红外/热导法检测C-103中氧氮含量

使用LECO ON736氧氮分析仪,采用红外和热导法,对C-103铌铪合金中氧、氮含量进行检测。通过助熔剂处理、坩埚选择、定量下限、分析功率、试样质量、精密度和加标回收实验,建立了C-103中氧、氮含量的检测方法。该方法氧和氮的RSD分别为3.36%和6.86%,加标回收率分别为95.5%~106.0%和92.5%~107.5%,精密度和加标回收实验结果良好,满足分析需要。     

热电能源材料研究进展

在介绍热电材料的背景、发展历史、主要应用的基础上,概括了目前提高热电材料性能的方法。主要包括:通过态密度共振和能带简并来提高Seebeck系数;通过掺杂点缺陷、纳米结构和多晶晶界等方法对声子进行全方位散射来降低晶格热导率;通过基体和纳米第二相的能带对齐来维持电传输性能;使用本征低热导率材料等。最后对热电材料的研究进行了总结和展望。     

Mechanical,electrical, and thermal expansion properties of carbon nanotube-based silver and silver-palladium alloy composites

The mechanical, electrical, and thermal expansion properties of carbon nanotube（CNT）-based silver and silver–palladium（10：1, w/w） alloy nanocomposites are reported. To tailor the properties of silver, CNTs were incorporated into a silver matrix by a modified molecular level-mixing process. CNTs interact weakly with silver because of their non-reactive nature and lack of mutual solubility. Therefore, palladium was utilized as an alloying element to improve interfacial adhesion. Comparative microstructural characterizations and property evaluations of the nanocomposites were performed. The structural characterizations revealed that decorated type-CNTs were dispersed, embedded, and anchored into the silver matrix. The experimental results indicated that the modification of the silver and silver–palladium nanocomposite with CNT resulted in increases in the hardness and Young＇s modulus along with concomitant decreases in the electrical conductivity and the coefficient of thermal expansion（CTE）. The hardness and Young＇s modulus of the nanocomposites were increased by 30%？40% whereas the CTE was decreased to 50%-60% of the CTE of silver. The significantly improved CTE and the mechanical properties of the CNT-reinforced silver and silver–palladium nanocomposites are correlated with the intriguing properties of CNTs and with good interfacial adhesion between the CNTs and silver as a result of the fabrication process and the contact action of palladium as an alloying element.     

Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoforming

The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion（CTE） are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.     

Thermal properties of open-celled aluminum foams prepared by two infiltration casting methods

Contrastive research was carried out to study the thermal properties of open-celled aluminum foams prepared by counter-gravity infiltration casting system and the traditional process respectively.The experimental results show that the thermal conductivity coefficients of aluminum foams prepared by two different infiltration methods have similar increasing trend with the increase of particle size; along with the reducing porosity,the thermal conductivity coefficients will be enhanced oppositely.However,with the same particle size,the open-celled aluminum foam prepared by the former method has a higher thermal conductivity coefficient obviously.It is largely because that the sample prepared by counter-gravity infiltration casting has a lower void content and better dense crystallization of metal-matrix after the constant pressure process.     

水对室温熔盐[Bpy]BF_4结构与性质的影响

采用分子动力学模拟方法研究了298.15 K、0.1 MPa下摩尔分数为0.05~0.95的水对室温熔盐1-丁基吡啶四氟硼酸([Bpy]BF4)结构与性质的影响.获得了体系的径向分布函数、配位数和空间分布函数等微观结构及其密度、自扩散系数、电导率和粘度等物理化学性质.模拟密度与实验结果符合很好;体系中各组分间的径向分布函数和配位数均随水摩尔分数的增加有规律的变化;获得了各组分之间的三维空间分布情况;随水摩尔分数的增加,阴阳离子之间的相互作用被削弱,同时水与阴离子、阳离子及水分子之间的相互作用逐渐增强,水、阴离子和阳离子的自扩散系数增大,体系粘度降低,电导率升高.研究工作揭示了水对[Bpy]BF4中各组分的存在形式、相互作用及其对体系物理化学及输运性质的影响,为其在冶金与材料制备方面的应用提供理论依据和参考.     

