Semi-insulating CdTe with a minimized deep-level doping

The possibility to prepare semi-insulating CdTe with a deep-level doping below the limit 10¹³ cm⁻³ demanded in detector industry is studied theoretically within quasi-chemical formalism. We show that proper thermal treatment, including low temperature (ca 200°C) dwell, allows fulfillment of this demand also in 7N or less purity materials. The procedure is demonstrated in Te-rich CdTe doped with a shallow donor. Its principle is based on enhanced defect selfcompensation, which affords at sufficiently low temperature extremely high compensation of shallow defects. New high-temperature transport data are used to refine on previous native defect properties for the modeling. The analysis of diffusion rates at lowered temperature approves the model for a real-time experimental verification.     

Specific contact resistivity of indium contacts to n-type CdTe

Indium alloyed to n-type CdTe of about 10¹⁶ cm^-3 electron concentration provides a contact resistivity of about 7 x 10^-3 ohm cm². This is achieved by alloying for 10 minutes at 150-450‡C in a sealed ampoule with an overpressure of cadmium. If the alloying is done in an open tube H₂ flow without a Cd vapor overpressure, alloying temperatures above 250‡C cause the contact resistance to rise as cadmium vacancies increase the compensation in the CdTe. Further improvement of the contact resistivity to 1 x 10^-3 ohm cm is obtained by a 900‡C diffusion of In into the n-CdTe (electron concentration 10¹⁶ cm^-3 before the diffusion).     

Dual-band infrared detectors made on high-quality HgCdTe epilayers grown by molecular beam epitaxy on CdZnTe or CdTe/Ge substrates

In this paper, we present all the successive steps for realizing dual-band infrared detectors operating in the mid-wavelength infrared (MWIR) band. High crystalline quality HgCdTe multilayer stacks have been grown by molecular beam epitaxy (MBE) on CdZnTe and CdTe/Ge substrates. Material characterization in the light of high-resolution x-ray diffraction (HRXRD) results and dislocation density measurements are exposed in detail. These characterizations show some striking differences between structures grown on the two kinds of substrates. Device processing and readout circuit for 128×128 focal-plane array (FPA) fabrication are described. The electro-optical characteristics of the devices show that devices grown on Ge match those grown on CdZnTe substrates in terms of responsivity, noise measurements, and operability.     

Monolithically integrated HgCdTe focal plane arrays

The cost and performance of hybrid HgCdTe infrared (IR) focal plane arrays are constrained by the necessity of fabricating the detector arrays on a CdZnTe substrate. These substrates are expensive, fragile, available only in small rectangular formats, and are not a good thermal expansion match to the silicon readout integrated circuit. We discuss in this paper an IR sensor technology based on monolithically integrated IR focal plane arrays that could replace the conventional hybrid focal plane array technology. We have investigated the critical issues related to the growth of HgCdTe on Si read-out integrated circuits and the fabrication of monolithic focal plane arrays: (1) the design of Si read-out integrated circuits and focal plane array layouts; (2) the low-temperature cleaning of Si(001) wafers; (3) the growth of CdTe and HgCdTe layers on read-out integrated circuits; (4) diode creation, delineation, electrical, and interconnection; and (4) demonstration of high yield photovoltaic operation without limitation from earlier preprocessing such as substrate cleaning, molecular beam epitaxy (MBE) growth, and device fabrication. Crystallographic, optical, and electrical properties of the grown layers will be presented. Electrical properties for diodes fabricated on misoriented Si and readout integrated circuit (ROIC) substrates will be discussed. The fabrication of arrays with demonstrated I–V properties show that monolithic integration of HgCdTe-based IR focal plane arrays on Si read-out integrated circuits is feasible and could be implemented in the third generation of IR systems.     

Effects of a-Si:H resist vacuum-lithography processing on HgCdTe

A vacuum-compatible process for carrying out lithography on Hg_1−xCd_xTe and CdTe films was previously demonstrated. It was shown that hydrogenated amorphous silicon (a-Si:H) could be used as a dry resist by projecting a pattern onto its surface using excimer laser irradiation and then developing that pattern by hydrogen plasma etching. Pattern transfer to an underlying Hg_1−xCd_xTe film was then carried out via Ar/H₂ plasma etching in an electron cyclotron resonance (ECR) reactor. Despite the successful demonstration of pattern transfer, the possibility of inducing harmful effects in the Hg_1−xCd_xTe film due to this vacuum lithography procedure had not been explored. Here we present structural and surface compositional analyses of Hg_1−xCd_xTe films at key stages of the a-Si:H vacuum lithography procedure. X-ray diffraction double crystal rocking curves taken before and after a-Si:H deposition and after development etching were identical, indicating that bulk structural changes in the Hg_1−xCd_xTe film are not induced by these processes. Cross-section transmission electron microscopy studies show that laser-induced heating in the 350 nm thick a-Si:H overlayer is not sufficient to cause structural damage in the underlying Hg_1−xCd_xTe surface. In vacuo surface analysis via Auger electron spectroscopy and ion scattering spectroscopy suggest that the hydrogen plasma development process produces Hg-deficient surfaces but does not introduce C contamination. However, after ECR plasma etching into the Hg_1−xCd_xTe film, the measured x value is much closer to that of the bulk.     

