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151.
A model of economic dynamics under stable ecological balance conditions is proposed. A methodology of construction of an optimal growth path is constructed for this model. 相似文献
152.
The metal contact method of rapid freezing is greatly improved by irradiating the specimen with microwaves at 2.45 GHz for a short period of time (50 ms), while pushing the specimen onto the surface of the copper block cooled by liquid N2. The microwave irradiation, together with two technical improvements (a light-mass plunger and a recently developed β-gel shock absorber) for preventing bounce, produces a good freezing zone for squid retina, with high reproducibility for each experimental trial, extending from the contact surface to a depth of about 15 μm, which is comparable to the depth obtained by the metal contact method using liquid He in the absence of microwave irradiation. A good freezing zone was also experimentally demonstrated in specimens of rat liver and heart muscle. Microwave irradiation does not have appreciable effects on the ultrastructure of squid retina. The mechanism underlying the improvement in the rapid freezing under the microwave irradiation is discussed. 相似文献
153.
154.
The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning
electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis
results indicate that Ag5Zn8 and AgZn3 become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations
gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure
when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure
of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these
solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%.
Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0%
to 3.0% 相似文献
155.
156.
Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates
The morphologies of intermetallic compounds formed between Sn-Zn based solders and Cu substrates were investigated in this
study. The investigated solders were Sn-9Zn, Sn-8.55Zn-0.45Al, and Sn-8.55Zn-0.45Al-0.5Ag. The experimental results indicated
that the Sn-9Zn solder formed Cu5Zn8 and CuZn5 compounds on the Cu substrate, while the Al-containing solders formed the Al4.2Cu3.2Zn0.7 compound. The addition of Ag to the Sn-8.55Zn-0.45Al solder resulted in the formation of the AgZn3 compound at the interface between the Al4.2Cu3.2Zn0.7 compound and the solder. Furthermore, it was found that the cooling rate of the specimen after soldering had an effect on
the quantity of AgZn3 compound formed at the interface. The AgZn3 compound formed with an air-cooling condition exhibited a rougher surface and larger size than with a water-quenched condition.
It was believed that the formation of the AgZn3 compound at the interface occurs through heterogenous nucleation during solidification. 相似文献
157.
对于某些槽数和极数比的多星形移相变极电机,提出与前人不同的是在两种极数下均不甩去线圈的绕组方案,使绕组利用率高,且线圈及其联接都较简单.这种绕组方案在一种极数下并联支路略有不平衡,其所引起的电机定子铜耗的增加是极其有限的,不致影响电机的正常运行. 相似文献
158.
159.
基础锚栓预埋加固方案 总被引:1,自引:0,他引:1
结合工程实例 ,介绍轻钢结构系统基础锚栓预埋、加固解决方案 ,并介绍了加固系统的制作及使用方法 ,可供工程人员参考 相似文献
160.