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991.
992.
Thermal Characterization of 1.3 μm InAsP/InGaAsP Ridge Waveguide MQW Lasers Based on Spectroscopy Method 总被引:1,自引:1,他引:0
An experimental way to analyze the thermal characterization of semiconductor lasers based on spectroscopy method under pulse driving conditions has been developed. By using this way the thermal characteristics of strain compensated 1.3 μm InAsP/InGaAsP ridge waveguide MQW laser diodes have been investigated. Results show that by measuring and analyzing the lasing spectra under appropriate driving parameters and temperature ranges, the thermal resistance of the laser diodes could be deduced easily. A higher thermal resistance of 640 K/W has been measured on a narrow ridge laser chip without soldering. Other thermal and spectral properties of the lasers have also been measured and discussed. 相似文献
993.
提出了三维定量储层地质模型及其参数动态预测方法,用该方法可预测储层开采状态,水淹区及剩余油区分布和各剩余油区的可采储量,三维定量储层地质模型的预测图件可为合理开采提供依据。 相似文献
994.
995.
Y. Nakamura Ichiro Tanaka N. Takeuchi S. Koshiba H. Sakaki 《Journal of Electronic Materials》1998,27(11):1240-1243
We studied morphology of GaAs surfaces and the transport properties of two-dimensional electron gas (2DEG) on vicinal (111)B
planes. Multi-atomic steps (MASs) are found on the vicinal (111)B facet grown by molecular beam epitaxy, which will affect
electron transport on the facet. We also studied how the morphology of GaAs epilayers on vicinal (111)B substrates depends
on growth conditions, especially on the As4 flux. The uniformity of MASs on the substrates have been improved and smooth surfaces were obtained when the GaAs was grown
with high As4 flux, providing step periodicity of 20 nm. The channel resistance of the 2DEG perpendicular to the MASs is reduced drastically
with this smooth morphology. These findings are valuable not only for fabricating quantum devices on the (111)B facets but
also those on the vicinal (111)B substrates. 相似文献
996.
关于生物系统超微弱发光的实验研究 总被引:3,自引:0,他引:3
生物系统存在超微弱光子辐射现象。通过一系列实验研究,我们认为,这种光子辐射既有低水平化学发光的性质,又有受激辐射的性质,是受激的低水平化学发光。 相似文献
997.
998.
Xiang Lu S. Sundar Kumar Iyer Jin Lee Brian Doyle Zhineng Fan Paul K. Chu Chenming Hu Nathan W. Cheung 《Journal of Electronic Materials》1998,27(9):1059-1066
We have demonstrated feasibility to form silicon-on-insulator (SOI) substrates using plasma immersion ion implantation (PIII)
for both separation by implantation of oxygen and ion-cut. This high throughput technique can substantially lower the high
cost of SOI substrates due to the simpler implanter design as well as ease of maintenance. For separation by plasma implantation
of oxygen wafers, secondary ion mass spectrometry analysis and cross-sectional transmission electron micrographs show continuous
buried oxide formation under a single-crystal silicon overlayer with sharp Si/SiO2 interfaces after oxygen plasma implantation and high-temperature (1300°C) annealing. Ion-cut SOI wafer fabrication technique
is implemented for the first time using PIII. The hydrogen plasma can be optimized so that only one ion species is dominant
in concentration and there are minimal effects by other residual ions on the ion-cut process. The physical mechanism of hydrogen
induced silicon surface layer cleavage has been investigated. An ideal gas law model of the microcavity internal pressure
combined with a two-dimensional finite element fracture mechanics model is used to approximate the fracture driving force
which is sufficient to overcome the silicon fracture resistance. 相似文献
999.
1000.
Measurements of the thermal diffusivity of thin films on substrate have been performed by the photoacoustic method. In order to examine the method we have built a new apparatus and proposed (1) a system calibration procedure using optically and thermally thick reference samples and (2) a data analysis procedure based on the RG (Rosencwaig and Gersho) theory. As a result of using a transparent photoacoustic cell, the systematic errors which are caused by stray light have been reduced. With this apparatus, measurements have been performed on platinum, titanium, and stainless steel (SUS304) thin foils (thickness form 50 to 100 µm) with three different liquid backing materials (water, glycerol, and ethyl alcohol). The reproducibility was within ±7% regardless of film thickness and substrate materials. 相似文献