高厚径比盲孔电镀

盲孔能够大大的增加板的密度,从而减小板面积。介绍了有关高厚径比盲孔电镀的有关工艺,从激光钻孔、金属化孔和电镀几个方面对孔径4mil以上的盲孔电镀进行了研究。     

Effect of chloride ions on immersion plating of copper onto porous silicon from a methanol solution

The effect of chloride ions (Cl⁻) during the immersion plating of copper onto porous silicon (PS) from a methanol (MeOH) solution has been studied. The presence of Cl⁻ in the Cu²⁺ solution was found to slow down the rate of copper deposition, as confirmed by inductively coupled argon plasma emission spectroscopy and X-ray photoelectron spectroscopy measurements. The threshold concentration of Cl⁻ at which the deposition of copper is very severely diminished was found to be 0.1 M. The inhibition effect is discussed on the basis of the rest potential values of PS and polarization curve measurements. They revealed that the rest potential of PS upon dipping in these solutions appears to direct the metal deposition. Current density-potential curves show that at Cl⁻ concentrations higher than 0.1 M, the reduction of Cu ions proceeds in two steps; the reduction of Cu(II) to Cu(I) followed by the reduction of Cu(I) to Cu(0). This suggests that Cu(I) species in MeOH solution can be stable over a certain potential range and this stability of Cu(I) is responsible for the inhibition of metal deposition. Fourier transform infrared spectroscopy and scanning electron microscopy (SEM) were also performed to investigate the structural changes and characterizations of PS samples after the plating process.     

微光机电系统的微绞链研制

本文讨论了非硅微机械工艺和微绞链的研制工艺。我们研制的非硅表面微机械工艺采用两次或三次掩模电镀层，聚酰亚胺和光刻胶分别作为底层和第二、第三层的牺牲层。用这套工艺，研制成功了三种不同种类的微绞链。微绞链能在基片表面作０—１８０度自由转动。     

Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers

Argon plasma-pretreated polyimide (PI, Kapton^® HN) films were subjected to UV-induced surface graft copolymerization with N,N′-(dimethylamino)ethyl methacrylate (DMAEMA) and 2-(trimethylammonium)ethyl methacrylate chloride (TMMAC). The DMAEMA graft-copolymerized PI (DMAEMA-g-PI) surfaces were also quaternized and amino-functionalized with 3-bromopropylamine hydrobromide (the Q-DMAEMA-g-PI surfaces). The surface composition and the degree of quaternization of the graft-modified PI films were determined by X-ray photoelectron spectroscopy. The DMAEMA-g-PI, Q-DMAEMA-g-PI and TMMAC graft-copolymerized PI (TMMAC-g-PI) surfaces can be activated directly by PdCl₂, in the absence of prior sensitization by SnCl₂ (the ‘Sn-free’ activation process), for the subsequent electroless plating of copper. A shorter induction time for the electroless deposition of copper was found for the palladium-activated Q-DMAEMA-g-PI and TMMAC-g-PI surfaces than for the palladium-activated DMAEMA-g-PI surface. The T-peel adhesion strength of the electrolessly deposited copper with the Q-DMAEMA-g-PI surface was enhanced to above 6 N/cm, in comparison to only about 4 N/cm for the DMAEMA-g-PI surface, about 2.5 N/cm for the TMMAC-g-PI surface, or about 0.5 N/cm for the PI surface with argon plasma treatment alone.     

PAN／Ni－P纤维和碳黑填充的HIPS复合材料的导电性

研究经化学镀镍的聚丙烯腈（ＰＡＮ）导电纤维（ＰＡＮ／Ｎｉ－Ｐ）填充的高抗冲聚苯乙烯（ＨＩＰＳ）复合材料的导电性与导电填料浓度的关系及加入有机钛酸酯偶联剂的影响、为了进一步提高复合材料的导电性，在ＰＡＮ／Ｎｉ－Ｐ纤维填充的复合材料中又加入不同量的碳黑，由于碳黑粒子的加入改善了纤维间的接触状态，更有利于导电网络的形成，从而大大提高了复合材料的导电能力。     

烧结钕铁硼永磁体的镍及镍磷合金镀层

综述了钕铁硼永磁体材料的表面电镀镍及化学镀镍磷合金的研究进展，提出了从铵铁硼材料的特殊性来选择恰当的前处理和镀覆工艺，就有获得优质的保护镀层。     

无机熔盐中脉冲铝镀层的研究

在190℃的AlCl3-NaCl—KCl共融盐中，对321型不锈钢板进行脉冲镀和直流镀。在钢板上获得银白色铝镀层。X射线衍射结果表明，两种情况均得面心立方结构的铝，但由脉冲镀所得的铝晶粒较小。对镀层进行性能测试分析。发现同为厚10μm的铝镀层，脉冲镀层硬度比由直流镀层高65HV，且脉冲镀层在耐蚀性和与不锈钢基体的的结合力上明显优于直流镀层.     

NdFeB水磁体表面离子镀Cu-Al-In三元仿金

分析了真空离子镀的基本原理，研究了NbFeB永磁合金表面离子镀Cu－Al-In三元仿金合金的新工艺。合金镀层晶粒较小，均匀美观，光泽柔和；合理的工艺条件为：偏压200V，主弧电流5A±0．25A，间距120mm，加热功率11kW，氩气分压1．33Pa～0．0133Pa，时间30min。     

化学镀Ni－Cu－P合金的工艺及镀层性能研究

探讨了化学镀Ｎｉ－Ｃｕ一Ｐ合金的镀液组成及工艺条件，并采用Ｘ射线衍射和弯曲法，研究了Ｎｉ－Ｃｕ－Ｐ镀层的组织结构和镀层结合力，结果表明，所研究的镀液组成，在适当工艺条件下，能够实现Ｎｉ、Ｃｕ离子的共沉积，并得到良好质量的合金镀层。经４００℃热处理，镀层中有和相析出，同时硬度达到最大值。镀态下，该镀层具有良好的结合力，且随镀层中铜含量的增加和热处理温度的提高，镀层结合力能得到进一步改善。     

新型合金代铬刷镀层的组织及强化机理的研究

采用Ｘ射线衍射仪，透射电镜和扫描隧道显微镜等手段对新型代铬镀层（Ｎｉ－Ｆｅ－Ｗ－Ｐ－Ｓ）相结构及组织进行了研究，并初步探讨了镀层的强化机理。研究表明，Ｎｉ－Ｆｅ－Ｗ－Ｐ－Ｓ合金镀层的组织是由含Ｆｅ、Ｗ、Ｐ、Ｓ的镍基固溶体和在其上弥散分布的金属间化合物Ｎｉ_３Ｆｅ所组成，镍基固溶体处于非晶和微晶的混合状态，合金镀层的镀态硬度为ＨＶ７００～７５０，在３００℃退火时。硬度达到最大值ＨＶ９００～９５０，其强化机理主要是微晶的晶界强化和Ｎｉ_３Ｆｅ的弥散强化。