电源用MLCC的新型设计

电源用MLCC在出现漏电击穿后会出现烧机的严重后果,针对该问题,介绍一种新型电源用MLCC的设计方法,采用该设计后,MLCC的耐电压与可靠性有一定改善,并且能够有效的规避烧机问题。     

MLCC表面贴装中墓碑现象的研究

墓碑现象是MLCC与PCB板焊接过程中一端离开焊区而向上方斜立或直立。主要原因是在焊接过程中MLCC两端的不平衡的润湿力。而不平衡润湿力产生的主要因素是:(1)MLCC两端不能同时熔融;(2)焊盘设计不合理。根据力学机理提出了保持MLCC的表面清洁,注意合理的焊盘设计、避免焊膏的活性减弱和确保MLCC两端同时熔融的解决措施。该措施能有效防止墓碑现象,并在实际生产中取得了良好的效果。     

CaZrO3掺杂对耐高温陶瓷电容介电性能的影响

用钛酸铋钠(BNT)改性亚微米级钛酸钡合成居里温度较高的基料。在Nb2O5-Ta2O5-ZnO基础配方体系基础上,利用CaZrO3对其掺杂改性,得到了介电性能优越的耐高温电容器陶瓷材料,其居里温度高(150℃),介电常数相对较高(1 200以上)。从离子取代及微观结构表征等方面研究了不同CaZrO3掺杂量对改性钛酸钡陶瓷的介电常数、容温变化率和介电损耗的影响,为研制耐高温多层陶瓷电容器(MLCC)提供了参考。     

片式多层陶瓷电容器生产用切割设备的研究与开发

随着表面贴装技术（SMT）的发展,对小尺寸、高精度、高质量片式元件的需求越来越大。目前,在国内外电子元件市场上,片式多层陶瓷电容器（MLCC）是片式化率最高、需求量最大的一种新型元器件。文中介绍了MLCC制成工序中的关键设备之一的切断设备,从工作原理及总体设计、机械结构、电气控制系统等几部分进行了设计和开发,达到了预期效果。     

多层片式陶瓷电容器容量命中率的研究

多层片式陶瓷电容器 (MLCC)容量命中率低是生产中普遍存在的问题。本文通过微观结构、金属层和介质层厚度、以及工序因素分析 ,探讨了引起MLCC容量分散的主要原因 ,提出了工序中应控制的因素 ,为MLCC生产过程控制、提高容量命中率提供了依据。     

Microstructure and dielectric characteristics of Nb2O5 doped BaTiO3-Bi(Znl/2Til/2)O3 ceramics for capacitor applications

The effects of Nb₂O₅ addition on the dielectric properties and phase formation of 0.8BaTiO₃-0.2Bi(Zn_l/2Ti_l/2)O₃ (0.8BT-0.2BZT) ceramics were investigated. The desired perovskite phase was achieved with Nb₂O₅ doping levels being in the range of 0.5 wt.%–3.0 wt.%. The 0.8BT-0.2BZT ceramics doped with 1.5 wt.% Nb₂O₅ was found to possess a moderate dielectric constant (ε = 1170) and low dielectric loss (tanδ = 1%) at room temperature and 1 kHz frequency, showing a flat dielectric behavior over the temperature range of −55 °C–200 °C. Based on this composition, the X9R-MLCC (multilayer ceramic capacitor) with Ag0.7-Pd0.3 electrode was sintered at 1060 °C. The optimized capacitance of the MLCC is 26.5 nF, with dielectric loss tanδ of 0.9% and electrical resistance of 4.50 × 10¹¹ Ω at room temperature, leading to a high time constant of 11,900 s, decreasing to 175 s at 200 °C, being one order higher than those of commercial X7R MLCC. In addition, the equivalent series resistance (ESR) was found to be on the order of 0.2 mΩ at 2 MHz, much lower than that of the DC Bus Capacitor Bank for the automotive inverters (where the desired characteristic is <3 mΩ). All these characteristics of the newly developed MLCC will benefit the high temperature and high power capacitor applications.     

Application of response surface method for optimal transfer conditions of multi-layer ceramic capacitor alignment system

The multi-layer ceramic capacitor (MLCC) alignment system aims at the inter-process automation between the first and the second plastic processes.As a result of testing performance verification of MLCC alignment system,the average alignment rates are 95% for 3216 chip,88.5% for 2012 chip and 90.8% for 3818 chip.The MLCC alignment system can be accepted for practical use because the average manual alignment is just 80%.In other words,the developed MLCC alignment system has been upgraded to a great extent,com...     

MLCC电极用铜粉的制备与表面改性研究进展

多层陶瓷电容器(MLCC)的重要发展方向之一是电极贱金属化,铜粉是一种较为理想的电极制作材料.介绍了MLCC电极铜粉制备和铜粉改性的研究现状,指出今后应加强对铜粉粒径控制技术和抗氧化性的研究.     

利用平衡式MLCC抑制干扰

仪表放大器通常工作在噪声嘈杂的环境中,当输入放大器工作时,RF 干扰的 AC 共模电压可能产生 DC整流并由此引发仪表放大器输出工作点的漂移,导致大量共模噪声转化为差模噪声。使用一种平衡式多层陶瓷电容(MLCC)可以提高 CMRR(共模抑制比)和防止仪表放大器中的 DC 整流。     

介质厚度对MLCC的TC、TVC特性影响

研究了细晶钛酸钡介质层厚度对 ML CC的 TC、TVC特性的影响。结果表明介质层厚度≥ 2 7μm时 ,ML CC的 TC、TVC特性符合 2 X1(BX)特性要求。在施加直流偏压时 ,- 2 5 %≤ ΔC/ C≤ +15 %。ML CC的绝缘电阻为 10 1 1 Ω,损耗小于 15 0× 10