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寄生电容参数提取是集成电路领域的关键课题,也是典型的静电场问题之一。通过研究电磁场对偶离散几何法, 探讨在二维非结构化网格离散空间上相应的寄生电容提取算法, 其中重点考察其对偶特性以及能量互补特性。基于该特性,同时采用对偶的两种方法能够有效地消除网格离散带来的误差,比采用单一方法更快地逼近真实解,从而可发展出静电场能量快速算法。并从理论与实例两方面将其与对偶有限元法实施分析对比。离散几何法采用对偶两套网格上的标量电势作为未知量,具有简单的形式与良好的精度,有望成为相关领域的一种主流方法。 相似文献
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《Microelectronics Journal》2015,46(3):258-264
Existing methods to analyze and optimize on-chip power distribution networks typically focus only on global power network modeled as a two-dimensional mesh. In practice, current is supplied to switching transistors through a local power network at the lower metal layers. The local power network is connected to a global network through a stack of vias. The effect of these vias and the resistance of the local power network are typically ignored when optimizing a power network and placing decoupling capacitors. By modeling the power distribution network as a three-dimensional mesh, the error due to ignoring via and local interconnect resistances is quantified. It is demonstrated that ignoring the local power network and vias can both underestimate (by up to 45%) or overestimate (by up to 50%) the effective resistance of a power distribution network. The error depends upon multiple parameters such as the width of local and global power lines and via resistance. A design space is also generated to indicate the valid width of local and global power lines where the target resistance is satisfied. It is shown that a wider global network can be used to obtain a narrower local network, providing additional flexibility in the physical design process since routability is an important concern at lower metal layers. At high via resistances, however, this approach causes significant increase in the width of a global power network, indicating the growing significance of local power network and vias. 相似文献
95.
《Microelectronics Reliability》2015,55(1):143-154
This work investigates the impact of geometry on the reliability of a high conductivity, meandered, stretchable interconnect. Meandered copper conductor interconnects of varying geometries that have been encapsulated into a PDMS matrix, are evaluated for reliability under tensile stretching conditions to 10% elongation. We present results that support our earlier findings by experiment and FEM simulation. Following, we vary interconnect parameters related to the encapsulation geometry, such as encapsulation hardness, thickness and stretchable zone perimeter, to assess impact on fatigue life of the embedded meandered copper lines. Results confirm and refine the prior simulation findings. Combinations of interconnect geometry parameters critical for stretching reliability are identified. Among others, we find that the meander radius (R) and encapsulation thickness are strongly coupled, causing very large meanders with thick encapsulation to fail very early. We show that, depending on the design of the meander transition, the characteristic life of an interconnect can differ 50 times under moderate, 10% cyclic elongation. Finally, we indicate the significance of our findings for the design of reliable, stretchable electronic systems. 相似文献
96.
Diah Permata Naoto Nagaoka 《IEEJ Transactions on Electrical and Electronic Engineering》2015,10(Z1):S28-S33
Transient characteristic of power system apparatus in a high‐frequency region should be modeled with stray capacitors. Pi‐type circuit is commonly used to represent the stray capacitors between terminals and those to the ground. A modeling method for the pi‐type circuit with unsymmetrical stray capacitances to ground is proposed in this paper. To obtain the unsymmetrical stray capacitances to ground, a couple of differential‐mode measurements are interchangeably applied. The parameters of the pi‐type circuit can be determined by the measurements with a common‐mode measurement. A nonlinear least‐squares method is used to estimate the capacitances. The method is applied to compose an equivalent circuit of a miniature circuit breaker (MCB), which has unsymmetrical stray capacitances to ground. The application is not only for the MCB but also for a scaled model of a high‐voltage circuit breaker. A gas‐filled arrester is used as a voltage sensor for the test because the voltage across the stray capacitor cannot be directly measured due to the input capacitance of a voltage probe. A transient response of the MCB with the gas‐filled arresters is numerically simulated to show the usefulness of the equivalent circuit. © 2015 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc. 相似文献
97.
矿业经济,技术预测决策的系统研究 总被引:2,自引:0,他引:2
本文对矿业经济、技术预测决策的系统研究进行了整体设计,并运用某大型采选联合铜矿企业历年的生产数据,建立了有关的灰色预测决策模型。结果表明灰色系统理论在矿业系统的经济、技术研究中的应用是有效的。 相似文献
98.
S. BOUNDS K. DAVEY S. HINDUJA 《International journal for numerical methods in engineering》1996,39(18):3195-3215
In this paper a new formulation for modelling solidification is discussed. The formulation has similar features to both the apparent and effective heat capacitance methods used for solidification problems where conduction predominates over other heat transfer mechanisms. The main feature of the new method is that a modified form of effective heat capacitance is calculated from the solution of non-linear equations that describe the energy loss for linear tetrahedral finite elements. This approach ensures that the predicted temperature field corresponds exactly with the energy loss and so providing an extremely stable formulation. The method is tested against a range of problems including some with non-linear liquid fractions. The predictions are compared against known analytical solutions and the method is shown to provide reasonable accuracy even for relatively large time-steps. A comparison is made between the method and the well-known temporal and spatial approximations of apparent heat capacitance, and effective capacitance. Accuracy is maintained over a greater variation in time-step and mesh density with comparable computational requirements. In addition, the method lends itself to the use of relatively simple bisection techniques for the solution of the non-linear finite element equations. Also demonstrated is the method's innate ability to predict energy loss to a high degree of accuracy for large time steps. 相似文献
99.
串扰约束下超深亚微米顶层互连线性能的优化设计 总被引:2,自引:1,他引:1
优化顶层互连线性能已成为超深亚微米片上系统(SOC)设计的关键.本文提出了适用于多个工艺节点的串扰约束下顶层互连线性能的优化方法.该方法由基于分布RLC连线模型的延迟串扰解析公式所推得.通过HSPICE仿真验证,对当前主流工艺(90nm),此优化方法可令与芯片边长等长的顶层互连线(23.9mm)的延时减小到182ps,数据总线带宽达到1.43 GHz/ μ m,近邻连线峰值串扰电压控制在0.096Vdd左右.通过由本方法所确定的各工艺节点下的截面参数和性能指标,可合理预测未来超深亚微米工艺条件下顶层互连线优化设计的发展趋势. 相似文献
100.