用CMOS工艺实现非接触IC卡天线的集成化设计

论述了用CMOS工艺实现非接触式IC卡天线的集成化需要考虑的各个方面,建立了集成天线的模型,给出了合理的设计方案,并通过实验验证了模型和设计方案.实验结果表明,采用片上天线完全可以提供非接触式IC卡工作所需要的能量.在频率为2 2 .5 MHz、感应强度为6×10 - 4 T的磁场中,面积为2 m m×2 mm的集成天线可以为10 kΩ的负载提供1.2 2 5 m W的能量.     

异步DS-CDMA系统中基于矩阵点除算法的DOA估计

针对异步DS-CDMA系统中的多用户环境,本文提出了一种低复杂度的DOA估计算法——矩阵点除算法。该算法通过对感兴趣信息的逐次分离,实现了DOA的逐路径估计。算法具有两方面显著优势:(1)克服了传统的DOA估计算法在路径总数大于天线阵元数时不能工作这一缺陷:(2)避免了计算复杂的特征值分解运算,大大降低了算法复杂度。仿真实验验证了算法的有效性。     

国外农用非织造布覆盖材料的应用

非织造布在现代农业生产中占有重要地位 ,非织造布作为农用覆盖材料在柑橘、草莓、茶叶、花卉、水稻和玉米育苗以及人参栽培等多方面应用较为广泛 ,本文对国外农用非织造布覆盖材料的特点、性能以及应用情况作了介绍     

Adhesive element modelling and weighted static shape control of composite plates with piezoelectric actuator patches

A novel finite element model is presented for static and dynamic analysis of composite plates integrated with a laminated piezoelectric layer, a host laminated composite plate and an adhesive layer between them. A new adhesive element is developed which includes both peel and shear effects in the adhesive layer based on first‐order shear deformation plate theory. The thin adhesive layer between the piezoelectric layer and the host plate is modelled by assuming that it carries constant shear and peel strains throughout its thickness. In addition, a weighted static shape control scheme for finding the optimal voltage distribution for static shape control is given. By selecting different weighting matrices, a variety of items such as displacements, slopes, curvatures, strains and even generalized forces, can be included in finding the optimal actuating voltage for static shape control. The present model is validated by comparing with those results available in the literature. The numerical results show that the weighted linear least method can give a satisfactory voltage distribution to best match the desired shape. Copyright © 2004 John Wiley & Sons, Ltd.     

Effects of Spatial Characteristics on Smart Antenna System with Uniform Linear Antenna Array

1IntroductionCurrently,smart antenna technology can greatly en-hance system performance and i mprove the system ca-pacity so that it has been considered as a keytechnologyinthe third generation wireless communicationsystems .The researches on channel model , beamforming algo-rithms and receive algorithms have been widely carriedout and a great many of proposition have beensubmittedtothe 3th Generation Project Partner (3GPP) . Fromthe viewpoint of link-level and system-level research,many asp…     

Integrated Smart Sensor Calibration

In many applications electronic sensors are used toimprove performance and reliability of measurement systems. Suchsensors should provide a correct transfer from the physical signalto be measured to the electrical output signal. One importantstep to achieve this, is to calibrate each sensor by applyingdifferent reference input signals and adjusting the sensor transferaccordingly. Besides expensive reference equipment the calibrationprocess takes much time and attention per individual sensor,which means a considerable increase in sensor production costs.By including at the sensor or sensor interface chip a programmablecalibration facility the calibration of such smart sensors caneasily be automated and can be executed for a batch of sensorsat a time, thus minimizing the calibration time and costs. Thispaper presents a calibration method and options for integrationin the smart sensor concept, in hardware as well as in software.An advantage of the proposed method is that it does not needa large matrix of calibration data, which needs to be storedin a look-up table or converted into a correction formula, butinstead it uses a step-by-step approach to correct the sensortransfer at each calibration measurement until the error is sufficientlysmall.     

结构振动控制中压电阻尼技术研究：（三）机敏约束层阻尼技术

给出了机敏约束阻尼概念，阐述了机敏约束层阻尼系统特征，分析了结构设计和系统建模方法。以典型梁系统为例，比较了被动约束阻尼技术和机敏约束层阻尼技术减振效果。结果表明；机敏约束层阻尼控制技术是一种更为有效的振动控制方法。最后，提出了今后重点研究问题。     

Advancing controlled release packaging through smart blending

Researchers from Rutgers University and Clemson University have collaborated to develop a concept of using smart blending to generate functional packaging films for the controlled release of active compounds such as antimicrobials, antioxidants and flavour compounds to extend the shelf‐life of food. In this paper, literature results are reviewed to justify the significance of controlled release packaging (CRP) and the research gaps for further development are identified. A major research gap is the lack of packaging materials that can provide the release of active compounds at rates suitable for a wide range of food packaging applications. Smart blending is a promising technology for bridging this research gap. To fully realize the potentials of smart blending, a systematic approach for developing CRP using smart blending is also presented. Copyright © 2005 John Wiley & Sons, Ltd.     

Cost-effective smart power CMOS/DMOS technology: design methodology for latch-up immunity

To answer to the need of a cost effective smart power technology, an original design methodology that permits implementing latch-up free smart power circuits on a very simple CMOS/DMOS technology is proposed. The basic concept used to this purpose is letting float the wells of the MOS transistors most susceptible to initiate latch-up. The efficiency of the design methodology is experimentally shown.     

Optoelectronics in satellite designs

Design of artificial satellites for communication, remote sensing and scientific investigations follows, at present, a fixed pattern based on existing and proven technologies and the requirements of payload or experiment within the constraints of weight, volume and power available. The advances in optoelectronic components and systems have opened up a new dimension in designing satellites of the future, incorporating new technologies. This paper deals with general satellite design concepts based on optoelectronic systems wherever applicable.