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61.
62.
Evaluation of Slow Crack Growth Resistance in Ceramics for High-Temperature Applications 总被引:1,自引:0,他引:1
The slow (subcritical) crack growth (SCG) resistance of Si3 N4 and SiC ceramics has been evaluated by a stepwise loading test on bending bars precracked by Vickers indentation. Three highly refractory materials were selected for the evaluation: i.e., (1) high-purity Si3 N4 sintered by hot isostatic pressing (HIP) without additives and (2,3) α - and β - SiC pressureless sintered with B and C addition. Under the hypothesis of linear elastic behavior at high temperature, which was found satisfied in the present materials, the SCG resistance was expressed in terms of initial stress intensity factor critical for SCG failure within a predetermined lifetime. The present method was found useful in shortening the testing time and consistent with other traditional fatigue tests (e.g., static-fatigue test): It is recommended as a screening test for materials under research and development. Among the materials tested in the present study, the highest SCG resistance up to 1440°C was found in the high-purity Si3 N4 without additives. 相似文献
63.
Numerical Modeling of Silicon Photodiodes for High-Accuracy Applications Part I. Simulation Programs
Jon Geist Deane Chandler-Horowitz A. M. Robinson C. R. James 《Journal of research of the National Institute of Standards and Technology》1991,96(4):463-469
The suitability of the semiconductor-device modeling program PC-1D for high-accuracy simulation of silicon photodiodes is discussed. A set of user interface programs optimized to support high-accuracy batch-mode operation of PC-1D for modeling the internal quantum efficiency of photodiodes is also described. The optimization includes correction for the dark current under reverse- and forward-bias conditions before calculating the quantum efficiency, and easy access to the highest numerical accuracy available from PC-1D, neither of which is conveniently available with PC-1D’s standard user interface. 相似文献
64.
Crystallization of Polymer-Derived Silicon Carbonitride at 1873 K under Nitrogen Overpressure 总被引:1,自引:0,他引:1
Martin Friess Joachim Bill Jerzy Golczewski re Zimmermann Fritz Aldinger Ralf Riedel Rishi Raj 《Journal of the American Ceramic Society》2002,85(10):2587-2589
The chemical stability of an amorphous silicon carbonitride ceramic, having the composition 0.57SiC·0.43Si3 N4 ·0.49C is studied as a function of nitrogen overpressure at 1873 K. The ceramic suffers a weight loss at p N2 < 3.5 bar (1 bar = 100 kPa), does not show a weight change from 3.5 to 11 bar, and gains weight above 11 bar. The structure of the ceramic changes with pressure: it is crystalline from 1 to 6 bar, amorphous at ∼10 bar, and is crystalline above ∼10 bar. The weight-loss transition, at 3.5 bar, is in excellent agreement with the prediction from thermodynamic analysis when the activities of carbon, SiC, and Si3 N4 are set equal to those of the crystalline forms; this implies that the material crystallizes before decomposition. The amorphous to crystalline transition that occurs at ∼10 bar, and which is accompanied by weight gain, is likely to have taken place by a different mechanism. A nucleation and growth reaction with the atmospheric nitrogen is proposed as the likely mechanism. The supersaturation required to nucleate α-Si3 N4 crystals is calculated to be 30 kJ/mol. 相似文献
65.
中国冷库的现状与发展趋势 总被引:8,自引:0,他引:8
张保生 《制冷与空调(四川)》2003,(2):21-24
本文从的设计建造、制冷工艺和管理维护这三个方面,介绍了近三年来中国冷库的现状,说明中国冷库正朝着灵活、自动化、节能和环保的方向进一步发展。 相似文献
66.
The interaction between thin films of hydrogenated amorphous silicon and sputter-deposited chromium has been studied. Following
deposition of the chromium films at room temperature, the films were annealed over a range of times and temperatures below
350°C. It was found that an amorphous silicide was formed only a few nanometers thick with the square of thickness proportional
to the annealing time. The activation energy for the process was 0.55±0.05 eV. The formation process of the silicide was very
reproducible with the value of density derived from the thickness and Cr surface density being close to the value for crystalline
CrSi2 for all films formed at temperatures ≤300°C. The specific resistivity of the amorphous CrSi2 was ≈600 μΩ·cm and independent of annealing temperature. 相似文献
67.
用50W连续波CO_2激光器为热源,诱发SiH_4和C_2H_4反应,合成SiC超细粉末。实验确定了反应腔体内压力p、气源中的C/Si原子比、喷嘴内径2r以及激光功率密度与粉末特性之间的关系,并对合成的产物进行物理、化学表征。 相似文献
68.
Shubneesh Batra Nanseng Jeng Akif Sultan Kyle Picone Surya Bhattacharya Keun-Hyung Park Sanjay Banerjee David Kao Monte Manning Chuck Dennison 《Journal of Electronic Materials》1993,22(5):551-554
When dopants are indiffused from a heavily implanted polycrystalline silicon film deposited on a silicon substrate, high thermal
budget annealing can cause the interfacial “native” oxide at the polycrystalline silicon-single crystal silicon interface
to break up into oxide clusters, causing epitaxial realignment of the polycrystalline silicon layer with respect to the silicon
substrate. Anomalous transient enhanced diffusion occurs during epitaxial realignment and this has adverse effects on the
leakage characteristics of the shallow junctions formed in the silicon substrate using this technique. The degradation in
the leakage current is mainly due to increased generation-recombination in the depletion region because of defect injection
from the interface. 相似文献
69.
沈阳太平洋广场空调冷热源方案比较 总被引:4,自引:1,他引:3
对一幢11.5万m^2的四星级综合建筑的空调冷热源不同的蓄冷和取冷比较了四种方案,论证了其中直燃型溴化锂吸收式冷热水机组供冷供暖、小型燃油锅炉供蒸汽的方案最为合理。 相似文献
70.
用发展的Sachs法研究模拟轧辊中的残余应力 总被引:3,自引:0,他引:3
对不同辊型,尺寸,材料与加工处理方法的模拟冷轧辊进行了内剥层试验研究,求出了原辊和打中心孔或扩孔后辊内残余应力分布曲线,提出了虚拟打孔法和虚拟剥层法,解决了实心辊中心和空心辊内表层的残余应力的精确测量问题,丰富了Sachs内剥层法的内容,机械法打中心孔,热处理前打中心孔,空心辊表淬前改变温度场的方法可降低残余应力值,后者降低残余应力的效果尤为显著。 相似文献