首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   42047篇
  免费   4018篇
  国内免费   2934篇
电工技术   1119篇
综合类   4252篇
化学工业   5320篇
金属工艺   5385篇
机械仪表   3702篇
建筑科学   6057篇
矿业工程   2701篇
能源动力   1178篇
轻工业   2395篇
水利工程   1950篇
石油天然气   2391篇
武器工业   353篇
无线电   1303篇
一般工业技术   6680篇
冶金工业   2823篇
原子能技术   376篇
自动化技术   1014篇
  2024年   157篇
  2023年   569篇
  2022年   1793篇
  2021年   1802篇
  2020年   1339篇
  2019年   1218篇
  2018年   1142篇
  2017年   1402篇
  2016年   1538篇
  2015年   1590篇
  2014年   2282篇
  2013年   2583篇
  2012年   2712篇
  2011年   3045篇
  2010年   2351篇
  2009年   2406篇
  2008年   2263篇
  2007年   2686篇
  2006年   2344篇
  2005年   2056篇
  2004年   1765篇
  2003年   1499篇
  2002年   1336篇
  2001年   1099篇
  2000年   1003篇
  1999年   833篇
  1998年   708篇
  1997年   623篇
  1996年   528篇
  1995年   429篇
  1994年   370篇
  1993年   295篇
  1992年   262篇
  1991年   187篇
  1990年   165篇
  1989年   156篇
  1988年   102篇
  1987年   71篇
  1986年   47篇
  1985年   37篇
  1984年   44篇
  1983年   19篇
  1982年   32篇
  1981年   10篇
  1980年   15篇
  1979年   21篇
  1964年   10篇
  1961年   6篇
  1959年   8篇
  1955年   11篇
排序方式: 共有10000条查询结果,搜索用时 15 毫秒
101.
Measurement of the flow stress of high density polyethylene (HDPE) and nylon 66 at strain rates of 103 s?1 using a split Hopkinson pressure bar technique is discussed. The flow stress at a strain of 10% has been determined for both polymers at 20°C. The intrinsic errors involved in this technique are briefly reviewed. The results indicate that the flow stress of HDPE and nylon 66 were 50MPa and 150MPa, respectively, at strain rates of about 103s?1.  相似文献   
102.
Compression-after-impact (CAI) tests have been conducted for quasi-isotropic thick plates with 48 plies by using the NASA method and on plates with 32 plies by using the SACMA method. Specimens are made of CF/PEEK (APC-2) and conventional CF/epoxy for the NASA plates and CF/epoxy for the SACMA plates. In the NASA CAI tests, the sequence of delamination buckling and its propagation is clearly revealed through various experimental techniques. One major technique is moiré topography, and the other is thermo-mechanical stress analysis with a high-accuracy infrared sensor. The arrest of delamination propagation just before catastrophic failure due to high fracture toughness is clearly captured by the moiré camera. This behavior provides good CAI values of CF/PEEK. The initial buckling properties of the delaminated region by the impact are then extensively discussed. Numerical predictions of initial buckling stress have been obtained by modelled geometry of the delaminated region simplified from its precise structure clarified by ultrasonic C-scanning. They agree fairly well with the experimental results. The in-plane stress distribution in the delaminated region before initial buckling is measured by an infrared stress graphic system. This compared favorably with finite element predictions. Two types of symmetric buckling modes with respect to the central plate surface, twin and single peak ones, are experimentally captured.  相似文献   
103.
The fatigue life of a welded aluminium T‐joint made from beams with rectangular hollow section (RHS) has been predicted using a crack propagation analysis and compared with experimental results from joints with different residual stress levels. To include the effect of the residual stresses, the stress ratio was calculated at the weld toe and, via Walker's equation, introduced into the analysis. How to obtain the Walker exponent has been discussed in detail. The introduction of a stress ratio at the weld toe provides good agreement between the experimentally and analytically found S–N curves. The effect of the residual stress was successfully included in the analysis.  相似文献   
104.
The technology of trailing peening is a kind of promisingly bran-new technology which can be used to control weldingstress and distortion of Ti alloy thin plate. Control of TC4 Ti alloy thn plate welding stress and distortion underthe condition of convent  相似文献   
105.
Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.  相似文献   
106.
An efficient return algorithm for stress update in numerical plasticity computations is presented. The yield criterion must be linear in principal stress space and can be composed of any number of yield planes. Each of these yield planes may have an associated or non-associated flow rule. The stress return and the formation of the constitutive matrix is carried out in principal stress space. Here the manipulations simplify and rely on geometrical arguments. The singularities arising at the intersection of yield planes are dealt with in a straightforward way also based on geometrical considerations. The method is exemplified on non-associated Mohr–Coulomb plasticity throughout the paper.  相似文献   
107.
Microhardness measurements have been performed on untreated (virgin) and electrically stressed, solvent‐cast laboratory‐prepared samples of pure poly(phenylene oxide) (PPO), pure polystyrene (PS), and PPO : PS polyblends with different weight proportions. Results of such measurement on untreated polyblend sample show that microhardness (Hv) increases with increase in the content of PS up to 10 wt %, which attributed to the existence of homogeneous phase morphology. However, this feature is not observable in samples containing higher content of PS. Electrical stress is found to modify considerably the mechanical property of polymer. The effect of electric field on the microhardness of such samples (PPO : PS :: 90 : 10) has been characterized by the existence of a peak. Trapping of charge carriers in electrically stressed samples imparts hardening to the polyblend up to an applied step field of 190 kV/cm. However, the excessive charging beyond this step field value destroys this characteristic. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008  相似文献   
108.
Recent experiments have shown that metallic materials display significant size effects when the characteristic length scale of non-uniform plastic deformation is close to a micron. Couple stress plasticity has been developed to explain such phenomena by Fleck and Hutchinson. The mechanical behaviors of ultra-thin nickel beams in different boundary conditions were studied with the hybrid element developed for couple stress plasticity before. Strong scale effects are found when the beam's thickness is close to the material characteristic length scale. Such phenomena will disappear if the beam' s thickness is greatly larger than the material characteristic length scale. The scale effect is the beams inherent property and it does not change with the change of support conditions.  相似文献   
109.
110.
Previous studies have identified a number of different farm stressors and have reported gender and age differences in levels of stress. This study aimed to determine stress experienced by New Zealand dairy farmers, particularly in relation to adoption of new technology and its relationship to age and gender. Measures of farm stress and adoption of technology were completed by 985 dairy farmers. The highest levels of stress were reported for time pressures, machinery breakdown, weather, and government policies. Stress related to new technologies occurred rarely. Women reported more stress and higher levels of stress for understanding new technologies. There was also an increase in severity of stress with age related to new technologies. Overall, stress levels were moderate and may reflect favorable economic conditions. The findings suggest a need to tailor stress interventions to meet specific needs. (PsycINFO Database Record (c) 2010 APA, all rights reserved)  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号