综合防渗技术在黄岗水库防渗加固工程中的应用

水库大坝综合防渗加固技术具有投资省、防渗墙体连接均匀完整可靠、防渗效果好、施工速度快等特点.通过黄岗水库的实践,为该项技术的推广提供了一个典型实例工程.     

添加高速钢粉对烧结钢组织与性能的影响

研究了添加高速钢粉对烧结钢组织与性能的影响。实验结果表明，含２０％高速钢的烧结钢综合力学性能最好；添加高速钢粉能导致烧结钢密度减小的冲击韧性降低，当高速钢含量增中时，硬度随之增加，烧结钢中残余奥氏体和马氏体的含量与高速钢的含量呈线性关系。烧结钢中的马氏体显微硬度很高，它主要原高速钢粒子和原铁粒子的连接区域形成。     

一个高电阻值测量电路

介绍一种新的高阻测试方法，可满足对高达１×１０＾１６Ω的测试要求。测试结果显示，对于１×１０＾１３Ω重复误差优于±２％。高阻测试电路通过接口与６８０９微机配套使用，操作简便，读数直观，便于长时间重复测量。     

高压条件下伴随化学反应两相流动的数值模拟

建立了高装填密度火药床在高压条件下的一维两相流体力学方程组，探讨了两相自由射流边界的处理方法，并对其进行了数值求解．揭示了对流燃烧过程的燃烧机理．数值结果与实验测得的压力曲线和火焰阵面曲线有较好的一致性     

工业CT技术在无损检测炸药部件中的应用综述

综述了美国能源部的有关单位将工业ＣＴ技术用于高能炸药无损检测的研究状况，劳伦斯利弗莫尔国家实验室（ＬＬＮＬ）洛斯阿拉莫斯国家实验室（ＬＡＮＬ）和潘台克斯工厂（ＰａｎｔｅｘＰｌａｎｔ）在这方面做的大量工作，包括ＣＴ机的建造，实验方法的制定和图像的重建等。测试样品有ＰＢＸ－９５０２，ＰＢＸ－９５０１和ＬＸ－１０－２炸药的药饼和半球，对ＣＴ技术在无损检测高能炸药方面的实用性和优越性作了评价。     

高能球磨AL─Cu合金固态合成反应研究

采用扫描电镜、能谱分析、Ｘ射线衍射和示差扫描量热分析研究了具有较大负混合焓的Ａｌ＿ｘＣｕ＿（１－ｘ）对称扩散系合金的高能球磨固态合成反应。高能球磨时组元晶粒细化达纳米级，造成纳米晶界亚互溶，为室温固态合成反应创造了条件，球磨强度对反应进程影响显著，在ｘ＝０．３～０．７范围内仅形成一种金属间化合物。     

基于激光多普勒测速法的2×106m/s2高冲击校准技术

在高冲击传感器动态性能校准中,实现高量程、宽脉冲激励是目前高冲击校准急需解决的问题。采用速度改变法校准原理,以气炮为激励源,利用激光多普勒测速方法测量砧体运动速度,建立高冲击校准系统。分析碰撞系统的作用原理,提出调整和控制激励脉宽的方法;分析测速误差,提出双光束差动侧向测速方法。实验结果表明:高冲击校准系统校准量程为2×106m/s2,激励脉宽在2×106m/s2时大于100μs,校准冲击灵敏度的扩展不确定度小于5%(k=2)。     

A copper/polyimide Metal-base packaging technology

A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.¹ This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm^?) and four small vias (1.0 mm^?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.     

Solid-liquid phase equilibria of benzene + 2-methyl-2-propanol system under high pressures

Solid-liquid phase equilibria of the benzene + 2-methyl-2-propanol system have been investigated at temperatures from 278 to 323 K and pressures up to 300 MPa using a high-pressure optical vessel. The uncertainties of the measurements of temperature, pressure and composition are within ±0.1 K, ±0.5 MPa, and ±0.001 mole fraction, respectively. The freezing pressure at a constant composition increases monotonously with pressure. The eutectic point shifts to a higher temperature and benzene-rich composition with increasing pressure. In order to describe the pressure-temperature-composition relation of high-pressure solid-liquid phase equilibria, a new simple equation has been proposed as follows: