Preparation and characterization of electroplated amorphous gold-nickel alloy film for electrical contact applications

A process for electroplating amorphous gold-nickel alloy with the atomic ratio of unity was developed. The plating bath was prepared by adding potassium cyanoaurate(I) into a known plating bath which produces amorphous nickel-tungsten alloy. At a sufficiently high gold concentration, the alloy deposit did not contain any tungsten. The amorphous nature of the Au-Ni alloy produced in the new bath was confirmed by using TEM and THEED. Hardness, resistivity, and contact resistance of this new alloy were determined, and the results are discussed for applications as an electrical contact material.     

Scanning droplet cell investigations on single grains of a FeAlCr light weight ferritic steel

Polycrystalline Fe7.5Al7Cr is a ferritic light weight steel that shows a strong anisotropic dissolution behaviour. This electrochemical phenomenon was investigated by use of a scanning droplet cell (SDC). The crystallographic orientation of the single grains was determined by electron back scatter diffraction (EBSD). The fraction of grains with a near 〈1 1 1〉 orientation (<10°) was 1.88 times higher than that of the near 〈0 0 1〉 orientation prior to annealing and 3.58 times higher after annealing. Voltammograms were performed on single grains with low index planes. The critical current density was 53% higher on 〈0 0 1〉 grains as compared to 〈1 1 1〉 grains. These results are used to discuss the electrochemical behaviour of the polycrystalline FeAlCr.     

Electrochemical analysis of zincate treatments for Al and Al alloy films

Electrochemical behavior of Al and Al alloy films in zincate solution was investigated to elucidate the effect of the zincate pretreatment for electroless NiP deposition, which is used for under bump metallization for LSI interconnects. The immersion potential for AlCu and AlSiCu, immediately reached to constant, which was almost equal potential to zinc reference electrode. The corrosion current for the AlCu and AlSiCu films was larger than that of the Al and AlSi films in the zincate solution. It was also confirmed that the deposited Zn at the surface of AlCu and AlSiCu films possessed smaller grain size and larger amount of nucleation, resulted in the formation of flat NiP films.     

The effect of vacuum evaporation plating on phase structure and electrochemical properties of AB5–5 mass% LaMg3 composite alloy

In this paper, Cu, Al and Ni were plated on the AB₅–5 mass% LaMg₃ composite hydrogen storage alloy using a vacuum evaporation plating method. The phase structure and the electrochemical properties were investigated. The X-ray diffraction (XRD) analysis shows that the phase structure is not changed obviously after the plating Cu, Al and Ni on the composites. The electrochemical tests show that maximum discharge capacity, high rate dischargeability (HRD), dischargeability at low temperature and cyclic stability was improved by vacuum evaporation plating Cu, Al and Ni. Maximum of discharge capacity of the AB₅–5 mass% LaMg₃ composite alloy plating Ni can reach 351 mAh/g, which is 3.5% higher than that of the untreated. HRD at I_d = 1200 mA/g of the composite alloy plating Cu is 45.0% of that at 60 mA/g, which is 20.4% higher than the untreated. Discharge capacity of the composite alloy plating Cu at low temperature 233 K is 205 mAh/g, which is 57.3% of that at 298 K, and it is much higher than 36.8% of the untreated composites. The discharge capacity retention of the composite alloy plating Al after 200 cycles is 7.8% higher than the untreated.     

EIS evaluation of the filiform corrosion of aluminium coated by a cataphoretic paint

Filiform corrosion is mainly considered as a cosmetic attack and is undesirable in most applications. The initiation and propagation of the filaments are related to different parameters such as the presence of defects, the permeability of the coating to water and oxygen, the adherence of the paint system and the presence of salts.

The aim of this work is to study the behaviour of painted aluminium samples towards filiform corrosion or delamination. The 6082 Aluminium alloy was selected and the samples were covered with a cataphoretic epoxy primer without lead (PPG Industries France). Prior to the application of the electrocoat, the samples were pre-treated by a commercial Zr/Ti or chromate conversion treatment or simply etched with a commercial acid etching product.

Filiform corrosion was studied by the normalized test (ISO/DIS 4623): painted and scratched samples were inoculated in HCl and exposed in a constant humidity chamber at 40 °C and 82% RH for 3 weeks. After exposure the samples were subjected to a visual and optical microscopic examination.

Electrochemical impedance spectroscopy was used to study the sensitivity to filiform corrosion. The operating mode of this test is similar to the normalized one. The samples were scratched before inoculation for 1 h in HCl and then exposed to the humidity chamber for a maximum of 4 days. The samples were tested by EIS in an acidified 0.1 M Na₂SO₄ electrolyte solution. The resulting impedance spectra were analyzed with an appropriate equivalent electrical circuit which allows the evaluation of the exposed metallic surface area, directly related to the extent of filiform corrosion or delamination. Different parameters were varied: the exposure time in the humidity chamber; the immersion time in the electrolyte sulphate solution as well as its pH and the coating thickness.     

