大块非晶合金的性能、制备及应用

综述了大块非晶合金的性能、制备方法及应用，对比了吸铸法制备的棒状Zr41.2Ti13.8Cu12.5Ni10Be22.5,Zr57Cu20Al10Ni8Ti5,Zr52.5Ti5Cu17.9Ni14.6Al10(原子分数)大块非晶样品的过冷温度区间宽度(△Tx)，给出了3种大块非晶合金系列的热稳定性参数Tg、Tx及△Tx，提出了大块非晶合金领域存在的问题及发展方向．     

心电地图仪中工频干扰的一种滤除方法

在心电地图仪中记录到的体表心电信号往往由于电磁的影响而引进工频干扰．基于体表心电信号中工频干扰的特点，作者提出了一种滤除工频干扰的方法，即就单独—胸导联信号通过提高频谱的分辨率来估计工频干扰的频率；基于最小均方误差准则来估计各导联信号中工频干扰的幅度和相位。文中还给出了该算法的流程图和滤波性能分析。模拟结果表明了该算法的有效性。应用该算法对心电地图仪中的工频干扰进行对消，取得了满意的结果。     

Efficient mixed Timoshenko–Mindlin shell elements

The precise representation of rigid body motions in the displacement patterns of curved Timoshenko–Mindlin (TM) shell elements is considered. This consideration requires the development of the strain–displacement relationships of the TM shell theory with regard to their consistency with the rigid body motions. For this purpose a refined TM theory of multilayered anisotropic shells is elaborated. The effects of transverse shear deformation and bending‐extension coupling are included. The fundamental unknowns consist of five displacements and eight strains of the face surfaces of the shell, and eight stress resultants. On the basis of this theory the simple and efficient mixed models are developed. The elemental arrays are derived using the Hu–Washizu mixed variational principle. Numerical results are presented to demonstrate the high accuracy and effectiveness of the developed 4‐node shell elements and to compare their performance with other finite elements reported in the literature. Copyright © 2002 John Wiley & Sons, Ltd.     

BaFe12O19/SiO2-B2O3微晶玻璃陶瓷的制备和微波性能

采用柠檬酸sol-gel工艺合成了BaFe12O19/SiO2-B2O3微晶玻璃陶瓷，研究了SiO2-B2O3玻璃的含量，Ba/Fe原子比和热处理温度对体系析出晶相的影响，以及介电常数和磁异率在1MHz-6GHz频率范围的变化规律，结果表明，休系中SiO2-B2O3玻璃的含量和Ba/Fe比越高，BaF312O19相的析出越困难，前驱体合适的热处理温度为1000℃，介电常数和磁导率基本上随测试频率的增而加下降；介电损耗的最大值为0．43，磁损耗较小。     

Effects of solvent and temperature on the coupling agent/epoxy resin interface

Increased wetting of the coupling agent/epoxy resin interface was observed when γ-glycidoxypropyltrimethoxysilane, polyfunctional aminosilane and γ-aminopropyltriethoxysilane were applied respectively from methyllethylketone, dimethylformamide and water on woven glass cloths which had been cleaned at 300°C. However, when factory-applied coupling agents were burnt off the woven cloths and fresh coupling agents re-applied, it was found that the nature of the factory-applied coupling agent influenced subsequent wetting. Thinner glass fibres showed a greater improvement in wetting rate than thicker fibres in those solvents identified to be good for improved wettability, irrespective of the heat-cleaning temperature.     

机动武器系统的含间隙动力学研究--下篇:系统仿真

本文把中篇建立的间隙铰模型引入多体系统动力学分析中,得到了一种处理含间隙多体系统动力学问题的一般方法.应用这种方法对机动武器的发射过程进行了原理性的仿真,验证了前面建立的碰撞模型和间隙模型,并分析了间隙对导弹运动状态的影响.导弹发射过程具有变拓扑的特点,本文方法提供了一种处理这类问题的思路.     

JOINING MECHANISMS OF β''''-Al2O3 CERAMIC AND PYREX GLASS TO Al MATRIX COMPOSITE

The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.     

Recent advances in isotropic conductive adhesives for electronics packaging applications

Isotropic conductive adhesives (ICAs) have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-bearing solders. Numerous studies have shown that ICAs possess many advantages over conventional soldering such as environmental friendliness, finer pitch printing, lower temperature processing and more flexible and simpler processing. However, complete replacement of soldering by ICAs is yet not possible owing to several limitations of ICAs which are mainly related to reliability aspects like limited impact resistance, unstable contact resistance, low adhesion and conductivity etc. Continued efforts for last 15 years have resulted in development of ICAs with improved properties. This review article is aimed at providing a better understanding of ICAs, their principles, performance and significant research and development work addressing the technological utility of ICAs.     

大环分子低维导体

本文综述了大环分子面－面堆积结构的准一维导体的结构、性质、导电机理、合成方法及研究进展。     

彩色PDP用玻璃基板

本文讨论了彩色ＰＤＰ现用钠钙玻璃的热稳定性，指出由于这种玻璃在热处理过程中易变形和收缩，因而不适合作大面积彩色ＰＤＰ基板材料，介绍了彩色ＰＤＰ基板玻璃的制造方法和特点。最后介绍了日本旭硝子公司和美国康宁公司各自为彩色ＰＤＰ新开发的玻璃基板材料ＰＤ２００和ＣＳ２５。