辐射换热的波长匹配问题

由于水的选择性吸收特性,辐射换热中水份波长匹配一直是一个有分歧的问题。文章通过理论与计算论证了这个问题,得出的结论否定了波长匹配的重要性。     

流道缩扩比对半波纹微通道流动和传热特性的影响

为探究流道缩扩比对半波纹微通道流动和传热特性的影响,设计了5种不同缩扩比的半波纹微通道模型,并对各通道内的层流流动(200＜Re＜1000,Re为雷诺数)和传热进行了数值模拟研究。结果表明,半波纹微通道的压降和努塞尔数随着流道缩扩比的减小而增大;与光滑微通道相比,半波纹微通道具有更优的传热性能但压降损失也更高;引入η作为综合性能指标,发现减小流道缩扩比是提高半波纹微通道综合换热能力的有效方式,且当Re＞490时,其综合换热能力均优于光滑微通道。     

面向方向图保形的共口径基站天线去耦技术

为了节省基站天线所占空间资源,降低其运营成本,现代移动通信需要将多个天线阵列紧密地排列在一起,构成多频共口径基站天线。多天线的紧密排列势必造成天线间强烈的耦合,不仅使得天线阻抗失配、隔离度变差,同时也造成辐射方向图的严重变形。因此,近年来多频共口径基站天线的去耦成为工业界和学术界研究的热点,早期的去耦技术主要是面向改善天线的阻抗匹配和隔离度,而对面向方向图保形的去耦技术研究相对较少。文章在简要介绍面向方向图保形的基站天线去耦技术的研究现状的基础上,重点阐述了褚庆昕教授天线射频团队基于感应电流抵消、耦合场抵消和辐射阻断等原理,提出的几种新型的去耦技术。这些技术不仅可以有效地改善基站天线的阻抗匹配和隔离,更重要的是很好地实现了天线方向图保形。仿真和测试结果验证了原理的正确性和设计的可行性。一些技术已被用于5G基站天线产品。     

基于肠道菌群探讨葛根芩连汤治疗湿热型2型糖尿病研究进展*

摘 要: 近年来世界范围内2型糖尿病(Diabetes Mellitus type 2,T2DM)的发病率不断上升。微生态学研究证实,T2DM疾病的发生与肠道菌群数量及比例的失调有很大的关联性,这成为研究热点。现有实验发现:肠道菌群紊乱可通过短链脂肪酸学说、胆汁酸代谢学说、内毒素学说、支链氨基酸学说等机制来影响T2DM的发生发展。湿热证T2DM患者在临床最为常见,该类患者胰岛素抵抗最为严重,而动物实验研究发现葛根芩连汤可通过特定的分子机制及通路作用于肠道菌群,通过调节胰岛β细胞的功能、提高胰岛素敏感性、减轻氧化应激反应,从而调节血糖,减轻胰岛素抵抗,为临床治疗T2DM患者提供更科学的依据。但由于菌群数量庞杂,现有数据多偏重于动物实验,且研究菌群特异性不足,为此今后需进一步加强对T2DM特定菌群的研究,以及增加临床大样本数据统计。     

VA + Embeddings STAR: A State-of-the-Art Report on the Use of Embeddings in Visual Analytics

Over the past years, an increasing number of publications in information visualization, especially within the field of visual analytics, have mentioned the term “embedding” when describing the computational approach. Within this context, embeddings are usually (relatively) low-dimensional, distributed representations of various data types (such as texts or graphs), and since they have proven to be extremely useful for a variety of data analysis tasks across various disciplines and fields, they have become widely used. Existing visualization approaches aim to either support exploration and interpretation of the embedding space through visual representation and interaction, or aim to use embeddings as part of the computational pipeline for addressing downstream analytical tasks. To the best of our knowledge, this is the first survey that takes a detailed look at embedding methods through the lens of visual analytics, and the purpose of our survey article is to provide a systematic overview of the state of the art within the emerging field of embedding visualization. We design a categorization scheme for our approach, analyze the current research frontier based on peer-reviewed publications, and discuss existing trends, challenges, and potential research directions for using embeddings in the context of visual analytics. Furthermore, we provide an interactive survey browser for the collected and categorized survey data, which currently includes 122 entries that appeared between 2007 and 2023.     

