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61.
D. E. Wetzler P. F. Aramendía M. L. Japas R. Fernández-Prini 《International Journal of Thermophysics》1998,19(1):27-42
Thermal diffusivities of supercritical CO2 and C2H6 were determined over a wide density range with a photothermal technique. The thermal lens, formed by the degradation of the absorbed light energy as heat by the sample, allows the employment of a nonequilibrium method in the critical region. Controlling the refractive-index gradient, i.e., a density gradient, perturbations can be maintained at levels where convection is negligible. An easy-to-operate setup allowed us to measure thermal diffusivities in the density ranges 5 to 20 mol·dm–3 for CO2 at 308 and 313 K and 2 to 12 mol·dm–3 for C2H6 at 308 K with a standard precision of 15%. 相似文献
62.
Thermal stratification in a mantled hot water storage tank is analysed numerically for different water inlet velocities. The aim is to obtain higher thermal stratification and supply hot water for usage as long as possible. Twelve different water inlet velocities to the hot water storage tank are considered. The numerical method is validated by comparing its results against experimental and numerical results from the literature. It turned out that the results obtained from the numerical analysis have shown very good agreements with the results from previous works. As a result, the water temperature in the tank increases with the increase of the water inlet velocities to the mantle but this increment is not proportional. After a period of operation of 7.2 h, which corresponds to the average sunshine duration in Turkey, temperature increments of 6.5 and 35 K have been estimated for the hot water inlet velocities of 0.01 and 0.3 m s?1, respectively, at a radial distance of 0.1 m and a height of 1 m inside the storage tank. Copyright © 2005 John Wiley & Sons, Ltd. 相似文献
63.
Rui Morimoto Chisato Yokomori Akiko Kikkawa Akira Izumi Hideki Matsumura 《Thin solid films》2003,430(1-2):230-235
In this paper, bulk-Si metal–oxide–semiconductor field effect transistors (MOSFETs) are fabricated using the catalytic chemical vapor deposition (Cat-CVD) method as an alternative technology to the conventional high-temperature thermal chemical vapor deposition. Particularly, formation of low-resistivity phosphorus (P)-doped poly-Si films is attempted by using Cat-CVD-deposited amorphous silicon (a-Si) films and successive rapid thermal annealing (RTA) of them. Even after RTA processes, neither peeling nor bubbling are observed, since hydrogen contents in Cat-CVD a-Si films can be as low as 1.1%. Both the crystallization and low resistivity of 0.004 Ω·cm are realized by RTA at 1000 °C for only 5 s. It is also revealed that Cat-CVD SiNx films prepared at 250 °C show excellent oxidation resistance, when the thickness of films is larger than approximately 10 nm for wet O2 oxidation at 1100 °C. It is found that the thickness required to stop oxygen penetration is equivalent to that for thermal CVD SiNx prepared at 750 °C. Finally, complementary MOSFETs (CMOSs) of single-crystalline Si were fabricated by using Cat-CVD poly-Si for gate electrodes and SiNx films for masks of local oxidation of silicon (LOCOS). At 3.3 V operation, less than 1.0 pA μm−1 of OFF leakage current and ON/OFF ratio of 107–108 are realized, i.e. the devices can operate similarly to conventional thermal CVD process. 相似文献
64.
65.
J. C. Jones H. Rahmati T. D. H. Do 《Journal of chemical technology and biotechnology (Oxford, Oxfordshire : 1986)》1992,54(4):317-318
Wood shaving samples were heated in both cubic baskets and in a previously described system realising the conditions of the ‘infinite slab’ in thermal ignition. Results from the two sets of experiment were found to be totally consistent with each other. 相似文献
66.
The microstructure and thermal behavior of the Sn-Zn-Ag solder were investigated for 8.73–9% Zn and 0–3.0% Ag. The scanning
electron microscopy (SEM) analysis shows the Ag-Zn compound when the solder contains 0.1% Ag. X-ray diffraction (XRD) analysis
results indicate that Ag5Zn8 and AgZn3 become prominent when the Ag content is 0.3% and above. Meanwhile, the Zn-rich phase is refined, and the Zn orientations
gradually diminish upon increase in Ag content. The morphology of the Ag-Zn compound varies from nodular to dendrite structure
when the Ag content increases. The growth of the Ag-Zn compounds is accompanied by the diminishing of the eutectic structure
of the Sn-9Zn solder. Differential scanning calorimetry (DSC) investigation reveals that the solidus temperature of these
solders exists at around 198°C. A single, sharp exothermic peak was found for the solders with Ag content less than 0.5%.
Liquidus temperatures were identified with the DSC analysis to vary from 206°C to 215°C when the Ag content ranges from 1.0%
to 3.0% 相似文献
67.
Novel diols containing imide groups were prepared via condensation of aromatic dianhydrides with 5‐amino‐1‐naphthol. The diimide–dinaphthols prepared were characterized by conventional methods and used to synthesize new poly(urethane–imide)s (PUIs). All the polymers were characterized and their physical properties, such as solubility, solution viscosity, thermal stability, and thermal behaviour were studied. The polymers obtained showed more thermal stability than typical polyurethanes because of the presence of the imide groups. Copyright © 2003 Society of Chemical Industry 相似文献
68.
Addressing the potential for drop impact failure of Pb-free interconnects, the shear ductility after extensive aging of Sn-Ag-Cu
(SAC) solders has been improved radically by Co or Fe modifications. Several other SAC+X candidates (X=Mn, Ni, Ge, Ti, Si,
Cr, and Zn) now have been tested. Solder joint microstructures and shear strength results show that new SAC+X alloys also
suppress void formation and coalescence at the Cu (substrate)/Cu3Sn interface (and embrittlement) after aging at 150°C for up to 1,000 h. Microprobe measurements of 1,000 h aged samples suggest
that Cu substitution by X is usually accentuated in the intermetallic layers, consistent with X=Co and Fe results. 相似文献
69.
70.
Plastisols, which are a blend of poly(vinyl chloride) resin and a plasticizer (DEHP), were used as a toughening agent of a resol resin in order to improve the mechanical properties. It was not possible to formulate resol blends by adding more than 10 % of plastisol owing to a lack of apparent homogeneity in the systems, which also showed many air bubbles. The relationship between dynamic mechanical, mechanical and thermal properties and the amount of plastisol added was studied. It was determined from the infrared spectroscopy and dynamic mechanical results that the resol–plastisol blends seem to be formed by a reaction between the phenol and PVC giving a higher crosslinked structure. An improvement in the thermal resistance of the blends at lower temperatures was observed with an increase in the percentage of plastisol. Flexural analysis showed the elastic behaviour of the systems. However, it was not possible to observe the effect of the plasticizer (DEHP) owing to the low quantity of plastisol that was added to the resol. Copyright © 2004 Society of Chemical Industry 相似文献