新型无杆水力采油装置研制与应用

针对中原油田中后期开发存在的液面降低、泵挂加深使得抽油机载荷增加、冲程损失增大、杆管偏磨严重等问题,研制了新型无杆水力采油装置。该装置采用球阀换向,冲程长、冲次低。现场试验时SC38—74—4.8型无杆水力采油装置与常规管式抽油泵联用,下泵深度1650m,冲程4.8m,冲次2.7min-1,日注水量72m3,产出液60m3。结果表明,新型无杆水力采油装置延长了抽油泵的使用寿命,彻底根除了杆管偏磨,采用球阀换向,对动力液要求较低,日常维护简单。     

Aging study on interfacial microstructure and solder-ball shear strength of a wafer-level chip-size package with Au/Ni metallization on a Cu pad

Eutectic solder balls (63Sn-37Pb) joined to Cu pads with an Au/Ni metallization have been widely used in wafer-level chip-size package (WLCSP) technology for providing electrical and mechanical interconnections between components. However, some reliability issues must be addressed regarding the intermetallic compounds (IMCs). The formation of a brittle IMC layer between the solder/Cu pad interface impacts considerably upon the solder-ball shear strength. In addition, it will degrade the long-term operating reliability of the WLCSP. This study investigates, by means of experiments, the growth of the IMC layer under isothermal aging for the eutectic Sn-Pb solder reflowed on a Cu pad with an Au/Ni metallization. Forming the Cu pad with an Au/Ni metallization was achieved by a simple semiconductor-manufacturing process. The effects of the intermetallic layer on solder-ball shear strength were examined for various parameters, including the thickness of the Au layer, solder-ball size, and the diameter of the Cu pad. Experimental results indicate that two IMC layers, Au_0.5Ni_0.5Sn₄ and Ni₃Sn₄, form at the solder/Cu pad interface after aging. The Au_0.5Ni_0.5Sn₄ intermetallic layer dominates the total thickness of the IMC layer and grows with aging time while the solder-ball shear strength decreases after aging. The degradation of the solder-ball shear strength was found to be caused mainly by the formation of the Au_0.5Ni_0.5Sn₄ layer. The experimental results established that a thinner Au layer on Cu pad can effectively control the degradation of solder-ball shear strength, and this is especially true for smaller ball sizes.     

Phase transformations in thermally exposed Au-Al ball bonds

Gold-aluminum ball bonds were thermally exposed at constant elevated temperatures, and the resultant phase transformations studied in detail. The as-bonded microstructure of a Au-Al ball bond essentially consisted of a reaction zone (termed “alloyed zone” (AZ) in the as-bonded condition) between the Au bump and the bonded Al metallization. It is the growth of the reaction zone between the Au bump and the bonded Al metallization and also the nonbonded Al metallization during thermal exposure that gave rise to the various phase transformations. Au₄Al, Au₈Al₃, and Au₂Al are the predominant phases that grew across the ball bond until the bonded Al metallization is available to take part in the interdiffusion reactions. After the complete consumption of the bonded Al metallization, the Au-Al phases reverse transformed resulting in the formation of the Au₄Al phase in the entire reaction zone across the ball bond (RZ-A). The lateral interdiffusion reactions resulted in the nucleation and the growth of all of the Au-Al phases given by the phase diagram. Kidson’s analysis and Tu et al.’s treatment were extended to a five-phase binary system to explain the phase transformations in thermally exposed Au-Al ball bonds. It is possible for all of the Au-Al phases to grow across a ball bond uninhibited as long as the bonded metallization is available. However, the supply limitation of the bonded metallization gives rise to reverse transformations where Al-rich phases transform to Au-rich phases and eventually result in the formation of the Au₄Al phase in the entire RZ-A. If infinite time is allowed, Au₄Al would dissolve; the extent of which is dependent on the solubility of Al in Au. No supply of Au lateral to the bond causes the reverse transformation of the Au₄Al phase, giving rise to the lateral growth of the remaining Au-Al phases. If infinite time is allowed, the lateral phase transformations would result in the formation of a phase that is dependant on the relative proportion of Au and Al present in the nonbonded metallization (NBM) and Au₄Al below the void line. Hence, the presence of a phase in a particular location of a ball bond is dependent on the time and temperature of thermal exposure.     

基于机理分析的球磨机系统动态模糊建模方法

钢球磨煤机是一个典型的强非线性、多变量耦合系统。文中提出了一种基于减法聚类的T S模糊建模方法,这种T S模糊模型具有较强的过程辨识能力,同时得到的模糊规则可以用机理清晰地解释分析。另外,该算法能将对象的机理特性融入建模过程,在简化结构辨识的同时又获得了优异的全局建模效果。这种相对透明的模糊模型为高性能模型控制器的设计奠定了基础。图5参3     

硬质合金激光铣削加工试验研究

采用不同的激光铣削工艺对硬质合金进行激光铣削试验研究。分析了工艺参数对铣削量和铣削质量的影响,并利用优化或复合的工艺对硬质合金试样进行多样激光铣削。     

变频器在龙门铣床上的应用

介绍龙门铣床的直流调速控制系统的改造方案，根据龙门铣床工作台运动过程及原直流电机的容量来选择交流电机和变频器并对变频器的功能进行设定。     

Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints

The shear strength of ball-grid-array (BGA) solder joints on Cu bond pads was studied for Sn-Cu solder containing 0, 1.5, and 2.5 wt.% Cu, focusing on the effect of the microstructural changes of the bulk solder and the growth of intermetallic (IMC) layers during soldering at 270°C and aging at 150°C. The Cu additions in Sn solder enhanced both the IMC layer growth and the solder/IMC interface roughness during soldering but had insignificant effects during aging. Rapid Cu dissolution from the pad during reflow soldering resulted in a fine dispersion of Cu₆Sn₅ particles throughout the bulk solder in as-soldered joints even for the case of pure Sn solder, giving rise to a precipitation hardening of the bulk solder. The increased strength of the bulk solder caused the fracture mode of as-soldered joints to shift from the bulk solder to the solder/IMC layer as the IMC layer grew over a critical thickness about 1.2 m for all solders. The bulk solder strength decreased rapidly as the fine Cu₆Sn₅ precipitates coarsened during aging. As a consequence, regardless of the IMC layer thickness and the Cu content of the solders, the shear strength of BGA solder joints degraded significantly after 1 day of aging at 150°C and the shear fracture of aged joints occurred in the bulk solder. This suggests that small additions of Cu in Sn-based solders have an insignificant effect on the shear strength of BGA solderjoints, especially during system use at high temperatures.     

多元低合金贝氏体铸钢磨球的研究和应用

针对常用磨球材质脆性大,耐磨性低,磨耗高,我们研制了多元低合金贝氏作铸钢磨球,它具有硬度高、硬度均匀性好和韧性高等特点,用于磨矿生产,磨耗接近高铬铸铸铁磨球,成本降低30％～40％,综合效益显著。     

调军台选矿厂大型球磨机锻(轧)钢球使用效果分析

介绍了铬钒钛材质锻造及轧制的钢球在调军台选矿厂5 .49m× 8.83m球磨机生产应用的情况 ,探讨了大型溢流型球磨机对磨矿介质机械性能和球径、配比等方面的技术要求 ,使新建选矿厂磨机生产能力尽快达到设计水平。