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111.
Resilient metal spring silicone-matrix conducting composites for separable interconnections in electronics were fabricated
by the impregnation of silicone into a preform comprising randomly oriented C-shaped Cu-Be springs and a small proportion
of Sn-Pb solder, which served to connect the springs at some of their intersections. Composites containing 6.1-9.8 vol.% total
filler exhibited volume electrical resistivity 0.5-1.0 mΩ.cm and contact resistivity (with copper) 11-17 mΩ.cm2. A compressive stress of about 30 kPa was needed for the low contact resistivity to be reached. The volume 17-26% and the
contact resistivity increased by 5% after heating in air at 130-150°C for seven days. Composites containing <9 vol.% total
filler showed no stress relaxation for seven days at 6.0% strain. 相似文献
112.
探讨了深圳前海物流园区的地理条件及发展的重要因素,针对其存在的交通设施不足,管理不到位等问题进行了分析,并结合功能定位从用地规模、功能布局等方面提出了规划设计构想。 相似文献
113.
ZHANG Zhaochun YUE Longyi GUO Jingkang 《稀有金属(英文版)》2006,25(3):253-259
Raman spectra of gallium phosphide (GAP) nanosolids (unheated and heat-treated at 598 and 723 K, respectively) were investigated. It was observed that both the longitudinal optical mode (LO) and the transverse optical mode (TO) displayed an asymmetry on the low-wavenumber side. The scattering bands were fitted to a sum of four Lorentzians which were assigned to the LO mode, surface phonon mode, TO mode, and a combination of Ga-O-P symmetric bending and sum band formed from the X-point TA + LA phonons, respectively. Analysis of the characteristic of surface phonon mode revealed that the surface phonon peak of the GaP nanosolids could be confirmed. In the infrared spectrum of the GaP nanoparticles, we observed the bands on account of symmetric stretching and bending of PO2, as well as stretching of Ga-O The Raman scattering intensity arising from the Ga-O-P linkages increased as increasing the heat-treatment temperature. 相似文献
114.
115.
116.
M.H. Song B. Park S. Nishimura T. Toyooka I.J. Chung Y. Takanishi K. Ishikawa H. Takezoe 《Advanced functional materials》2006,16(14):1793-1798
A liquid crystal (LC) photonic device with an anisotropic optical heterojunction structure has been fabricated. The device has a phase‐retarding nematic LC (NLC) layer sandwiched between two polymer cholesteric LC films with right‐handed helices of different pitches. Electrotunable non‐reciprocal light transmittance and unidirectional circularly polarized (CP) lasing emission have been successfully demonstrated for this device structure. Two left CP (LCP) lasing emission peaks are observed at the edges of the overlapping region between the two photonic bands in the structure and are shifted upon the application of a voltage. In contrast, a non‐reciprocal right CP (RCP) lasing emission peak emerges at one of the band edges and diminishes upon the application of a voltage. These phenomena are interpreted based on the selective reflection of RCP light and the reorientation of the NLC molecules by the application of a voltage. 相似文献
117.
The determination of the Young’s modulus and damping coefficient Q−1 by means of non-destructive vibrating techniques has been applied to bulk and coated industrial materials. Extensions of a previous analytic model of composite beam allow to determine accurately the macroscopic modulus of each component of multilayered structural materials as coated superalloys or nitride-hardened steels. Furthermore, the study of glasses and polymers has been investigated. An attempt of normalisation of the modulus versus temperature curves allows to establish master curves depending on the specific structure, from metallic glasses to polymeric glasses. Finally a comparison of dynamical modulus and Q−1 values measured between resonant (>1 kHz) and subresonant techniques (10−3 to 10 Hz) in relation to the loading frequencies applied in real conditions has been under folder. For metallic materials such as forged or rolled titanium alloys, the brittle-to-fragile transition occurs abruptly or smoothly with a shift of 300 K following the range of excitation frequencies. 相似文献
118.
Food products can be high‐pressure processed (HPP) either in bulk or prepackaged in flexible or semi‐rigid packaging materials. In the latter case the packaging material is subjected, together with the food, to high‐pressure treatment. A number of studies have been performed to quantify the effects of high‐pressure processing on the physical and barrier properties of the packaging material, since the integrity of the package during and after processing is of paramount importance to the safety and quality of the food product. This article reviews the results of published research concerning the effect of HPP on packaging materials. Copyright © 2004 John Wiley & Sons, Ltd. 相似文献
119.
The paper presents a computational approach and numerical data which facilitate the use of the smeared-tip method for cohesive fracture in large enough structures. In the recently developed K-version of the smeared tip method, the large-size asymptotic profile of the stress intensity factor density along a cohesive crack is considered as a material characteristic, which is uniquely related to the softening stress-displacement law of the cohesive crack. After reviewing the K-version, an accurate and efficient numerical algorithm for the computation of this asymptotic profile is presented. The algorithm is based on solving a singular Abel's integral equation. The profiles corresponding to various typical softening stress-displacement laws of the cohesive crack model are computed, tabulated and plotted. The profiles for a certain range of other typical softening laws can be approximately obtained by interpolation from the tables. Knowing the profile, one can obtain with the smeared-tip method an analytical expression for the large-size solution to fracture problems, including the first two asymptotic terms of the size effect law. Consequently, numerical solutions of the integral equations of the cohesive crack model as well as finite element simulations of the cohesive crack are made superfluous. However, when the fracture process zone is attached to a notch or to the body surface and the cohesive zone ends with a stress jump, the solution is expected to be accurate only for large-enough structures. 相似文献
120.
A molecular orbital approach to materials design has recently made great progress. This approach is based on the electronic structure calculations by the DV-Xα cluster method. In this paper recent progress in this approachis reviewed. In particular 相似文献