使用溅射AlN成核层实现大规模生产深紫外LED

高质量AlN薄膜对制造高性能深紫外器件非常重要,但是目前还很难使用大型工业MOCVD生长出高质量的AlN薄膜.采用磁控溅射制备了不同厚度的用作成核层的AlN薄膜,使用大型工业MOCVD直接在成核层上高温生长AlN外延层,研究了不同成核层对AlN外延层质量的影响.通过扫描电子显微镜和原子力显微镜对成核层AlN薄膜的表面形貌进行表征;使用高分辨X射线衍射仪对AlN外延层晶体质量进行表征,结果表明:在溅射成核层上生长的AlN外延层的晶体质量有显著提高.使用大型工业MOCVD在蓝宝石衬底上成功制备出中心波长为282 nm的可商用深紫外LED,在注入电流为20 mA时,单颗深紫外LED芯片的光输出功率达到了1.65 mW,对应的外量子效率为1.87%,饱和光输出功率达到4.31 mW.     

单晶生长用AlN粉料的烧结提纯工艺实验研究

使用自主研发的钨系统中频感应加热炉对AlN粉料进行了烧结提纯处理实验,并用XRD、SEM、IGA和GDMS等表征方法分析了烧结后的样品.实验发现,高温(2 250℃)长时间(50 h)烧结提纯工艺效果显著,但AlN粉料损耗高达47.37％;而低温(小于2 000℃)分段式短时间(每段10h)烧结提纯工艺粉料损耗低于2％,但是提纯效果一般.通过对实验结果的综合分析,提出了一种AlN粉料烧结提纯的改进工艺,最终得到了氧含量仅238 ppm、碳含量135 ppm的高质量AlN单晶生长原料,并且显著增加了原料的利用率.     

FBAR用AlN薄膜的射频反应溅射制备研究

采用射频反应磁控溅射法，制备了用于薄膜体声波谐振器的（002）取向的氮化铝薄膜。氮化铝薄膜为（002）取向为主混合少量（103）取向。氮化铝薄膜生长模式表面二维均匀成核再沿C轴堆垛生长。基片温度明显影响薄膜的取向，获得好的（002）取向的基片温度在380℃～400℃之间。不同的氮气分压比存在金属模式、过渡模式和氮化物模式，要进入稳定的氮化物模式。氮气分压比为0．3～0．4，氮气分压比高有利于（002）取向。射频馈入功率密度影响到成膜速率，且与氮气分压关联，较合适的值为12W／cm^2～15W／cm^2。     

Advances in pulsed-laser-deposited AIN thin films for high-temperature capping, device passivation, and piezoelectric-based RF MEMS/NEMS resonator applications

In this paper we report recent advances in pulsed-laser-deposited AIN thin films for high-temperature capping of SiC, passivation of SiC-based devices, and fabrication of a piezoelectric MEMS/NEMS resonator on Pt-metallized SiO₂/Si. The AlN films grown using the reactive laser ablation technique were found to be highly stoichiometric, dense with an optical band gap of 6.2 eV, and with a surface smoothness of less than 1 nm. A low-temperature buffer-layer approach was used to reduce the lattice and thermal mismatch strains. The dependence of the quality of AlN thin films and its characteristics as a function of processing parameters are discussed. Due to high crystallinity, near-perfect stoichiometry, and high packing density, pulsed-laser-deposited AlN thin films show a tendency to withstand high temperatures up to 1600°C, and which enables it to be used as an anneal capping layer for SiC wafers for removing ion-implantation damage and dopant activation. The laser-deposited AlN thin films show conformal coverage on SiC-based devices and exhibit an electrical break-down strength of 1.66 MV/cm up to 350°C when used as an insulator in Ni/AlN/SiC metal-insulator-semiconductor (MIS) devices. Pulsed laser deposition (PLD) AlN films grown on Pt/SiO₂/Si (100) substrates for radio-frequency microelectrical and mechanical systems and nanoelectrical and mechanical systems (MEMS and NEMS) demonstrated resonators having high Q values ranging from 8,000 to 17,000 in the frequency range of 2.5–0.45 MHz. AlN thin films were characterized by x-ray diffraction, Rutherford backscattering spectrometry (in normal and oxygen resonance mode), atomic force microscopy, ultraviolet (UV)-visible spectroscopy, and scanning electron microscopy. Applications exploiting characteristics of high bandgap, high bond strength, excellent piezoelectric characteristics, extremely high chemical inertness, high electrical resistivity, high breakdown strength, and high thermal stability of the pulsed-laser-deposited thin films have been discussed in the context of emerging developments of SiC power devices, for high-temperature electronics, and for radio frequency (RF) MEMS.     

