Thermophysical Properties of W–Re Alloys Above the Melting Region

In earlier experiments we have studied pure elements with a fast pulse heating technique to obtain thermophysical properties of the liquid state. We report here results for thermophysical properties such as specific heat and dependences among enthalpy, electrical resistivity, and temperature, for four W–Re alloys (3.95, 21.03, 23.84, and 30.82 at % of Re) in a wide temperature range covering solid and liquid states. Thermal conductivity is calculated using the Wiedemann–Franz law for the liquid alloy, as.well as data for thermal diffusivity for the beginning of the liquid phase. Additionally, data for the entire temperature range studied have been analyzed in comparison with those of the constituent elements, tungsten and rhenium, since both metals have been studied previously with the same experimental technique. Such information is of interest in the field of metallurgy since W–Re alloys of low Re content in the region of mutual component solubility in the solid state are widely used as thermocouple materials for the purposes of high-temperature thermometry.     

焊前处理方式对LF6铝合金扩散焊的影响

利用Ｇｌｅｅｂｌｅ－１５００热／力模拟试验机，研究了ＬＦ６铝合金的扩散焊工艺，通过对焊接温度、压力、时间的调整和选用不同的料前处理方法，确定了最佳的扩散规范，研究结果表明：在一定的温度和时间范围内，ＬＦ６５铝合金扩散焊接头的剪切哟度随焊接温度和时间的增加而提高；化学浸蚀法比机械打磨法能更有效的去除铝合金表面的氧化膜；在现有试验条件下，得到ＬＦ６铝合金扩散焊的最佳规范参数，搭接试扩散焊接头的剪切强度     

COMPUTING MAXIMUM CLIQUES OF CIRCULAR ARCS IN PARALLEL*

Given a set S of n proper circular arcs, it is required to identify a largest cardinality subset K[S] of S each two of whose members intersect. This paper describes an optimal parallel algorithm to compute K[S]. The algorithm is not based on any previously known sequential solution, and is designed for the CREW PRAM model of computation. It uses 0(n/logn) processors and runs in O(logn) time. An interesting feature of the algorithm is that it transforms the computational geometric problem at hand, to a problem involving computations on 0-1 matrices, and then transforms the latter back into a ray shooting problem in computational geometry.     

A new microsecond pulse-heating system to investigate thermophysical properties of solid and liquid metals

A new discharge system for resistive self-heating has been constructed for the measurement of accurate thermophysical properties. A constant-current pulse is used to heat metals over a time interval of 50 to 100 s, reaching temperatures up to the boiling point. New techniques have been developed to obtain sound speeds in the pulse-heated sample, emissivities, and vapor pressure. A new pyrometer allows the extension of the measured temperature range down to the melting point of copper.     

激光焊接对接拼缝测量的微景深方法

对于复杂微细、错边量小的激光焊接拼缝测量,现有的视觉传感器方法不能稳定、可靠地提取出拼缝的中心位置、拼缝宽度等信息。为此,提出了基于微景深的激光焊接对接拼缝测量方法,该方法采用高倍光学放大镜头、工业CCD(Charge Coupled Device)/CMOS(Complementary Metal-Oxide-Semiconductor Transistor)相机和LED(Light-Emitting Diode)外部照明装置,以光学成像光轴与被测表面法矢呈45°的方式,组成的对接拼缝的非接触测量系统,既解决了显微放大时景深很小、测量范围小的问题,又解决了狭窄拼缝高光学放大倍数拼缝检测的难题。实验结果表明,该系统可快速准确地提取出拼缝中心坐标、拼缝宽度以及拼缝局部表面法矢。拼缝宽度测量精度优于5 μm,拼缝中心测量精度优于6 μm,可识别的最小拼缝宽度为0.02 mm,完全满足激光焊接对接狭窄拼缝的检测与自动跟踪的要求。     

Latchkey children and susceptibility to peer pressure: An ecological analysis.

