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991.
The shadow masked growth technique is presented as a tool to achieve thickness and bandgap variations laterally over the substrate during metalorganic vapor phase epitaxy. Lateral thickness and bandgap variations are very important for the fabrication of photonic integrated circuits, where several passive and active optical components need to be integrated on the same substrate. Several aspects of the shadow masked growth are characterized for InP based materials as well as for GaAs based materials. Thickness reductions are studied as a function of the mask dimensions, the reactor pressure, the orientation of the masked channels and the undercutting of the mask. The thickness reduction is strongly influenced by the mask dimensions and the reactor pressure, while the influence of the orientation of the channels and the amount of undercutting is only significant for narrow mask windows. During shadow masked growth, there are not only thickness variations but also compositional variations. Therefore, we studied the changes in In/Ga and As/P ratios for InGaAs and InGaAsP layers. It appears that mainly the In/Ga-ratio is responsible for compositional changes and that the As/P-ratio remains unchanged during shadow masked growth.  相似文献   
992.
We report here the identification of a new precipitate phase in thin-film Al-4wt.%Cu metallization used for interconnects on integrated circuits. The phase is based on a trigonal distortion of a face centered cubic lattice. Computer simulation of electron diffraction intensities suggests that the basis structure is isomorphous with Al2Ca but with a large and ordered population of vacancies on Cu sites. The reason for the formation of the new phase and its implications for electromigration reliability are discussed.  相似文献   
993.
A rapid and easy analysis method for polymers is presented. The method involves sample preparation by SFE, separation of the extracted compounds by SFC and simultaneous quantitative detection by FID, as well as identification of unknowns by MS. The applications illustrate how structural research work and routine polymer analysis can be done with this time saving method.  相似文献   
994.
群时延精确设计的全差分四阶Bessel滤波器   总被引:1,自引:0,他引:1  
何怡刚  江金光  吴杰 《电子学报》2002,30(2):249-251
采用MOS管有源电阻,提出了一种全差分R-MOSFET-C四阶Bessel有源低通滤波器,.通过调节工作于亚阈值区的CMOS管的沟道导纳补偿电阻值的大小,能抵消集成电路制造工艺中电阻值的一致偏差,实现Bessel有源滤波器群时延的精确设计.根据无源滤波器的状态方程完成有源滤波器的综合,应用3.3V,0.5μm CMOS工艺完成了群时延大小为0.75μs的四阶Bessel低通滤波器的管极计算机仿真,仿真结果表明所提电路正确有效,适于全集成.  相似文献   
995.
在硼酸存在下合成了掺铁铝酸锂荧光体,研究了在不同温度下硼酸加入量对荧光体发光强度的影响,并通过X射线粉末衍射和粒度分析,初步探讨了发光增加的原因。  相似文献   
996.
Because of its high–temperature chemical stability, SiC ceramic is a promising material for high-temperature device applications such as thermoelectric energy converters. However, the electrical conductivity of SiC ceramic is too low for it to be used as a thermoelectric energy converter at the cold junction. Therefore, we propose a SiC-Si functionally gradient material (FGM) in order to improve the electrical conductivity of the SiC ceramic at the cold junction. An SiC rod was fired in a temperature gradient furnace. One end of the SiC rod was maintained at 2473 K and the other end was maintained at 1973 K for 30 min. After firing, the porous SiC edge fired at 1973 K was dipped into molten Si in order to infiltrate molten Si into the porous SiC. The microstructure of the FGM is classified into three regions: the SiC-Si composite material; the porous SiC ceramic; and the densified SiC ceramic. The electrical conductivity, the Seebeck coefficient and the thermal conductivity for each region of SiC-Si FGM was measured at 300 K; a figure of merit was calculated. The figure of merit of the SiC-Si FGM at the cold junction, at room temperature, was 108 times higher than that of a nongradient SiC ceramic.  相似文献   
997.
树脂热解炭制备碳化硅晶须   总被引:6,自引:1,他引:5  
用自制的配合醛树脂热解和炭源,用SIO2超细汾作原,根据碳热还原原理,利用常规加热和微波加热两种方式,分别制备了直径在纳米级的SiC晶须,X射线衍射、透射电检测结果表明:制备工艺和条件对SiC晶须的性质有较大的影响。  相似文献   
998.
Pb(Sc1/2Ta1/2)O3铁电体的有序结构和介电性质)   总被引:1,自引:0,他引:1  
通过铌铁矿预合成法制备Pb(Sc1/2Ta1/2)O3(PST)陶瓷,经适当的热处理获得了钙钛矿化合物B位离子的高有序和高无序试样,PST陶瓷的介电性质研究结果表明,高有序试样(S=0.77)的居里温度为29℃,并具有较低的介电常数表现出普通铁电体性质特征,而高元序试样(S=0)具有很高的介电常数,并表现出明显的弥散性相转变和Tm的频率色散行为,即高介电常数的驰豫铁电体性质。文中还利用XRD,SE  相似文献   
999.
利用蒸发冷凝法,制备了不同平均粒径的Fe-29wt%Ni合金超细微粒。在不同压强下,将超细微粒压制成片。随压强增大,马氏体体积分数和比饱和磁化强度σs明显增大,而矫顽力Hc呈线性下降。压力效应与平均粒径d大小密切相关  相似文献   
1000.
The influence of metal particle size of monometallic and bimetallic supported catalysts (Au, Pd, Au–Pd)/C was studied using as a model reaction the liquid phase oxidation of glycerol. By tuning the metal particle size from 2 to 16 nm a progressive decrease of activity and simultaneously an increase in the selectivity to sodium glycerate was observed. Moreover, the influence of the temperature was studied and it was found that by increasing the temperature, only with a large particle size the formed glycerate was retained and not over-oxidized to tartronate.  相似文献   
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