Dependence of surface morphology of CVD diamond films on deposition conditions

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零库存流程管理在医院成本核算中的应用

随着各类医用耗材、消毒品数量和种类的增加,医院物资管理在医院运营中的作用越来越显著。在提倡以患者为中心,提高患者满意度的宗旨下,与患者直接接触的HIS、LIS、PACS、CIS等医疗系统发展十分迅速,而医院内部使用的物资管理系统却比较落后。针对在医院实际医用物资管理中,时常发生医疗物资积压和医疗耗材缺货导致医疗时机延误等问题,对现有物资管理系统中的不足进行分析,并提出一种以零库存管理为基础的新工作流程,以解决现有的一些问题,并在继续深入探讨和研究。     

FMS50柔性加工系统

本文对FMS50系统结构进行了介绍，着重阐述了该系统的多种物流模式．并分析了其通信控制系统的构成。     

常减压蒸馏装置高温部位的腐蚀与防护

阐述了常减压蒸馏装置高温部位的腐蚀机理，介绍了高温防腐蚀的三种方法：正确选材、高温缓蚀剂技术及喷涂渗铝技术，建议在类似的石化装置推广使用。     

中频感应加热中温轧制成形工艺及其应用

介绍应用中频快速感应加热方法对弹簧钢、轴承钢、工模具钢等冷变形抗力大的材料及某些异型材在再结晶温度以下进行温轧的成功经验。利用快速加热还可对轧后需保持原有组织和特性的材料进行轧制。     

免疫遗传算法在烧结矿配料优化中的应用

运用免疫遗传算法和MATLAB语言 ,编制了钢铁烧结矿配料优化计算仿真程序 ,计算机仿真结果表明符合实际生产工艺要求 ,可直接应用于生产 ,提高各种烧结矿的综合利用率 ,降低成本 1 0 32 %。从而证明了免疫遗传算法是一种切实有效的优化方法 ,该算法为钢铁烧结矿配料问题的优化求解提供了新的思路和方法。     

分子动力学在材料科学中的应用

分子动力学方法是进行物质原子或分子层次计算机模拟时所采用的一种基本方法。通过分子动力学模拟，可以给出原子尺度上材料及其演化过程细节的可能性，具有无先例的准确性，使材料设计和性能预测成为可能。本文分析了分子动力学模拟的基本原理和算法；综述了分子动力学在材料科学中的应用，介绍了最近发展的第一原理分子动力学模拟，指出材料科学中第一原理分子动力学模拟的应用还有待进一步发展。     

On The Measurement of Temperature in Material Removal Processes

Because it is key to understanding the performance of material removal processes and resultant workpiece quality, the measurement of temperature during material removal is done extensively. We review several widely used temperature measurement methods and show how they can be applied to temperature monitoring during material removal. Since there is little documentation on measurement uncertainties as relates to material removal, this paper outlines the physics of each method, detailing the sources and evaluation of uncertainty. Finally, using criteria critical in measuring material removal, methods are compared, and the results presented in guide-format for participants in this field of work.     

SiCp/Cu包覆粉体及其热沉材料的制备

采用化学镀铜工艺制备了Cu包覆SiCp复合粉体,并对复合粉体的组成和形貌进行了分析.同时,利用制得的复合粉体,结合适当的热压烧结工艺制备了Cu-35SiCp热沉材料,并对热沉材料的微观组织和热物理性能进行了研究.结果表明,SiCp颗粒在热沉材料的基体中均匀分布,界面结合良好.在试验条件下,Cu-35SiCp热沉材料的导热系数为165.7 W/(m·K),30～200 ℃温度区间内的热膨胀系数为15.1×10-6/K.     

An experimental investigation into soft-pad grinding of wire-sawn silicon wafers

Silicon is the primary semiconductor material used to fabricate microchips. A series of processes are required to manufacture high-quality silicon wafers. Surface grinding is one of the processes used to flatten wire-sawn wafers. A major issue in grinding of wire-sawn wafers is reduction and elimination of wire-sawing induced waviness. Results of finite element analysis have shown that soft-pad grinding is very effective in reducing the waviness. This paper presents an experimental investigation into soft-pad grinding of wire-sawn silicon wafers. Wire-sawn wafers from a same silicon ingot were used for the study to ensure that these wafers have similar waviness. These wafers were ground using two different soft pads. As a comparison, some wafers were also ground on a rigid chuck. Effectiveness of soft-pad grinding in removing waviness has been clearly demonstrated.