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101.
Yoo Seung Song Shin Kyung Lee Jeong Woo Lee Do Wook Kang Kyoung Wook Min 《ETRI Journal》2019,41(6):703-714
Many use cases have been presented on providing convenience and safety for vehicles employing wireless access in vehicular environments and long‐term evolution communication technologies. As the 70‐MHz bandwidth in the 5.9‐GHz band is allocated as an intelligent transportation system (ITS) service, there exists the issue that vehicular communication systems should not interfere with each other during their usage. Numerous studies have been conducted on adjacent interfering channels, but there is insufficient research on vehicular communication systems in the ITS band. In this paper, we analyze the interference channel performance between communication systems using distribution functions. Two types of scenarios comprising adjacent channel interference are defined. In each scenario, a combination of an aggressor and victim network is categorized into four test cases. The minimum requirements and conditions to meet a 10% packet error rate are analyzed in terms of outage probability, packet error rate, and throughput for different transmission rates. This paper presents an adjacent channel interference ratio and communication coverage to obtain a satisfactory performance. 相似文献
102.
M. H. Kim S. S. Bose B. J. Skromme B. Lee G. E. Stillman 《Journal of Electronic Materials》1991,20(9):671-679
Variable temperature Hall effect and low temperature photoluminescence measurements have been performed on high purityp- andn-type GaAs grown at atmospheric pressure by metalorganic chemical vapor deposition. These high purity epitaxial GaAs layers
were grown as a function of the arsine (AsH3) to trimethylgallium (TMG) ratio (V/III ratio). The accurate quantitative assessment of the electronic properties of thep-type layers was emphasized. Analysis of the material focussed on the variation of the concentration of the shallow impurities
for different V/III ratios. Surface and interface depletion effects are included to accurately estimate the concentration
of impurities. The model of the merging of the excited states of the acceptor with the valence band is used to include the
dependence the activation energy of the impurity on the acceptor concentration as well as on acceptor species identity. The
characteristicp- ton-type conversion with increasing V/III ratio was observed in these samples and the reason for thep- ton-type conversion is that the background acceptor concentration of carbon decreases and the germanium donor concentration increases
as the V/III ratio is increased. 相似文献
103.
104.
Distance and clustering‐based energy‐efficient pseudonyms changing strategy over road network 下载免费PDF全文
To improve the fairness, the energy consumption changing pseudonyms needs to be taken into account. Existing works focus on changing velocity‐based pseudonyms changing strategy and short changes interval with limited coverage, but due to similar velocity and short changes, internal attacker guesses easily known communication and location information due to location information of vehicle on tracking, which may expose adversary private information, and frequently, pseudonyms changing occurs due to movement of vehicles' similar velocity and short coverage, which may cause serious attack of vehicle. To overcome this problem, distance and cluster can be performed. In this work, we proposed distance and cluster‐based energy pseudonyms changing method for road network. We proposed distance and energy‐based clustering routing service over road network, the cluster head elected to depend on random number of distance and energy to change pseudonyms of vehicles. An each interval to be establish cluster head vehicle deployed while selects the operation mode and informs the cluster members of the selected mode through beacon signal. The cluster head vehicle node performs the pseudonyms changing based on the predicted distance and energy of the cluster member to use clustering optimization. The data of whole network send to report server through these nodes while near the RSU, and the vehicles in this area will use less energy to change the pseudonyms. The simulation results show that the proposed method enhances pseudonyms changing strategy less consumption and delays sufficient privacy level each vehicle also our method has outperform compare with existing methods than we use Sumo simulation and Matlab tools to verify our proposed method. Our proposed method outperformed in terms of pseudonym changing energy efficiency to careful attention during the cluster formation process, stable and balanced clusters that prolong the network lifetime, increases distances to more CH vehicles connectivity to makes clustering group and changing their pseudonyms in terms of high level privacy and finally, CH nodes use Dijkstra's algorithm use MST among the vehicles nodes depend on existing road networks to follow shortest path selection roads in terms of high connectivity probability of CH and stable structure of the network decreases the topology changes and thus,the clustering overhead is reduced. 相似文献
105.
Two types of 5μm thick hybrid orientation structure wafers,which were integrated by(110)or(100) orientation silicon wafers as the substrate,have been investigated for 15-40 V voltage ICs and MEMS sensor applications.They have been obtained mainly by SOI wafer bonding and a non-selective epitaxy technique,and have been presented in China for the first time.The thickness of BOX SiO2 buried in wafer is 220 nm.It has been found that the quality of hybrid orientation structure with(100)wafer substrate is better than that with(110)wafer substrate by"Sirtl defect etching of HOSW". 相似文献
106.
In flip chip technology, Al/Ni(V)/Cu under-bump metallization (UBM) is currently applicable for Pb-free solder, and Sn−Ag−Cu
solder is a promising candidate to replace the conventional Sn−Pb solder. In this study, Sn-3.0Ag-(0.5 or 1.5)Cu solder bumps
with Al/Ni(V)/Cu UBM after assembly and aging at 150°C were employed to investigate the elemental redistribution, and reaction
mechanism between solders and UBMs. During assembly, the Cu layer in the Sn-3.0Ag-0.5Cu joint was completely dissolved into
solders, while Ni(V) layer was dissolved and reacted with solders to form (Cu1−y,Niy)6Sn5 intermetallic compound (IMC). The (Cu1−y,Niy)6Sn5 IMC gradually grew with the rate constant of 4.63 × 10−8 cm/sec0.5 before 500 h aging had passed. After 500 h aging, the (Cu1−y,Niy)6Sn5 IMC dissolved with aging time. In contrast, for the Sn-3.0Ag-1.5Cu joint, only fractions of Cu layer were dissolved during
assembly, and the remaining Cu layer reacted with solders to form Cu6Sn5 IMC. It was revealed that Ni in the Ni(V) layer was incorporated into the Cu6Sn5 IMC through slow solid-state diffusion, with most of the Ni(V) layer preserved. During the period of 2,000 h aging, the growth
rate constant of (Cu1−y,Niy)6Sn5 IMC was down to 1.74 × 10−8 cm/sec0.5 in, the Sn-3.0Ag-1.5Cu joints. On the basis of metallurgical interaction, IMC morphology evolution, growth behavior of IMC,
and Sn−Ag−Cu ternary isotherm, the interfacial reaction mechanism between Sn-3.0Ag-(0.5 or 1.5)Cu solder bump and Al/Ni(V)/Cu
UBM was discussed and proposed. 相似文献
107.
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110.
一种新的消除VV算法载波相位模糊的方法 总被引:1,自引:0,他引:1
VV算法非常适用于PSK突发信号的载波同步。该算法需要对估计出来的相位进行后续处理,以消除由剩余频差引起的相位模糊、避免跳周现象。该文提出了一种新的相位后续处理方法,不但能够消除由剩余频差带来的相位模糊,而且对于由噪声引入的相位模糊仍然非常有效。相对于已有的方法,该方法大大降低了信号发生跳周的概率。计算机仿真表明,该方法具有良好的性能,适用于对MPSK突发信号的解调。 相似文献