A copper/polyimide Metal-base packaging technology

A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.¹ This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm^?) and four small vias (1.0 mm^?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.     

Improving antibacterial,biocompatible, and reusable properties of polyvinyl chloride via the addition of aluminum alkoxides

Global bacterial infections associated with conventional polyvinyl chloride (PVC) medical devices place a heavy burden on healthcare systems and thus it will be desirable if medical devices are made from antimicrobial PVC. There are numerous studies focusing on polymer surface modifications to either leach antimicrobial agents or kill pathogenic microbes upon direct contact. In this work, mannitol fumarate ester-based aluminum metal alkoxide (MFE-Al) additive was developed to confer simultaneously improved antibacterial property and enhanced high temperature sterilization resistance of the resultant PVC. Data obtained confirm that the MFE-Al stabilized PVC sheets significantly inhibit 98% bacterial growth. They also show biocompatibility with cultured H9C2 cardiomyocytes and hemocompatibility in vitro. Dry heat sterilization is generally not suitable for PVC medical wares due to their poor thermal compatibility. Surprisingly, our antimicrobial-biocompatible PVC can maintain stability at 180°C for 90 min. Such a high thermal stability indicates the MFE-Al stabilized PVC can endure 90 cycles of dry-heat sterilization without significant damage. This study may provide a solution to reduce PVC medical waste for a maximum benefit without compromising human health or the environment.     

仿生黏附性聚多巴胺丁香酚抑菌微胶囊的制备

以丁香酚（EO）为芯材,多巴胺（DA）为壳材,通过乳液模板-界面聚合法成功制备出尺寸可控的聚多巴胺丁香酚（PDA@EO）微胶囊。通过FTIR、TG、UV-Vis、SEM和TEM对微胶囊的化学结构、形貌、粒径及性能进行表征和分析,结果表明,所制备的微胶囊呈规整球形,粒径在55～94 nm之间,丁香酚包封率为25.35%,包封量为0.6288 g/g,24 h时累积释放率达到68.39%。通过对比实验证明,PDA@EO微胶囊在不同材料表面均具有优异的黏附性能;作用于口腔感染部位常见细菌金黄色葡萄球菌和大肠杆菌24 h,PDA@EO微胶囊较游离丁香酚的抑菌活性分别提高了36.84%和35.52%;当微胶囊质量浓度达到2.0 g/L时,PDA@EO微胶囊对两种细菌的抑菌活性均达到99%以上。     

Facile Fabrication of Povidone Iodine-Embedded Polytetrafluoroethylene Superhydrophobic Films with Improved Antiadhesive and Bactericidal Properties in Bacterial Environments

It remains a challenge to maintain the antiadhesion properties of superhydrophobic films after exposure to bacterial environments. In this work, superhydrophobic bactericidal polymer films via the simple incorporation of polyvinylpyrrolidone-iodine (PVP-I) or iodine into polytetrafluoroethylene (PTFE) are fabricated to improve their antiadhesive and antibacterial capability. Superhydrophobic iodine-embedded films, polytetrafluoroethylene/polyvinylpyrrolidone-iodine and polytetrafluoroethylene-iodine (PTFE/PVP-I and PTFE-I), show excellent antiadhesive and bactericidal performances even post exposure to bacterial solutions as compared to iodine-free counterparts by controlling the release of iodine. Especially, superhydrophobic PTFE/PVP-I films display a more sustained iodine release profile and significant antibacterial properties against gram-positive (S. aureus, methicillin-resistant S. aureus (MRSA)) and gram-negative (E. coli) bacteria. Such a facile combination of antiseptic agents and superhydrophobic surface could be widely used for antiseptic biomedical applications.     

Facile Deposition of Silver Nanoparticles on Photonic Cellulose Nanocrystals Films: A Study on Solvent Stability and Post Antibacterial Activity

Cellulose nanocrystals (CNCs) incorporated with silver nanoparticles (AgNPs) photonic films have drawn considerable attention due to their plasmonic chiroptical activity. However, the exploitation of some fundamental properties for practical use such as the affinity analysis of metal nanoparticles attached to the surface of photonic films according to the solvent compatibility and antibacterial activity under physical conditions has yet not been studied. Hence, a facile process of in situ deposition of AgNPs into the chiral structure of CNC films is proposed. CNC photonic films, cross-linked by glutaraldehyde are prepared. This interaction generated the solvents-stable photonic film with a considerable amount of unreacted aldehyde functional groups that facilitates the reduction of Ag salt to AgNPs. The formed AgNPs in the photonic films show excellent stability over immersion in various polar and non-polar solvents. The post-solvent treated photonic films display excellent contact-based antibacterial behavior against gram-negative Escherichia coli.     

含铜抗菌不锈钢的应用研究现状

含铜(Cu)抗菌不锈钢是一类结构/功能一体化金属新材料,目前已经具备稳定的工业规模生产能力。为应对日常生活、医疗领域和海洋工程装备领域所遇到的细菌微生物污染问题,已经开发出适用于相应领域的多种含Cu抗菌不锈钢新材料。为了探索新阶段含Cu抗菌不锈钢的研发方向,综合介绍了含Cu抗菌不锈钢关键性能的研究进展及在多领域的应用现状,并分析了时代发展给该领域所带来的新的问题与挑战。     

Shear strength and aging characteristics of 63Sn−37Pb solder bumps with various solder ball and pad sizes

The shear strength and aging characteristics of 63Sn–37Pb solder bumps were characterized with variation in solder ball and UBM pad sizes. The shear strength increased with shorter effective crack size,a _effs which was determined with the solder ball and pad sizes. The shear strength of the solder bumps on Au/Ni/Cu and Ni/Cu did not change significantly with reflow time. Substantial decrease in the shear strength occurred for the solder bumps formed on Au/Ni/Cu with aging treatment, and the shear strength after aging was also related to the bump shape which was determined with the solder ball and pad sizes.     

水基传送带润滑剂综述

说明了水基传送带润滑剂的作用机理、性能要求,详细介绍了现有的水基传送带润滑剂的特点,并简单介绍了水基传送带润滑剂的发展前景和趋势。     

制备工艺参数对抗菌胶衣树脂抗菌性能的影响

本文以硅溶胶为载体,通过负载金属银离子、TiO2、ZnO以及A l2(S iO3)3于硅溶胶中,制备了复合无机抗菌剂,并将其加入到胶衣树脂中制备了抗菌胶衣树脂。主要研究了抗菌剂的制备参数、含量及种类和抗菌胶衣树脂的制备参数对胶衣树脂抗菌性能的影响。实验结果表明,随着烧结温度的升高,抗菌胶衣树脂的抗菌率呈现先升高后降低的趋势,烧结温度为1000℃时抗菌胶衣树脂的抗菌率最高;随着球磨时间的延长,抗菌胶衣树脂的抗菌率呈上升趋势,球磨时间大于6h时抗菌率增加的幅度减小;随着苯乙烯含量的增加,其抗菌率也逐渐增加,苯乙烯含量为10m l时抗菌率达94%;随搅拌时间的延长,抗菌胶衣树脂的抗菌率也有所增加,搅拌时间为1h时抗菌率为94%。