导电银胶触变性的研究

以环氧树脂为基体,银粉为填料,制备出IC封装用导电银胶。研究了环氧树脂与银粉的比例、银粉的形貌和粒径以及触变剂SiO2的用量对导电银胶触变性的影响。结果表明,银胶触变性随树脂/银粉质量比的减小而增大,当其为0.2时,触变指数达到5.68。在一定粒径范围内,银胶的触变性与银粉粒径呈反比关系;银胶触变性随SiO2的用量增大而增大。     

Simulations and experiments of three-dimensional paddle shift for IC packaging

Paddle shift is one of the most serious defects which may arise during the IC encapsulation of leadframe-type packages. The term “paddle shift” means the deflection of the leadframe-pad and die as a result of the pressure difference between the top and bottom mold cavities. In extreme cases, paddle shift could lead to a substantial reduction in the reliability of package.This paper employed a computational approach to predict the paddle shift quantity during the IC packaging process. The approach was based on precise finite element (FE) models and flow-structure decoupled analyses. Two kinds of FE models were needed for the decoupled analyses, namely a 3D FE model for the mold filling analysis (i.e. fluid-flow mesh) and a 3D FE model for the structural analysis (i.e. paddle mesh). The aim of the mold filling analysis was to identify the pressure distribution acting on the paddle structure during the encapsulation process, while the objective of the structural analysis was to determine the amount of paddle shift which was caused by pressure distribution.To investigate the relationship between the package geometry and the amount of paddle shift, the present simulations considered six TQFP (Thin quad flat package) models with different geometrical parameters. The simulation results for the paddle shift were compared with the experimental results to demonstrate the accuracy of the proposed numerical approach. It was found that a good agreement exists between the two sets of results.     

功率器件封装用纳米浆料制备及其烧结性能研究进展

随着SiC、GaN等第三代半导体在大功率器件上的应用,功率器件的工作温度可达到300℃,传统Sn基无铅钎料因为熔点低及钎焊温度高等原因无法满足要求。纳米浆料因其可以实现低温烧结、高温服役的特性吸引了国内外研究者的青睐。从纳米颗粒的合成、纳米浆料的制备、烧结性能以及可靠性等方面综述国内外纳米浆料的研究进展,同时对纳米浆料研究中存在的问题提出一些建议。     

High-Efficiency Reactive Oxygen Species Generation by Multiphase and TiO6 Distortion-Mediated Superior Piezocatalysis in Perovskite Ferroelectrics

Piezocatalysis, governed by piezo-potential within piezoelectrics, has gained prominence for reactive oxygen species (ROS) generation, which is significant to environmental and biological applications. However, designing piezocatalysts with excellent piezocatalytic performance in a wide temperature and efficient charge carrier separation ability is still challenging. Herein, eco-friendly BaTiO₃ (BT)-based perovskite ferroelectrics with tailored multiphase coexistence in a wide temperature range are constructed to boost higher piezoelectricity and large piezo-potential, which is attributed to decreased polarization anisotropy by flat Gibbs energy profile. Elevated piezo-potential in designed BT-based piezocatalyst guarantees high-efficient generation rate of •OH (200 µmol g⁻¹ h⁻¹) and •O₂⁻ (40 µmol g⁻¹ h⁻¹) by ultrasound stimulation, which is 3.5 times more than that of pure BT. Besides, piezocatalytic capacity to degrade dye wastewater shows a rate constant of 0.0182 min⁻¹ and gives an antibacterial rate of 95% within 30 min for eliminating E. coli. Theoretical simulations validate that the local distortion of TiO₆ octahedra also contributes to piezocatalytic performance by inducing electron–hole pairs separation in real space, and better response to slight structural deformation. This work is important to design high-performance piezocatalysts with high-efficiency ROS generation for sewage treatment and sonodynamic therapy.     

基于数字散斑相关的封装热机械耦合效应测量

利用数字散斑相关方法(DSCM),对COB封装结构在热循环状态下的表面热机械耦合效应进行了测量.利用CCD摄像机采集封装芯片在不同温度场中的散斑图像,对比采集到的图像,获取封装芯片在温度场作用下的面内变形.根据三角法测量技术原理,将离面位移的测量转化为面内位移的测量,从而获得了芯片受热后的翘曲形变和弹性应变分布.将实验测量与有限元模拟以及理论计算的结果进行了对比,3种结果吻合得比较好,表明了实验方法的有效性和可行性.     

