聚多巴胺-聚乙烯亚胺改性反渗透膜制备与表征

饮用水短缺和水污染问题严重影响着人类和社会的发展。反渗透技术提供了一种高效经济的方法来生产纯水和处理废水,以缓解这个问题。但是,反渗透膜的污染尤其是生物污染严重制约着其高效应用。膜表面改性技术是提升膜抗污染性能的最常用手段,通过多巴胺盐酸盐(DA)在聚酰胺反渗透膜表面自聚,生成超薄聚多巴胺涂层(PDA),进一步利用PDA涂层上的活性基团将聚乙烯亚胺(PEI)接枝到反渗透膜表面,得到稳定持久的PDA-PEI改性反渗透膜。通过对改性膜的XPS测试,亲水性和抗菌性试验,得到以下结论:PDA成功涂层于反渗透膜表面,且PEI成功接枝于PDA涂层表面;PDA-PEI改性增大了膜表面的亲水性,提升了反渗透膜抗污染的能力,使其具有了一定的抗菌能力。     

Ceramic and Glass-Ceramic Packaging in the 1990s

A broad overview of packaging involving interconnecting, powering, protecting, and cooling semiconductor chips to meet a variety of computer system needs is presented. The general requirements for ceramics in terms of their thermal, mechanical, electrical, and dimensional control requirements are presented, both for high-performance and low-performance applications. Glass-ceramics are identified as the best candidates for high-performance systems, and aluminum nitride, alumina, or mullite are identified for low-performance systems. Glass-ceramic/copper substrate technology is discussed as an example of high-performance ceramic packaging for use in 1990s. Lower-dielectric-constant ceramics such as composites of silica, borosilicate, and cordierite, with or without polymers and porosity, are projected as potential ceramic substrate materials by the year 2000.     

纳米TiO2抗菌涂料研究进展

介绍了纳米TiO2抗菌涂料的抗菌机理、制备方法和应用现状，并对其研究进行了展望。     

电子封装用环氧树脂的增韧和提高耐热性研究

用α,ω 二氯聚二甲基硅氧烷(DPS)或α 氯聚二甲基硅氧烷(CPS)来改性普通双酚A环氧树脂(BPAER)和四溴双酚A环氧树脂(TBBPAER),目标是制备出一系列可用于电子封装的高韧性高耐热性的环氧基料。通过对固化物的冲击强度、拉伸强度、断裂伸长率和玻璃化转变温度(Tg)以及断裂面形态的测定,探讨了改性方法、有机硅组成与含量等对材料性能的影响。结果表明,当m(BPAER)∶m(DPS)=100∶10时,树脂固化物的冲击强度达到30 5kJ/m2,拉伸强度达46 95MPa,断裂伸长率达到60 23%,Tg达到141 3℃;分别比未改性BPAER提高了19 7kJ/m2,1 69MPa,54 29%以及5 9℃。而当m(TBBPAER)∶m(CPS)=100∶10时,固化物的冲击强度达到17 2kJ/m2,拉伸强度达39 89MPa,断裂伸长率达到5 60%,Tg达到147 0℃;分别比未改性TBBPAER提高了12 8kJ/m2,28 26MPa,4 29%以及7 9℃。     

Advanced underfill for high thermal reliability

The key to the success of flip‐chip technology lies in the availability of sucessful underfill materials. However, the reliability of flip‐chip technology using current underfill materials is generally found to be lower than that of conventional wire‐bond connection packaging materials such as epoxy molding compound (EMC) because of the high coefficients of thermal expansion (CTE) and moisture absorption of cured underfill material. In this study desbimide (DBMI), which has a low melting point (about 80°C), was used in the underfill materials as a cohardener. As a result, DBMI‐added underfill can show excellent thermal reliability, which is due to the superior properties of the CTE, the elastic modulus, and water resistance. When the properties of a 2 wt % DBMI‐added underfill were compared with those of a typical underfill (epoxy/anhydride), the CTE value was reduced to less than one‐half at the solder reflow temperature (about 200°C), the elastic modulus was reduced to less than one‐half in the temperature region below the glass‐transition temperature, and the water resistance was improved twofold. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 2617–2624, 2002     

晋中民俗文化对当地食品包装设计的影响

承载着千年文化的山西晋中,有着独特的地域民俗文化,在当今如何把当地传统民俗文化内涵运用在食品包装设计当中成为一种趋势,越来越多的设计师和消费者深刻的认识到本土民俗文化元素对食品包装设计内涵的重要性,因此在现代食品包装设计中合理的融入民俗文化元素,从而使食品包装设计显示出独特、深厚并富有魅力的乡土风情和地域性文化内涵。     

交互式教学实践在设计教学中的应用研究

交互式实践教学模式是指在设计教学过程中,不仅考虑教学媒介与学习者之间的双向信息流动,也考虑设计教学中内容与实践的结合以及学生在课堂上的有效思考和设计实践能力。文章以包装设计课程为例,探讨交互式教学实践模式设计艺术课程教学改革的可能性。     

化学还原法制备Ag-TiO2光催化抗菌材料的研究

选用平均粒径分别为30nm和8μm的二氧化钛为原料,利用化学还原法制得银质量分数为0. 7% ~5%的Ag-TiO2光催化抗菌材料,采用抑菌圈试验对其抗菌性能进行研究,通过光催化降解亚甲基蓝实验研究了二氧化钛载银前后光催化活性的改变。结果表明,负载1% (质量分数)银的平均粒径为30nm的二氧化钛经250℃热处理后具有良好的抗菌性,其催化活性没有改变。     

浅论陶瓷包装的促销作用

简单的阐述了包装的含义、历史上的陶瓷包装;并从包装装潢的促销作用、引导消费过程入手,具体叙述了陶瓷包装在陶瓷销售中的促销作用。最后简述了我国与世界包装的差距,总结陶瓷包装的发展。     

Antibacterial and corrosive properties of copper implanted austenitic stainless steel

Copper ions were implanted into austenitic stainless steel (SS) by metal vapor vacuum arc with a energy of 100 keV and an ions dose range of (0.5-8.0)×1017 cm-2. The Cu-implanted SS was annealed in an Ar atmosphere furnace. Glancing X-ray diffrac-tion (GXRD), transmission electron microscopy (TEM) and Auger electron spectroscopy (AES) were used to reveal the phase compositions, microstructures, and concentration profiles of copper ions in the implanted layer. The results show that the antibacterial property...