水性聚氨酯电导率与聚沉值的研究

研究了软（硬）段含羧基的水性阴离子纳米聚氨酯体系的n(NCO)/n(OH)比值，COOH的质量分类，反离子各类，合成方法与电导率关系及产生的原因；探讨了该体系的n(NCO)/n(OH)值，COOH的质量分数，合成方法与临界聚沉值（Cc.c)的关系和规律。并分析，比较了软（硬）段含羧基的水性阴离子聚氨酯体系电导率与Cc.c二者关系，得出了随COOH的质量分数升高，二者变化相同，随n(NCO)/n(OH)比值升高,二者变化相反的结论。     

纳米4-H碳化硅薄膜的掺杂现象

对纳米晶SiC薄膜进行了P和B的掺杂,B掺杂效率比P高,其暗电导预前因子与激活能遵守Meyer-Neldel规则,并有反转Meyer-Neldel规则出现.掺杂效率比非晶态碳化硅薄膜高是纳米碳化硅薄膜的特点之一.非晶态中的隧穿和边界透射对输运有一定贡献.     

Stability of Standard Electrolytic Conductivity Solutions in Glass Containers

The stability of solutions having an electrolytic conductivity, κ, of 5 μS/cm to 100 000 μS/cm packaged in glass screw-cap bottles, glass serum bottles, and glass ampoules was monitored for 1 year to 2 years. The conductivity was determined by measuring the ac resistance of the solution. Mass loss was also monitored for solutions packaged in bottles. The solutions were prepared using KCl in water (κ ≥100 μS/cm) or KCl in 30 % (by mass) n-propanol 70 % (by mass) water (κ ≤ 15 μS/cm). The conductivity changes were compared by packaging type and by nominal κ. The main causes of the κ changes are evaporation (screw-cap bottles) and leaching (screw-cap bottles, serum bottles, and ampoules). Evaporation is determined from mass loss data; leaching occurs from the glass container with no change in mass. The choice of optimal packaging, which depends on the conductivity level, is the packaging in which κ changes the least with time. Ampoules are the most suitable packaging for standards having nominal κ values of 500 μS/cm to 100 000 μS/cm. Screw-cap bottles are most suitable for standards having a nominal κ of 5 μS/cm to 100 μS/cm.     

Development of High Thermal Conductivity Aluminum Nitride Ceramic

AIN ceramics with densities varying from 3.18 to 3.30 g/cm³ and room-temperature thermal conductivities varying from 88 to 193 W/m K were produced. Different sintering conditions, packing powders, AIN powder sources, carbon additive, and sintering times were evaluated, and the key processing parameters which cause the differences in density and thermal conductivity were identified. SEM, TEM, and EDS were used to characterize the correlation between thermal conductivity, microstructure, and processing parameters. The important parameters which control the thermal conductivity of AIN ceramics are discussed.     

聚氧化乙烯—聚磷酸钠共混物的钠离子导电性

研究了聚氧化乙烯-聚磷酸钠共混物的钠离子导电性和低分子量多缩乙二醇对共混物导电性的改进作用。结果表明,降低多缩乙二醇的分子量以及增加其含量都有利于提高共混物的离子导电率。增塑剂改进共混物导电性的实质是提高共混物的非晶相含量,共混物内钠离子传导发生在非晶区,聚合物链段运动是离子传导的主要推动力。     

Effect of doping polyacrylic acid with some dopants as studied by different techniques

The molecular weight of polyacrylic acid (PAA) was determined by a viscometric method using NaNO₃ as solvent at 30°C. The specific electric conductivities (σ) of PAA as well as PAA doped with carbon black (CB), chromium oxide (Cr₂O₃), and cupferron with different concentrations (from 0.25 to 1 wt %) were measured at a temperature range 360–400 K. IR spectra of some polymers were determined and it was shown that when PAA was doped with 0.5 wt % CB, a C? O? C band appeared at 775–875 cm^?1. The positron annihilation lifetime (PAL) spectra in PAA doped with the above‐mentioned dopants were measured as a function of their concentrations. It was observed that the short lifetime intensity I₁ decreased, whereas the intermediate lifetime intensity I₂, which is related to the conductivity of the material, increased with increasing the wt % of Cr₂O₃ and cupferron as well as at low concentrations of CB. These results are discussed in terms of the conducting island model. It was found that there were distinct positive relationships between σ and I₂. © 2002 John Wiley & Sons, Inc. J Appl Polym Sci 84: 877–883, 2002; DOI 10.1002/app.10381     