聚乙二醇二丙烯酸酯基透明凝胶电解质的制备及其性能研究

将三氟甲烷磺酸锂(LiCF3SO3)、碳酸丙烯酯(PC)、聚乙二醇二丙烯酸酯(PEGDA)以及2,2-二甲氧基-2-苯基苯乙酮(DMPAP)混匀后,采用紫外光固化法制备高分子透明凝胶电解质.其中,LiCF3SO3、PC、PEGDA和DMPAP的加入量是影响凝胶电解质电导率的四个主要因素,各因素分别设置5个水平,采用L25(54)正交设计进行试验,以凝胶电解质的电导率作为考察指标.通过极差分析,得出影响电导率的因素顺序为LiCF3SO3PCPEGDADMPAP,制备试验中LiCF3SO3、PC和PEGDA的最佳质量比为0.3∶3∶1.采用紫外-可见光谱仪、XRD、四探针电导率测定仪分别对凝胶电解质的光透过率、结晶程度和电导率进行了表征.结果表明,所制备的凝胶电解质具有较高的可见光透过率和电导率.通过在水中浸泡及外界自然环境下放置试验,测试表明所制得的凝胶电解质的稳定性较好.     

合金元素对Cu-Te-Cr合金时效组织与性能的影响

采用扫描电镜(SEM)、X射线衍射仪(XRD)、电子能谱(EDS)分析Cu-Te-Cr合金时效析出相的形貌与组成,研究合金元素对Cu-Te-Cr合金时效组织与性能的影响。结果表明,时效过程中Te、Cr以多元化合物或细小的单质Cr析出,合金的硬度明显升高,随时效温度的升高,Cr粒子长大,共格度降低;同时基体晶粒内,部分析出相重溶,使合金硬度下降;由于Cr和Te两种元素互不相溶,其交互作用生成CrxTey化合物,随着Te含量的增加,铸造过程中生成这种化合物越多,减少Cr元素在铜基体的固溶度,从而合金硬度下降,而导电率有所提高。     

Effect of initial density on thermal conductivity of new micro-pipeline heat conduction C/SiC composites

C/SiC composites prepared by chemical vapor infiltration technique (CVI) have been regarded as thermal structural materials widely. However, these composites still suffer from poor functional properties like low thermal conductivity, especially in thickness direction of the composites, limiting their large-scale applications. Herein, mesophase pitch based carbon fiber (MPCF) and continuous wave laser machining were utilized to construct highly effective heat conductive micro-pipelines within CVI C/SiC composite. The effect of initial density on the final density and thermal conductivity of the as-obtained MPCF-C/SiC composites were investigated. The results revealed that higher initial density would directly enhance the thermal conductivity and reduce the negative impact of the bottle-neck effect. At temperatures between 100°C and 500°C, MPCF-C/SiC composites preserved more than threefold of the thermal conductivity (340%) when compared to reference C/SiC composites. This work provides a highly effective route for enhancing the thermal conductivity of C/SiC, which would broaden their future applications.     

Temperature and processing effects on lithium ion conductivity of solution-deposited lithium zirconium phosphate (LiZr2P3O12) thin films

Lithium zirconium phosphate (LiZr₂P₃O₁₂) thin films have been prepared on platinized silicon substrates via a chemical solution deposition approach with processing temperatures between 700°C and 775°C. Films that were subject to a single high-temperature anneal were found to crystallize at temperatures above 725°C. Crystallization was observed in films annealed after each deposited layer at 700°C and above. In both cases, grain size was found to increase with annealing temperature. Ion conductivity was found to increase with annealing temperature in singly annealed films. In per-layer annealed films ion conductivity was found to initially increase then decrease with increasing annealing temperature. A maximum ion conductivity of 1.6 × 10⁻⁶ S/cm was observed for the singly annealed 775°C condition, while a maximum ion conductivity of 5.8 × 10⁻⁷ S/cm was observed for the 725°C per-layer annealed condition. These results are consistent with an increasing influence of cross-plane, internal interface resistance and vapor phase carrier loss in the per-layer annealed samples. This work demonstrates that post-deposition processing methods can strongly affect the ion conducting properties of LiZr₂P₃O₁₂ thin films.