氮化铝薄膜的厚度对场发射特性的影响

采用射频磁控溅射方法,在n型(100)Si基底上沉积了不同厚度(20~150 nm)纤锌矿结构的纳米AlN薄膜。在超高真空系统中测量了不同膜厚样品的场发射特性,发现阈值电场随着厚度的增加有增大的趋势。厚度为44 nm的AlN薄膜样品具有最低的阈值电场(10 V/μm),当外加电场为35 V/μm时,最高发射电流密度为284μA/cm2。AlN薄膜场发射F-N曲线表明,在外加电场作用下,电子隧穿了AlN薄膜表面势垒发射到真空。     

氮化铝陶瓷与铜界面传热计算机仿真

固体界面热阻是航空航天、低温与超导、微电子技术等领域中研究热点问题，氮化铝陶瓷和金属铜被广泛应用于低温超导装置和集成电路芯片。基于氮化铝陶瓷与金属铜样品之间界面热阻的低温实验，应用MATLAB软件对实验数据进行回归分析，建立了氮化铝陶瓷与铜之间界面热阻与温度、压力等参数的回归分析仿真模型，仿真结果与实验数据有较好的一致性。研究结果对氮化铝陶瓷、铜应用于超导装置和集成电路芯片的传热设计、空间热控制具有重要意义。     

Thermodynamics and kinetics analysis of in-situ synthesizing AlN

AlN powders were prepared by in-situ synthesis technique. It is a reaction of binary molten Al-Mg alloys with highly pure nitrogen. It was confirmed through thermodynamics calculation that Mg element in Al-Mg alloys can decrease oxygen content in the reacting system. Thus, nitridation reaction can be performed to form AlN. Moreover, an analysis of kinetics shows that the nitridation reaction of Al-Mg alloys can be accelerated and transferred rapidly with the increment of Mg content.     

Simulation analysis of directivity and optimization of the array of the AlN thin film PMUT array

The relatively low piezoelectric constant of the aluminum nitride piezoelectric film limits the development and application of the piezoelectric micro-machined ultrasonic transducer based on the aluminum nitride. Therefore, the directivity of the piezoelectric micro-machined ultrasonic transducer array is studied for this problem. First, the far-field sound pressure and normalized directivity function of the transducer array are calculated according to the Rayleigh principle. Furthermore, the effects of array element radius, array element spacing, array element number and operating frequency on the beam width, direction sharpness angle and sidelobe level of the array are analyzed, and the transducer array is optimized. Finally, based on the optimization results, area and filling efficiency, the final structure size of the transducer array is determined and the sound pressure distribution visually simulated. The results show that the optimized transducer array has an ideal sound pressure distribution, good directivity and sharp main lobe. The-3dB beamwidth of the main lobe is about 9 ° and the sidelobe level is about 0.228.     

Ag70-Cu28-Ti2活性封接AlN陶瓷

研究了在真空条件下AlN陶瓷真空活性封接的情况,使用的活性焊料是Ag70-Cu28-Ti2熔炼焊片。通过试验可以得到该活性焊料在AlN片上润湿性良好,获得的AlN/AlN接头达到了气密性要求(漏气速率小于1×10-10Pa.m3/s),平均强度值分别为1.49 kN/cm2(抗弯)和2.00 kN/cm2(抗剪切)。通过扫描电镜及电子探针仪观察了焊层形貌和元素分布,分析了连接强度较高的原因。通过XRD确定了焊接的冶金结合及新相的生成。     

蓝宝石衬底上原子级光滑AlN外延层的MOCVD生长

在蓝宝石衬底表面无氮化、低Ⅴ/Ⅲ比的情况下,采用1200℃的衬底温度、5kPa反应室气压,用MOCVD方法在蓝宝石衬底上生长出了表面原子级光滑的AlN外延层.原子力显微镜测试表明其平均粗糙度为0.44nm,X射线衍射(0002)回摆曲线FWHM为166".实验结果和分析表明,极性和气相反应是影响AlN表面形貌的主要原因.以原子级光滑的AlN为模板生长出了高质量的高Al组分的n型AlGaN,证实了AlN模板具有较好的质量.