Ultra-Damping Composites Enhanced by Yolk–Shell Piezoelectric Damping Mechanism

High-performance damping materials are significant toward reducing vibration and maintaining stability for industrial applications. Herein, a yolk–shell piezoelectric damping mechanism is reported, which can enhance mechanical energy dissipation and improve damping capability. With the addition of yolk–shell particles and carbon nanotube (CNT) conductive network, damping properties of various resin matrices are enhanced with the energy dissipation path of mechanical to electrical to heat energy. Particularly, the peak loss factor of epoxy composites reaches 1.91 and tan δ area increases by 25.72% at 20 °C. The results prove the general applicability of yolk–shell piezoelectric damping mechanism. Besides, the novel damping materials also exhibit excellent flexibility, stretchability, and resilience, offering a promising application toward damping coating, indicating broad scope of application in transportation and sophisticated electronics, etc.     

改进残差网络的猴痘病毒皮肤病变分类

目前猴痘病毒在全球范围内传播,这种病毒在临床上与其他皮肤疾病难以区分,特别是天花病毒和水痘病毒.在确定性聚合酶链式反应技术和其他生物检测技术还没有完全成熟的情况下,通过计算机辅助诊断技术检测猴痘病毒皮肤病变是一种可行的方法,因此提出了一种基于残差网络的猴痘病毒皮肤病变分类算法.该算法以残差网络为基本框架,结合深度可分离卷积和轻量化注意力,在降低模型计算量与复杂度的同时,也提高了模型的分类性能.实验结果表明,该算法对猴痘病毒皮肤病变表现出较好的分类性能,对猴痘皮肤病变的分类准确率、召回率和精度分别为97.3%, 96.8%和97.2%,且均优于实验中所对比的常见分类模型和其他研究方法.     

Obstacle avoidance tracking control with antiswing and tracking errors constraint for underactuated automated lifting robots with load hoisting/lowering

The existing automated lifting robot technology focuses merely on motion control and ignores the surrounding environment. In practice, obstacles inevitably exist in the movement path of the automated lifting robot, which affects construction safety. Furthermore, due to the underactuated characteristics of the automated lifting robot, the load can be difficult to control when it swings violently, which undoubtedly poses huge challenges to obstacle avoidance trajectory planning and controller design. In this paper, an obstacle avoidance trajectory and its tracking controller with antiswing and tracking errors constraint are proposed. To ensure accurate load positioning and effective obstacle avoidance, the proposed control method introduces a four-segment polynomial trajectory interpolation curve to construct an obstacle avoidance trajectory based on analyzing the geometric relationship between variables. To improve the transient coupling control performance of the system, combined with the passive analysis of the automated lifting robot system, this method constructs a potential function that limits the tracking error and a coupling signal that enhances the coupling relationship between the system variables. Barbalat's lemma and Lyapunov techniques are used to analyze the stability of the system. Simulation and experimental results show that the proposed control method can significantly suppress or even eliminate load oscillation, accurately locate the load, avoid obstacles, improve the safety and efficiency of the working automated lifting robot, and have strong robustness to changes in system parameters and the addition of external disturbances.     

基于傅里叶级数解析热扩散角的功率模块热阻抗物理模型

绝缘栅双极型晶体管功率模块失效主要由温度因素诱发。为提高功率模块可靠性,RC热阻抗模型被提出用于实时预测芯片结温。随着功率密度的提高,模块横向扩散愈发明显,多芯片热耦合效应愈加突出,导致传统RC模型会引入较大误差。文中针对RC模型精准度不足进行改进,揭示热扩散角取决于热流密度的物理内涵,结合多层封装结构下的傅里叶级数解析热流模型,建立一维RC热网络与三维热流物理场的本质联系,构造计及多芯片热路耦合的扩散角热网络,较为准确地描述多芯片结温动态特性,揭示热扩散与热耦合效应对芯片温度场形成的规律。与其他传统热扩散角模型相比,所提出方法的结温计算结果准确度最高。最后以型号SEMi X603GB12E4p模块为例,针对提出的物理模型进行验证,仿真与实验结果均表明,该模型能够表征不同工况条件下功率模块的热过程,验证了所提建模方法的有效性与准确性,误差小于4%,且验证了所提模型较不计及热耦合模型精度提高了16.72%。