MEMS封装技术及标准工艺研究

分析了MEMS的特点及封装工艺对MEMS的影响,给出了对MEMS封装的基本要求.研究了MEMS封装工艺中的一些关键技术,即硅-硅和硅-玻璃键合技术、清洗与引线键合技术、焊料贴片和胶粘技术以及气密封帽技术等,并给出了一些重要的研究结果.同时也介绍对几种MEMS惯性器件的封装要求及封装方法.     

Status and prospects for phosphor-based white LED packaging

The status and prospects for high-power, phosphor-based white light-emitting diode (LED) pack-aging have been presented. A system view for packaging design is proposed to address packaging issues. Four aspects of packaging are reviewed: optical control, thermal management, reliability and cost. Phosphor materials play the most important role in light extraction and color control. The conformal coating method improves the spatial color distribution (SCD) of LEDs. High refractive index (RI) encapsulants with high transmittance and modified surface morphology can enhance light extraction. Multi-phosphor-based packaging can realize the control of correlated color temperature (CCT) with high color rendering index (CRI). Effective thermal management can dissipate heat rapidly and reduce thermal stress caused by the mismatch of the coefficient of thermal expansion (CTE). Chip-on-board (COB) technology with a multi-layer ceramic substrate is the most promising method for high-power LED packaging. Low junction temperature will improve the reliability and provide longer life. Advanced processes, precise fabrication and careful operation are essential for high reliability LEDs. Cost is one of the biggest obstacles for the penetration of white LEDs into the market for general illumination products. Mass production in terms of CoB, system in packaging (SIP), 3D packaging and wafer level packaging (WLP) can reduce the cost significantly, especially when chip cost is lowered by using a large wafer size.     

RFID标签引脚阻抗的建模与计算

射频识别(RFID)标签的封装中,芯片与天线靠各向异性导电胶(ACA)连接。ACA的性质导致了芯片的引脚与天线连接处会有较大的阻抗,影响了标签的电参数,会对标签读写距离产生不利的影响。分析了芯片引脚处阻抗对标签的电性能的影响,对该处电阻与寄生电容进行了建模和计算。最后,依据理论计算了一款天线的引脚阻抗,并据此对该天线进行了优化与测试,验证了理论的正确性。     

Cracking energy estimation of ultra low-k package using novel prediction approach combined with global-local modeling technique

Interfacial crack/delamination, due to the presence of dissimilar material systems, is one of the major concerns of thermo-mechanical reliability for the development of next node technology in integrated circuits (IC) devices. The cracking energy results from many back end of line (BEOL) and packaging processes at various temperature differences is prone to drive the crack advance. To investigate the sensitivity of crack propagation in low-k dielectric materials, a robust estimation of J-integral approach combined with a rectangular path of integral contour is performed using finite element analysis (FEA). By means of the verification of 4-point bending test (4-PBT), excellent agreements are obtained as compared with the experimental data. Moreover, a multiscale modeling technique is proposed to resolve the difficulty of model construction as from bridge device level to packaging level. The sub-modeling procedures developed specifically for the impact prediction of interfacial crack in complicated Cu/low-k interconnects. The analytic results indicate the foregoing methodology is valuable to forecast the physical behavior and reliability of advanced IC devices in the nano scaled size. On the basis of the presented results in this research, an approximated criterion for determining the dimensions of sub-model is suggested and demonstrated as well.     

Superparamagnetic Ag@Co‐Nanocomposites on Granulated Cation Exchange Polymeric Matrices with Enhanced Antibacterial Activity for the Environmentally Safe Purification of Water

Cation exchange polymeric matrices are widely used in water treatment protocols to reduce the mineral content of hard waters, even for human consumption. However, they are not antibacterial and flowing bacteria can be trapped in their structures and proliferate, thus acting as microbial contamination sources. Here, Ag@Co‐nanoparticles (Ag@Co‐NPs) with a low‐cost superparamagnetic Co⁰‐core and an antibacterial Ag‐shell are synthesized on granulated cation exchange polymeric matrices under soft reaction conditions. The presence of these NPs provides the final nanocomposite (NC) with additional functionalities (superparamagnetism and antibacterial activity) making it ideal for water purification applications. Ag@Co‐NPs are synthesized in situ on four cation exchange polymeric matrices containing either strong (sulfonic) or weak (carboxylic) acid functional groups homogeneously distributed (C‐type) or concentrated on an external shell (SST‐type) by the intermatrix synthesis (IMS) method. The NCs are characterized (metal content, NP size and distribution, metal oxidative state, and metal release) and evaluated for water purification applications.