触摸输入技术探析

本文扼要概述触摸输入的４种技术，及其应用与性能比较。     

球铁管表面喷锌机的设计与研究

球铁管是我国“九五”和“十五”期间大力推广和发展的项目 ,在大量的设计和应用基础上 ,对球铁管生产使用的重要设备之一———表面喷锌机进行了系统的研究与分析 ,提出了相关的设计思想和方法。对于提高表面喷锌机的使用性能和生产效率具有重要意义     

Rapid analysis of polymer homologues and additives with SFE/SFC-MS coupling

A rapid and easy analysis method for polymers is presented. The method involves sample preparation by SFE, separation of the extracted compounds by SFC and simultaneous quantitative detection by FID, as well as identification of unknowns by MS. The applications illustrate how structural research work and routine polymer analysis can be done with this time saving method.     

基于"替换法"的汉字加、解密实现技术

文章讨论的基于“替换法”的汉字信息加、解密实现技术,改变了传统的汉字加密结果,使加密后的密文仍是可以识别和再利用的汉字,发送者可以在任何可编辑汉字的通讯设备上发送和接收密文,确保中文信息传输过程中的安全性。加、解密算法实现的代码语言为VFP6.0。     

三峡工程临时船闸坝段4.5 m升层混凝土施工

三峡临时船闸2号坝段甲块混凝土因大坝蓄水验收要求，须在50d内完成28．5m高的混凝土浇筑，如按常规大坝混凝土施工是无法完成的。工程实施中，采用了4．5m大升层混凝土施工方案，通过加快混凝土入仓速度，改进混凝土施工工艺，加强混凝土模板设计，注重混凝土初期冷却，缩短混凝土间歇期等一系列措施，提前7d完成了目标计划。临时船闸2号坝段4．5m升层混凝土的施工经验，可供大体积混凝土施工借鉴。     

包装机中塑料薄膜常热式热封参数的实验研究

文中通过对包装机中常热式热封过程的分析及有效的实验，获得较为可靠的热封实验数据，并利用专业统计软件spss对实验数据进行处理，得到包装机中塑料薄膜的封口强度与操作参数之间的关系，为设计人员提供了一种获得最优操作参数的有效方法。     

High‐pressure processing effects on the mechanical,barrier and mass transfer properties of food packaging flexible structures: a critical review

Food products can be high‐pressure processed (HPP) either in bulk or prepackaged in flexible or semi‐rigid packaging materials. In the latter case the packaging material is subjected, together with the food, to high‐pressure treatment. A number of studies have been performed to quantify the effects of high‐pressure processing on the physical and barrier properties of the packaging material, since the integrity of the package during and after processing is of paramount importance to the safety and quality of the food product. This article reviews the results of published research concerning the effect of HPP on packaging materials. Copyright © 2004 John Wiley & Sons, Ltd.     

Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging

In packaging of microelectromechanical systems (MEMS), optical, and electronic devices, there is a need to directly bond a wide variety of inorganic materials, such as oxides, nitrides, and semiconductors. Such applications involve hermetic-sealing components, three-dimensional MEMS assembly components as well as active semiconductor or optical components, dielectric layers, diffusion barriers, waveguides, and heat sinks. These materials are known to be very difficult to wet and bond with low melting-point solders. New Sn-Ag- or Au-Sn-based universal solders doped with a small amount of rare-earth (RE) elements have been developed, which now allow direct and powerful bonding onto the surfaces of various MEMS, optical, or electronic device materials. The microstructure, interface properties, and mechanical behavior of the bonds as well as the potential packaging applications of these new solder materials for MEMS and optical fiber devices are described. Various packaging-related structural, thermal, or electrical issues in MEMS are also discussed.     

我国塑料机械工业概况与发展

介绍了我国2001年塑料机械工业的生产状况，通过大量翔实的数据对我国注射机、挤出机和吹塑机三大产品的生产技术、经济技术指标及进出口市场状况进行了分析。     

可编程控制器在捆扎机自动控制中的应用

介绍了一种用可编程控制器（PLC）实现捆扎机自动控制的设计方案，详细地介绍了设计过程，给出了完整的程序流程图和部分控制程序。