Crevice corrosion behavior of high-alloy stainless steelsin a SWRO pilot plant

This paper presents the results of a study which has been carried out to investigate the crevice corrosion behavior of high-alloy stainless steel in a SWRO pilot plant. The study evaluated the corrosion performance of some austenitic and duplex steels in a crevice-forming environment created in a RO plant, especially in high-pressure feed and brine lines. The study of the effect of chemical dosing on crevice corrosion in the RO plant and electrochemical testing of crevice corrosion in the laboratory were the main objectives of this test program. High-alloy stainless steels, namely AL 6XN® and 254 SMO (superaustenitic), 2205, 2507 and DP3W (Duplex) were used in the test program. The tests were carried out in natural seawater and RO concentrate (conductivity: 75,000 to 80,000 μS/cm) at ambient temperature by operating the test plant at normal SWRO operating feed pressure of 54 bar. FeCl₃ was added as coagulant to maintain a silt density index of ∼3, and H₂SO₄ was added to feed in order to maintain the feed pH of ∼ 6.5. Chlorination and subsequent dechlorination agents were not added to the feed. For crevice corrosion tests in RO unit, the exposure periods were 6 and 12 months, respectively. The results of the tests showed that alloy DP3W has the best pitting resistance in crevice forming environment of seawater. In RO concentrate, alloys 2507 and 254 SMO showed lowest “maximum pit depth”. The results of potentiodynamic cyclic polarization (PCP) indicate that all the alloys have high pitting potential and small hysteresis loop. The results of critical crevice solution pH (CCSpH) indicated excellent resistance of alloys 254 SMO and DP3W against crevice corrosion attack and 2205 had least resistance in most aggressive sodium chloride solution.     

Electrodeposition of Co-Ni and Co-Ni-Cu systems in sulphate-citrate medium

Electrodeposition of Co-Ni and Co-Ni-Cu alloys was performed in a sulphate-citrate medium. Experimental electrodeposition parameters (pH, cobalt(II), nickel(II) and citrate concentrations) were varied in order to analyse their influence on the deposition. Anomalous Co-Ni codeposition occured in the citrate medium. High [Ni(II)]/[Co(II)] ratios (above 5) were suitable for the preparation of homogeneous magnetic Co-rich Co-Ni deposits of hexagonal close-packed (hcp) structure or face centred cubic (fcc) structure as a function of the deposition potential.The presence of very low copper(II) concentrations (<10⁻² mol dm⁻³) in the nickel-cobalt bath makes it possible to incorporate copper in the deposits in amounts ranging from 5 to 60% Cu, although uniform deposits are obtained only for low copper percentages. These ternary deposits are solid solutions with fcc structure and magnetic behaviour both dependent on the deposition potential.     

以锌铁合金为装饰镀铬底层的节镍工艺

镍是装饰镀铬组合工艺的中间镀层，用量较大，而镍价居高不下，节镍工艺倍受关注。本文介绍以锌铁合金为装饰镀铬底层的节镍工艺：一般Cu／Ni/Cr镀层改为Zn-Fe/碱Cu／亮Ni/Cr；高档产品半亮Ni/高硫Ni/全亮Ni/Cr镀层改为Zn-Fe/中性镍／亮Ni/Cr。应用表明，节镍工艺既不影响装饰铬的防护性，又显著节约金属镍，有效降低生产成本。     

Passivity and Corrosion of Cu–<Emphasis Type="BoldItalic">x</Emphasis>Zn (<Emphasis Type="BoldItalic">x</Emphasis> = 10–40 wt%) Alloys in Borate Buffer Containing Chloride Ions

The electrochemical behaviour of Cu–xZn alloys and of Cu and Zn metals was studied by cyclic voltammetry and chronopotentiometry in borate buffer, pH = 9.2, with and without the addition of chloride ions in the range from 0.01 m to 1 m. In general, the shape of voltammograms of four Cu–xZn alloys with 10 – 40 wt.% of zinc resembles that of copper more than that of zinc. With increasing zinc content several characteristics of zinc are observed. In borate buffer containing chloride anions, Cu–xZn alloys are susceptible to pitting corrosion. The breakdown potential, E_b, at which the current density in the passive region starts to increase abruptly, becomes more negative with increasing zinc content in the alloy. The general relationship E_b = a + b log c_NaCl held in all cases, with constants a and b, however, being dependent on the zinc content of the alloy and on the chloride concentration. The corrosion resistance of Cu–xZn alloys was less than that of copper metal but significantly greater than that of zinc.     

Pd合金／Si接触过渡层的结构组分研究

淀积合金薄膜的 Si 片退火时,通过固相反应在界面处生成接触过渡层,其组分与结构均不同于一般条件下生成的硅化物.本文介绍了 Pd 合金/Si接触过渡层的形成工艺,对接触过渡层的结构组分进行了分析与讨论.基于“相分层”效应,可用掺氮或掺氧的方法提高阻挡层的质量.