基于XRD的薄膜界面结合强度试验研究

利用X射线衍射技术（XRD）分析了薄膜结合界面应力及其变化规律，通过对薄膜界面结合状态的检测，建立了X衍射法测量薄膜界面结合强度的原理、方法与过程。其检测界面结合强度方法可对薄膜试样进行非接触检测，适用于晶体或多晶体薄膜的界面结合强度测量，是一种研究无损检测薄膜结合强度的试验新方法。     

再加热对Fe3A1/18-8扩散焊界面附近组织结构的影响

Fe3A1/18-8扩散焊界面不均匀地分布着第二相析出物,特别是交界面处连续分布的析出相族可能直接诱发裂纹,是引起接头失效的重要因素.对Fe3A1/18-8扩散焊接头进行再加热,采用扫描电镜、能谱分析、X射线衍射等对析出相及界面相结构进行分析.结果表明,再加热后界面析出相细化且形状规则,均匀分布于Fe3A1/18-8界面,析出相族消失.界面附近的显微硬度降低,不存在高硬度脆性相.     

Si3N4/Ti/Cu/Ni/Cu/Ti/Si3N4二次部分瞬间液相连接强度

采用Ti/Cu／Ni中间层对Si3N4陶瓷进行二次部分瞬间液相(PTLP)连接，研究连接工艺参数对Si3N4／Ti/Cu／Ni连接强度的影响，同时研究了连接强度随试验温度的变化规律。结果表明，在该试验条件下，室温连接强度随着二次连接温度的提高和二次保温时间的延长而提高，改变连接工艺参数对Si3N4／Ti/Cu／Ni二次PTLP连接界面反应层厚度无明显影响；连接强度在试验温度400℃时达到最大，随后随试验温度升高，连接强度降低，但在800℃前，其高温强度具有很好的稳定性。     

Bonding of Al2O3 ceramic and Nb using transient liquid phase brazing

The brazing of Al2O3 to Nb was achieved by the method of transient liquid phase (TLP) bonding. Ti foil and Ni-5V alloy foil were used as interlayers for the bonding. The base materials were brazed at 1423-1573 K for 1-120 min. The results show that the shear strength of the joint first increases and then decreases with increasing holding time and brazing temperature. The joint interface microstructure and elements distribution were investigated. It can be concluded that a composite structure, in which the base metals are solid solution Nb(V) and Nb(Ti) reinforced by Ni3Ti, is formed when the brazing temperature is 1473 K and holding time 15 min, and a satisfactory joint strength can be achieved. The interaction of Ti foil and Ni-5V foil leads to the formation of liquid eutectic phase with low melting point, at the same time the combination of Ti come from the interlayer with O atoms from Al2O3 results in the bonding of Al2O3 and Nb.     

Ag-Cu-Ti-(Ti+C)反应-复合钎焊SiC陶瓷和 Ti合金的接头组织

研究用合金化Ag-Cu-Ti粉、Ti粉、C粉组成的混合粉末真空无压钎焊再结晶SiC陶瓷和Ti合金,采用X射线衍射、扫描电镜和能谱仪对接头的组织结构进行了分析.结果表明:在67.6%Ag-26.4%Cu-6%Ti(质量分数)粉末中加入相当于15%～30%TiC(体积分数)的(Ti C)粉末(Ti与C摩尔比为1:1),经920℃,30 min真空钎焊,Ti和C原位合成TiC,形成以TiC晶粒强化的连接良好的复合接头;形成的TiC分布于Ag相、Cu-Ti相中;TiC的形成明显降低了接头的热应力.过量的(Ti C)粉末则导致反应不完全,容易在连接层中产生孔洞,影响接头强度;焊接过程中,Ti由钛合金扩散进入连接层,Cu也有部分从连接层中扩散进入钛合金.     

Characteristics of deformation joining of aluminum-stainless steel composite sheet

1　INTRODUCTIONAseveryoneknows ,aluminumandstainlesssteelaredifficulttoweldtogether[16 ] .Inthepast,braz ing ,projectionweldingaswellasaluminizingwereused .Nowadays ,anewmethodisputforward ,inwhichthealuminumsheetandstainlesssteelsheetheatedbyinductionheaterareconnectedbypressureofascrew press .Notonlycanthismethodimprovebondingbehaviorofthecompositesheet,butalsocanitraisetheproductivity greatly .Thistechnologyiscalleddeformationjoining ,i.e .pressjoining .InChi na ,ithasbeensuccessfully…     

累积叠轧焊法制备超细晶纯铝的研究

采用累积叠轧焊方法在室温下对1060纯铝进行剧烈塑性变形，并分析1060纯铝变形前后内部微观组织结构的演变和力学性能的变化。实验结果表明，随着累积叠轧道次的增加，层界面复合越来越紧密，5道次后出现母材基体的相互渗透；材料的抗拉强度和硬度得到大幅度提高，伸长率在1道次时急剧下降，然后基本保持不变；晶粒尺寸急剧细化，等效真应变为6．4的条件下得到了平均晶粒尺寸为400nm的超细晶组织。     

SiCp/Cu复合材料的真空钎焊

对冷压烧结结合热挤压工艺制备的SiC/Cu复合材料,选用Ti和AgCuTi为钎料,采用不同的工艺进行真空钎焊试验.用金相显微镜和扫描电镜对母材和钎焊接头的剪切断口形貌进行分析,利用电子万能试验机对钎焊接头进行抗剪强度测试,将接头抗剪强度与母材抗剪强度进行对比以评判钎缝质量.结果表明,用Ti为钎料连接SiCp/Cu复合材料的连接状况要优于AgCuTi钎料,且连接温度850℃,保温时间为20 min时,抗剪强度最大为70.5 MPa,与母材抗剪强度相当;随着铜基复合材料中SiCp含量不断增加,钎焊接头室温抗剪强度不断下降,当SiCp含量超过10%时,抗剪强度快速下降.     

陶瓷与金属扩散连接的研究现状

陶瓷与金属的连接技术是材料工程领域的热点研究课题,而扩散连接方法被认为是陶瓷与金属连接最适宜的方法。本文综述了陶瓷与金属扩散连接的研究现状,重点介绍了界面反应研究、残余应力分析和连接工艺研究等内容,并在此基础上指出了研究中所存在的问题。     

Role of temperature gradient in liquid／solid phase solution-diffusion bonding

The liquid-film solution-diffusion bonding of ZCuBe2. 5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time decreases and the interlace migration velocity increases remarkably. The appropriate temperature gradient is 5 -40 K/cm. Under fixed bonding time, the thickness of diffusion layer increases with the increase of temperature gradient, and this tendency becomes more remarkable with the prolonging of bonding time.