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101.
脆断事故的原因分析和预防措施 总被引:1,自引:0,他引:1
戚国胜 《南方冶金学院学报》2002,23(1):28-33
分析高强度材料和大型工程结构元件发生低应力脆性断裂的原因及条件,指出传统强度设计理论的局限性,从设计和工艺上提出防止发生低应力脆断事故的具体措施,给使用高强度材料和设计大型工程结构元件时提供参考。 相似文献
102.
103.
管壳式换热器流场三维数值模拟 总被引:16,自引:0,他引:16
采用多孔介质方法 ,在PHOENICS 3 3程序的基础上建立了换热器的三维流动计算模型。引入体积穿透率、表面穿透率、分布阻力等来描述换热器内的管束。模型通过计算Halle等[1] 的实验工况来进行验证 ,并尝试用于计算 2 0 0MW低温供热堆主换热器内的流场 相似文献
104.
The low melting point metallic tin powder or alloy of tin and lead was blended with polypropy-lene. A kind of in situ composite has been prepared. The variations of torque were studied when the composites were mixed in Haake torque rheogeniometer. By way of capillary extrusion, effects upon rheology of the in situ com-posites of the low melting point metals (LMPM) and coupling agent for their different variety and content, were investigated. From flow curves, the results indicate that in situ composites mixed with the LMPM are a kind of pseudoplastic fluid. If the LMPM were melted, the higher the content of the LMPM , the lower apparent viscosity of composites. Meanwhile, when the coupling agent is added into composites, the viscosity of composite will go up first and drop then. This shows that the LMPM have a promoter flow action on the polypropylene. 相似文献
105.
作者结合实例,论述了氨罐保冷改造的设计、选材及施工,给出了改造后两年的测试结果,并对测试结果进行了分析。 相似文献
106.
柴油机针阀体的乙炔低压渗碳 总被引:2,自引:0,他引:2
乙炔低压渗碳可以有效地避免在真空渗碳过程中产生炭黑和焦油,同时由于乙炔具有较高的供碳能力,使这一技术尤其适用于针阀体这样的小直径深盲孔零件。 相似文献
107.
本文介绍了宽低温STN-LCD加热装置的设计和制备方法,并对低温加热的实验结果进行了讨论和分析,相应的研究结果表明此法有利于拓宽STN液晶显示器的负温工作范围。 相似文献
108.
J. A. Jimenez-Tejada J. A. Lopez-Villanueva P. Cartujo J. Vicente J. E. Carceller 《Journal of Electronic Materials》1992,21(9):883-886
The energy levels introduced by Pt in silicon have been measured in a non-abruptp
+-n junction using constant-capacitance thermal-emission rate measurements and a numerical simulation of high frequency-capacitance.
Two levels have been detected with activation energies of:E
c -E
T = 0.22 eV with acceptor character andE
T -E
v = 0.34 eV with donor character. The sample preparation and diffusion of Pt is similar to previous works in which an acceptor
levelE
c -E
T = 0.34 eV was found instead of or besides a donorlike levelE
T -E
v = 0.34 eV. Our numerical calculation of the shallow-impurity profile points to the existence of a gradual transition near
the metallurgical junction for these samples. We have demonstrated that the well-known model of an abrupt junction is not
appropriate for these types of junctions, and could lead to errors in the location attributed to the detected levels. Simulation
of the electrical behavior leads to the non-existence of the acceptor levelE
c −E
T = 0.34 eV located in then-side of the junction. 相似文献
109.
The pyrolysis of tertiarybutylphosphine (TBP) has been studied in the low pressure conditions used for chemical beam epitaxy
(CBE). The pyrolysis studies were carried out in low pressure reactors of two different configurations, one of which is a
cracker cell designed for use in a CBE system. The reaction products were studied using a quadrupole mass spectrometer. The
products observed are accounted for by a reaction mechanism involving homolysis of the parent TBP molecule to produce PH2 and C4H9 radicals. These undergo subsequent reactions to form the stable products C4H8, PH3 and H2, with smaller amounts of P and P2 being produced. The production of the sub-hydride PH2 using this cracker cell design indicates that the use of partially cracked TBP may be a promising technique for reducing
the amount of carbon incorporated into the growing epitaxial layer. 相似文献
110.
Shubneesh Batra Nanseng Jeng Akif Sultan Kyle Picone Surya Bhattacharya Keun-Hyung Park Sanjay Banerjee David Kao Monte Manning Chuck Dennison 《Journal of Electronic Materials》1993,22(5):551-554
When dopants are indiffused from a heavily implanted polycrystalline silicon film deposited on a silicon substrate, high thermal
budget annealing can cause the interfacial “native” oxide at the polycrystalline silicon-single crystal silicon interface
to break up into oxide clusters, causing epitaxial realignment of the polycrystalline silicon layer with respect to the silicon
substrate. Anomalous transient enhanced diffusion occurs during epitaxial realignment and this has adverse effects on the
leakage characteristics of the shallow junctions formed in the silicon substrate using this technique. The degradation in
the leakage current is mainly due to increased generation-recombination in the depletion region because of defect injection
from the interface. 相似文献