‐dioxane to obtain the three IP, IIP, and IIIP copolymers. These copolymers were removed from the acetoxy group in a transesterification process into new IVP, VP, and VIP copolymers with a pendant hydroxyl group. Two modified processes were adopted to prepare photoresists using these copolymers. The first process involved mixing the dissolution inhibitor, o‐nitrobenzyl cholate, with the new copolymers. Second, o‐nitrobenzyl cholate was introduced into the copolymers using 1,8‐diazabicyclo[5.4.0]undec‐7‐ene (DBU) in dimethylformamide (DMF). The cyclic maleimide structure is responsible for the high thermal stability of these copolymers. After irradiation using deep–UV light and development with aqueous Na₂CO₃ (0.01 wt %), the developed patterns showed positive images and exhibited good adhesion to the silicon wafer without using any adhesion promoter. The resolution of these resists was at least 0.8 μm and an oxygen‐plasma etching rate was 1/5.3 to that of hard‐baked HPR‐204. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 2791–2798, 2002; DOI 10.1002/app.10255     

C50 级混凝土冬季施工技术探讨

介绍了应用在预应力砼Ｔ型梁的Ｃ５０级砼的冬季施工配制措施，并给出了－１０℃条件下的砼有效配合比及冬季４５℃±５℃蒸汽养生法措施。     

优化SMC模压工艺控制制品收缩率和表面粗糙度

优化SMC模压工艺参数：模压压力分为二阶段，选定最佳压力释放时机和压力；适宜降低模压温度。可显著降低SMC制品的固化收缩率，提高其表观质量、试验表明，同时采用的线收缩率和表面粗糙度两种检测和村定方法具有很好的同一性。     

双马来酰亚胺树脂体系的固化反应研究

利用ＤＳＣ及原位ＦＴＩＲ技术研究了双马来酰亚妥树脂体系的固化反应，获得了在固化反应过程中各组分的转化率与时间的关系，结合热分析数据，确立了最佳固化工艺。