Halogen-induced charge transfer polymerization of pyrrole in aqueous media

Simultaneous polymerization and doping of pyrrole have been carried out in the presence of a halogenic electron acceptor, bromine (Br₂) or iodine (I₂), in aqueous dispersion or in a two-phase solvent system. The morphology of the polypyrrole (PPY) so produced is granular and porous. The electrical conductivity of the PPY-I₂ charge transfer (CT) complex is of the order of 10¹ ohm⁻¹ cm⁻¹ while that of the PPY-Br₂ complex is about one order of magnitude less. Both complexes are stable in the atmosphere. The physicochemical properties of the PPY-I₂ and PPY-Br₂ CT complexes prepared under various experimental conditions are examined in detail.     

交联型聚醚聚氨酯的表征、力学性能及其碱金属盐络合物的导电性能

采用三羟甲基丙烷（ＴＭＰ）作交联剂与聚乙二醇（ＰＥＯ－１５４０）和甲苯二异氰酸酯（ＴＤＩ）反应，得到了具有较好力学性能的交联型聚醚聚氨酯（ＰＥＵ），该聚合物与ＬｉＣｌＯ４的结合物具有较高的室温电导率（σ３０℃＝１．８７×１０￣（－４）Ｓ／ｃｍ）。采用全反射红外光谱（ＡＴＲ－ＩＲ）对聚合物的结构进行了表征。对聚合物的组成、不同ＴＤＩ类型及络合盐浓度对聚合物力学性能及其络合物电导率的影响进行了探讨。低度交联聚合物的络合物，其电导率与温度的关系符合建立在自由体积理论上的ＶＴＦ方程，表明络合物中离子的传导主要是在无定形区域进行，与自由体积有关。     

Application of SiC-Si functionally gradient material to thermoelectric energy conversion device

Because of its high–temperature chemical stability, SiC ceramic is a promising material for high-temperature device applications such as thermoelectric energy converters. However, the electrical conductivity of SiC ceramic is too low for it to be used as a thermoelectric energy converter at the cold junction. Therefore, we propose a SiC-Si functionally gradient material (FGM) in order to improve the electrical conductivity of the SiC ceramic at the cold junction. An SiC rod was fired in a temperature gradient furnace. One end of the SiC rod was maintained at 2473 K and the other end was maintained at 1973 K for 30 min. After firing, the porous SiC edge fired at 1973 K was dipped into molten Si in order to infiltrate molten Si into the porous SiC. The microstructure of the FGM is classified into three regions: the SiC-Si composite material; the porous SiC ceramic; and the densified SiC ceramic. The electrical conductivity, the Seebeck coefficient and the thermal conductivity for each region of SiC-Si FGM was measured at 300 K; a figure of merit was calculated. The figure of merit of the SiC-Si FGM at the cold junction, at room temperature, was 10⁸ times higher than that of a nongradient SiC ceramic.     

添加CaF2-YF3的AlN陶瓷的热导率

用CaF2和YF3做添加剂，在1750℃制备了热导率高于170W/m.K的的AlN陶瓷，并用XRD和SEM研究了AlN陶瓷在烧结过程中的相组成，微结构以及晶格参数的变化，并讨论了其对热导率的影响，研究发现，当使用CaF2-YF3做添加剂时，微结构差异对AlN陶瓷热导率的影响很小，AlN陶瓷的热导率主要由AlN晶格氧缺陷浓度决定，由于CaF2-YF3能有效降低AlN颗粒表面的氧含量，从而有利于获得高的热导率。