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61.
B. Stypuła J. Banaś M. Starowicz H. Krawiec A. Bernasik A. Janas 《Journal of Applied Electrochemistry》2006,36(12):1407-1414
The anodic behaviour of copper was investigated in ethanol solution containing LiClO4, LiCl electrolyte and water. The type of electrolyte and the water content influences the mechanism of the anodic process and the formation of anodic products. In LiClO4 electrolyte the dissolution of copper is related to the oxidation of Cu(I) to Cu(II). In solutions of LiCl the etching of copper begins with the creation of soluble complexes of Cu(I) with chloride ions and solvent molecules. At potentials above 0.4 V the formation of alkoxides was observed in both solutions, characterized by a yellow tint. On the other hand, above 0.8 V (i.e. above the equilibrium potential of alcohol oxidation) copper dissolution is accompanied by the formation of a blue colloidal suspension of Cu (II) copper salt. Anodic etching of copper in solutions containing 3% H2O at potentials higher than 0.4 V leads to the formation of colloidal suspension of copper oxide nanoparticles. 相似文献
62.
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64.
G. Petkova E. Sokolova S. Raicheva P. Ivanov 《Journal of Applied Electrochemistry》1998,28(10):1067-1071
The inhibition effect of gamma-pyrodiphenone (PD) on copper corrosion in near neutral sulphate solutions was investigated. Weight loss and polarization measurements show a high inhibition efficiency (>96%) of PD on copper corrosion at extremely low concentrations. PD suppresses active copper dissolution and oxygen reduction. The potentiodynamic cathodic reduction measurements showed an inhibition of oxide formation and stabilization of the Cu2O oxide in the presence of PD. XPS measurements suggested that the high inhibition effect of PD on copper corrosion is due to the adsorption of PD molecules, as a first stage, and the formation of a film with a polymer-like structure by coordination of PD with Cu2O on prolonged exposure. 相似文献
65.
滴定分析法测定铜的改进 总被引:1,自引:0,他引:1
提出在NH4HF2介质中,有SCNˉ存在下,以Iˉ3—淀粉为指示剂,硫代硫酸钠滴定铜的分析方法 相似文献
66.
Constant L. Ruiz P. Abel M. Robach Y. Porte L. Bertolini J.C. 《Topics in Catalysis》2000,14(1-4):125-129
The catalytic properties, with respect to the 1,3-butadiene hydrogenation reaction, of strained Pd films on Cu(110) (lattice mismatch 8%) has been probed as a function of the film thickness. The characterization of the adlayer has been made by the combined use of STM with LEED and AES. For deposits below 1015 Pd/cm2 (i.e., about 1 ML) the catalytic activity is near zero. This is the consequence of the formation of a Pd–Cu surface alloy with tendency for Cu to migrate/segregate to the surface. The catalytic activity suddenly increases to reach a maximum value for about 3 ML; the activity is then one order of magnitude higher than that of the pure Pd(110) surface. This is the consequence of the presence of a strained Pd overlayer, with Pd surface atoms having very unusual geometry, and hence very peculiar electronic and chemical properties. The catalytic activity then decreases as the Pd coverage is increased, and tends to values near that of the pure Pd(110). Gradual relaxation of the film geometry towards that of the normal fcc Pd structure probably exists. 相似文献
67.
The electrochemical behaviour of copper has been investigated in different cupric complex solutions by cyclic voltammetry. In pyridinic and picolinic solutions the reduction of cupric complex occurred in two stages leading to Cu(I) and Cu(0), respectively. The electrodeposited copper is oxidized in two steps leading to Cu(I) and Cu(II) as in ammoniacal cupric complex solutions. In glycine, alanine, sulfamic acid and ethylenediamine solutions, the cuprous complex is an intermediate in the cupric complex reduction but it is not detected during the oxidation of the electrodeposited copper in these solutions. In EDTA and triethanolamine solutions, the cuprous complex is not observed. The rate of copper etching was determined in pyridinic and ammoniacal cupric solutions and was shown to be faster in ammoniacal cupric solutions than in the pyridinic solutions. 相似文献
68.
The effect of dissolved oxygen on the rate of chemical etching of copper by acidic cuprous chloride solution was investigated numerically for the case of a rotating disc electrode (RDE). Copper dissolution in aerated acidic cupric chloride solutions of composition 3.5M CuCl2 + 0.5M HCl + 0.5M KCl and 3.5M CuCl2+0.5M HCl was investigated with consideration of the instantaneous homogeneous reaction 4CuCl32-+4H++O2rlhar4CuCl 3-+2H2O which takes place within the mass transport boundary layer. It was assumed that CuCl32- and O2 react instantaneously, resulting in the formation of a reaction plane which separated the mass transport boundary layer into two regions: a region adjacent to the electrode where oxygen was depleted, and a region adjacent to the bulk where CuCl32- was absent. A one-dimensional mathematical model was developed to predict the position of the reaction plane. The model accounted for diffusion, migration and fluid flow generated by an RDE and included nine species and five heterogeneous electrochemical reactions. The homogeneous redox reaction served to regenerate the chemical etchant solution and thus enhance the etch rate. With increasing oxygen concentration and rotation rate the reaction plane was found to move closer toward the electrode and thus the etch rate of copper increased. Addition of KCl increased the Cl- content in solution so as to shift the reaction plane toward the bulk. 相似文献
69.
The galvanostatic technique on a laboratory scale has been shown to be a useful tool in detecting the presence of nodules on the cathode during copper electrodeposition by using the value of the starting electrolytic potential and by the presence of a cathodic polarization peak on the potential–time curve. Studying the morphology of the deposit with a scanning electron microscope at various magnifications confirmed the galvanostatic results. It is postulated that inappropriate concentrations and/or ratios of the additives (thiourea, gelatin and chloride ions) are associated with a certain current density that generates intergranular microcracks due to adsorption of the additives and leads to the formation of nodules at the macroscale. 相似文献
70.