A comparison of the diffusion of iodine into CdTe,Hg0.8Cd0.2Te and Zn0.05Cd0.95Te

Studies on the diffusion of iodine into CdTe, mercury cadmium telluride (Hg_0.8Cd_0.2Te, referred to as MCT) and zinc cadmium telluride (Zn_0.5Cd_0.95Te, referred to as ZCT) in the temperature range of 20 to 600°C are compared and discussed. The concentration profiles were measured using a radiotracer sectioning technique. As with the diffusion studies using the halogens into CdTe, the profiles were composed of four parts to which a computer package consisting of the sum of four complementary error functions (erfc) gave satisfactory fits. The diffusivity for the diffusion of iodine into MCT was faster than for the diffusion into CdTe, which was faster than for the diffusion into ZCT. The high diffusivity for the fastest profile part at 20°C indicates that when iodine is diffused from the vapor into these materials, it is not a suitable long term stable dopant in devices where sharp junctions are required.     

Substrate issues for the growth of mercury cadmium telluride

Close lattice matching and lattice compatibility with mercury cadmium telluride (MCT) make CdTe and related alloys ideal substrate materials for growth of MCT layers for the purpose of making high-performance second-generation infrared detectors. However, the limitations in the properties of CdTe and the difficulties in its bulk growth have prompted extensive research in the area of alternative substrates. Some basic relevant characteristics of substrates such as sapphire, GaAs, and silicon are compared and the possibilities and problems associated with each material are analyzed in the light of the most recent results in the field.     

Growth and optical characterization of strained CdZnTe/ CdTe quantum wells

We have grown strained Cd_1-xZn_xTe(x ≈ 0.2)/CdTe single and multiple quantum wells by molecular beam epitaxy. GaAs was used as a substrate. The well widths were systematically increased until the critical thickness was exceeded. Low-temperature (liquid helium) photoluminescence (PL) spectroscopy was used to characterize the films. Two prominent PL peaks were observed: one arising from the quantum well and the other from the barrier material. The energy of the quantum well luminescence is consistent with theory when strain is included. The critical layer thickness for the CdTe quantum wells was found to be between 150 and 175 å, in agreement with the model of Matthews and Blakeslee.     

Molecular beam epitaxy of CdTe and Hg1-xCdxTe ON GaAs (100)

Using the molecular beam epitaxial (MBE) technique, CdTe and Hg_1-xCd_xTe have been grown on Cr-doped GaAs (100) sub-strates. A single effusion cell charged with polycrystal-line CdTe is used for the growth of CdTe films. The CdTe films grown at 200 °C with a growth rate of ~ 2 μm/hr show both streaked and “Kikuchi” patterns, indicating single crystalline CdTe films are smoothly grown on the GaAs sub-strates. A sharp emission peak is observed at near band-edge (7865 Å, 1.577 eV) in the photoluminescence spectrum at 77 K. For the growth of Hg_1-xCd_xTe films, separate sources of HgTe, Cd and Te are used. Hg_0.6Cd_0.4Te films are grown at 50 °C with a growth rate of 1.7 μm/hr. The surfaces are mirror-smooth and the interfaces between the films and the substrates are very flat and smooth. As-grown Hg_0.6Cd_0.4Te films are p-type and converted into n-type by annealing in Hg pressure. Carrier concentration and Hall mobility of an annealed Hg_0.6Cd_0.4Te film are 1 × 10¹⁷ cm^?3 and 1000 cm²/V-sec at 77 K, respectively.     

<Emphasis Type="Italic">Ab Initio</Emphasis> Studies of Hydrogen Defects in CdTe

Using first-principles calculations based on density functional theory, we have investigated the nature of H defects in CdTe. The formation energy calculations indicate that the ground state position of the H inside the CdTe lattice depends on charge state: the lowest energy position for H⁰ and H⁺ is at the bond center site, while H⁻ prefers the tetrahedral interstitial site with Cd nearest neighbors (T_Cd). We find that H in CdTe acts as an amphoteric impurity. In p-type samples, H is in a positive charge state, acting as a donor to neutralize the free holes in the valence band, and in n-type samples H acquires an electron, compensating the donors in the sample.