晶圆制造物料运输系统实时调度方法

Interbay物料运输系统的运行效率对晶圆制造系统的影响较大。为减少运输小车平均搬运工件时间、晶圆工件的等待时间和运输小车的临时性堵塞,提出一种基于匈牙利算法的实时调度方法,并建立工件调度模型。基于300 mm晶圆制造系统数据的仿真结果表明,与传统的Interbay物料运输调度方法相比,该方法能有效提高Interbay物料运输系统的综合性能。     

Control of ignition delay in microfabricated hot-wire igniters: Simulation, fabrication, and experimental results

The presented work studied thermal interactions between laminated, metal-foil, hot-wire igniters and exothermic solid-state, composite chemical systems in order to demonstrate precise timing control of a thermal ignition process. The study includes FEA modeling, device fabrication, and characterization to demonstrate control microthruster ignition delays to within 2 ms. The modeling included studies of total ignition delay as well as the ignition delay variation versus process variations. Microthrusters were then fabricated via printed circuit board lamination, and the ignition performance was characterized. The characterization showed agreement with modeling to within 2-sigma for most cases. And the characterization demonstrated that the ignition delay could be controlled to within 0.36 and 0.84 ms for the best case. Furthermore, this performance was demonstrated with a small battery supply (200-600 mAh) and minimal electronics in the ignition system. This work extends the use of current microthrusters to short-lifetime applications that need high forces delivered in millisecond time intervals.     

A new DFM approach to combine machining and additive manufacturing

Design for manufacturing (DFM) approaches aim to integrate manufacturability aspects during the design stage. Most of DFM approaches usually consider only one manufacturing process, but product competitiveness may be improved by designing hybrid modular products, in which products are seen as 3-D puzzles with modules realized individually by the best manufacturing process and further gathered. A new DFM system is created in order to give quantitative information during the product design stage of which modules will benefit in being machined and which ones will advantageously be realized by an additive process (such as Selective Laser Sintering or laser deposition). A methodology for a manufacturability evaluation in case of a subtractive or an additive manufacturing process is developed and implemented in a CAD software. Tests are carried out on industrial products from automotive industry.     

High-temperature superconducting microwave devices: Fundamental issues in materials, physics, and engineering

High-T _c superconductivity has generated a great deal of interest because of the challenges it presents in the fields of material science, condensed matter physics, and electrical engineering, and because of the potential applications which may result from these research efforts. Thin-film passive microwave components may become the first high-temperature superconducting (HTS) devices available for widespread use and commercialization. In this article, we review aspects of material science, physics, and engineering which directly impact high-T _c superconducting microwave devices and discuss issues which determine the performance of these devices. Methods of growing HTS thin films on large-area substrates, techniques for fabricating single-level HTS passive microwave components, and the relevant properties of high-T _c superconducting films are discussed, with a focus on thin films of the HTS material YBa₂Cu₃O_7–. Several known mechanisms for microwave loss in both the superconductor and the dielectric substrate are presented. An overview of the general classes of superconducting passive microwave devices is given, and representative microwave devices which have been recently demonstrated are described in detail. Examples of a select few HTS active microwave components are also presented. Potential microwave applications are illustrated with comparisons to current technology.     

数字式三相智能电能表的研制

介绍了一款基于单片机Atmega128的三相数字式智能电能表的研制,从电路硬件选型、电路设计及制作进行论述。所设计的智能电能表与同类产品相比具有集成度高、功能强、成本更低廉、抗干扰能力强、功耗低等优点。随着未来电能智能化管理及电能表集抄需求,该款表具有很大的应用前景。     

机械力化学制备陶瓷材料的研究进展

在球磨过程中机械力化学使颗粒和晶粒细化产生裂纹，比表面积增大，晶格缺陷增多，晶格发生畸变和非晶化，乃至诱发低温化学反应，可制备出高活性陶瓷粉体和性能优异的陶瓷基材料。介绍了机械力化学在陶瓷材料研究中的最新研究进展。同时，还讨论了不同球磨工艺条件对材料制备过程的影响；并对其未来发展进行了展望。     

Parametric studies of multi-material laser densification

Fabrication of multi-material components via a laser-assisted layer-by-layer fabrication process has been numerically simulated and analyzed using a three-dimensional thermo-mechanical model. Effects of the chamber preheating temperature, laser scanning rate, initial porosity and thickness of each powder layer on the out-of-plane warping and residual thermal stresses of a nickel/porcelain workpiece have been investigated. It is found that warping and residual thermal stresses of the laser-densified multi-material workpiece are more sensitive to the chamber preheating temperature and the thickness of each powder layer than to the laser scanning rate and the initial porosity of the powder layer. The major mechanism responsible for these phenomena is identified to be related to the change of the temperature gradient induced by these laser processing parameters.     

陶瓷／金属梯度热障涂层的制备及性能评价

为了评价陶瓷／金属梯度热障涂层的性能，设计了4种涂层方案和2种基体材料（1Cr18Ni9Ti和2Cr13）．利用单枪单送粉器成功地制备了线性梯度涂层．通过观察涂层的微观结构、测量涂层的抗热震性能和热残余应力来评价涂层的性能．利用扫描电镜对各种陶瓷涂层的微观结构进行了观察和分析，利用X射线能谱分析得到了陶瓷梯度涂层试样中的不同区域的衍射图．热震试验表明，梯度涂层比非梯度涂层具有更好的抗热震性能．采用钻孔法对不同涂层方案进行了残余应力的测量，结果表明，压应力出现在1Cr18Ni9Ti基体材料上，而拉应力出现在2Cr13基体材料上．     

Fabrication of GaN films through reactive reconstruction of magnetron sputtered ZnO/Ga_2O_3

1　INTRODUCTIONGallium nitride (GaN) is one of the most po tential semiconductors. GaN has a direct energyband gap of 3.4 eV at room temperature and highexternal photoluminescence quantum efficiency, aswell as a high excitonic binding energy of20 meV[1]. It is an ideal material for fabrication ofultraviolet(UV)/blue/green light emitting diodes(LEDs), laser diodes(LDs), UV detectors and de vices operating in high temperature, high frequen cy and high power co…     

透明导电氧化物薄膜及其制备方法

综述了透明导电氧化物(TCO)薄膜的特性、应用及制备技术的发展,重点讨论了磁控溅射、脉冲激光沉积、溶胶-凝胶、喷射热分解等制备技术和柔性衬底TCO薄膜的制备状况、进展及发展趋势,并指出改进TCO薄膜制备技术的努力方向应体现完善薄膜性能、降低反应温度、提高控制精度、降低制备成本和适应集成化等趋势,而制备方法的选择则应根据薄膜的性能要求和不同的应用目的而不同.