Data on adolescents' after-school experiences and their susceptibility to peer pressure were derived from surveys administered to a heterogeneous sample of 865 adolescents in Grades 5–9. Consistent with the findings of previous studies, the results show that Ss who reported home after school were not significantly different from those who were supervised by their parents at home during after-school hours. However, when a 2nd sample of latchkey children (n?=?594) was studied to include greater variation in after-school experiences, Ss who were more removed from adult supervision were found to be more susceptible to peer pressure to engage in antisocial activity. Ss who were home alone were less susceptible to peer pressure than are those who were at a friend's house after school, and those who were at a friend's house, in turn, were less susceptible than were those who describe themselves as "hanging out." Moreover, latchkey Ss whose parents knew their whereabouts and those who had been raised authoritatively were less susceptible to peer influence than were their peers, even if their afternoons were spent in contexts in which adult supervision was lax and susceptibility to peer pressure was generally high. (17 ref) (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

As离子注入形成硅化钨的研究

大规模集成电路的发展使集成度不断提高,器件尺寸减小,线条变窄。现常用的多晶硅栅和互连,由于电阻率高,限制了集成电路的速度。近年发展起来的硅化物材料,因其电阻率低、稳定性好、自对准性能好而常被用作大规模集成电路中的欧姆接触,互连和肖特基势垒。     

Thermal accommodation coefficient of gases on controlled solid surfaces: Argon-tungsten system

The knowledge of the thermal accommodation coefficient for gases on well-controlled surfaces as a function of temperature is imperative to understanding the mechanism of interphase heat transfer on the microscopic level. With this goal in view, a heat transfer column instrument is designed, fabricated, assembled, and tested for the specific case a argon—tungsten system. With 99.9999%, pure argon, six sets of data are taken in the rarefied gas region in the maximum temperature range of 500–1500 K. Four sets of these measurements are in the temperature-jump region and are analyzed by the constant-power method to compute the thermal accommodation coefficient of argon on a controlled tungsten surface. The other two sets are taken under free-molecular flow conditions and are interpreted in accordance with the man-free-path kinetic theory for the low-pressure regime. These data are compared and discussed in the context of reported data in the literature and interpreted in the light of the surface condition and finish of the tungsten wire.Nomenclature A area of the solid surface - C _j constants in Eq. (3); j=0, 1, 2, 3, and 4 - E _i incident energy flux - E _r reflected energy flux - E _s reflected energy flux when the interaction between the gas and the solid atoms is complete - g temperature-jump distance - L half-length of the metal wire - M molecular weight of the gas - P gas pressure - Q _H total thermal energy conducted by the gas per unit time from the hot surface - Q_KT total thermal energy conducted by the gas per unit time if the striking gas molecules were to attain thermal equilibrium with the hot surface - R molar gas constant - r radial coordinate - r _f radius of the hot wire - S sticking coefficient - S_o initial sticking coefficient - T temperature - T _e linearly extrapolated gas temperature on the hot-wire surface - T _g temperature of the impinging gas molecules - T _H temperature of the hot surface - T _i temperature of the incident gas stream - T _r temperature of the gas molecules receding after collision with the solid surface - T _s temperature of the solid surface Greek Symbols thermal accommodation coefficient for the gas—solid surface - resistivity of the metal wire - gas coverage on the solid surface For an explanation of symbols, see Nomenclature.     

热喷焊技术在导板强化中的应用

用氧化乙炔焰热喷焊技术对普碳钢导卫装置进行表面强化，制成复合材导卫以替代高碳高合金导卫，取得较好效果。     

齿轮类零件电子束焊接结构的合理性分析

综述了齿轮类传动零部件采用电子束焊接加工的优越性，指出零件在不同结构尺寸、不同使用环境以及不同工艺状态下应选用与电子束焊接工艺相适应的焊缝结构，并对不同零件的焊缝接头结构形式的合理性进行了深入分析。