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101.
Specular X-ray reflectivity from SiO2 thin films prepared on silicon substrates by plasma-enhanced chemical vapor deposition showed the films to have a characteristic width of the decay in density at the free surface of 17 Å, to be about three-quarters the density of -quartz, and to have an interfacial layer at the silicon interface that was of the order of 100 Å wide and less dense than the bulk of the film. After chemical-mechanical polishing the characteristic width of the decay in density at the free surface was reduced to 10 Å; furthermore, the near-surface region to a depth of 30 Å had a greater density than the as-deposited film. Off-specular reflectivity confirmed that the decrease in characteristic width at the free surface was due to reduced roughness upon polishing and also revealed that the lateral correlation length in the limit of long wavelengths was the same for both polished and unpolished samples. The compression of the near-surface region during polishing is believed to enhance the dissolution of SiO2 into the slurry which is necessary to achieve smooth surfaces. 相似文献
102.
Veena Misra Xiaoli Xu Brian E. Hornung Richard T. Kuehn Donald S. Miles John R. Hauser Jimmie J. Wortman 《Journal of Electronic Materials》1996,25(3):527-535
In the present study, we have performed electrical characterization of oxides deposited via rapid thermal chemical vapor deposition using SiH4 and N2O. We have investigated the effect of temperature, pressure, and SiH4 to N2O ratio on the electrical and material properties of as-deposited films. We have found that as-deposited oxides deposited at low temperatures, low pressures, and with a low silane to nitrous oxide ratio of ~0.5% give good material and electrical properties. The as-deposited films are stoichiometric in nature and have high deposition rates. As-deposited films had very low Dit values, high breakdown fields, and excellent subthreshold swing. The leakage currents and metal oxide semiconductor field effect transistor current drive, although lower than thermal oxides, were found to be quite acceptable. We have also investigated the thickness dependence of the films and found that as the film thickness is reduced below 50Å, the reliability improves for all oxides including the silicon-rich deposited oxides. 相似文献
103.
104.
R. Niebuhr K. H. Bachem U. Kaufmann M. Maier C. Merz B. Santic P. Schlotter H. Jürgensen 《Journal of Electronic Materials》1997,26(10):1127-1130
Oxygen doped GaN has been grown by metalorganic chemical vapor deposition using N2O as oxygen dopant source. The layers were deposited on 2″ sapphire substrates from trimethylgallium and especially dried
ammonia using nitrogen (N2) as carrier gas. Prior to the growth of the films, an AIN nucleation layer with a thickness of about 300? was grown using
trimethylaluminum. The films were deposited at 1085°C at a growth rate of 1.0 μm/h and showed a specular, mirrorlike surface.
Not intentionally doped layers have high resistivity (>20 kW/square). The gas phase concentration of the N2O was varied between 25 and 400 ppm with respect to the total gas volume. The doped layers were n-type with carrier concentrations
in the range of 4×1016 cm−3 to 4×1018 cm−3 as measured by Hall effect. The observed carrier concentration increased with increasing N2O concentration. Low temperature photoluminescence experiments performed on the doped layers revealed besides free A and B
exciton emission an exciton bound to a shallow donor. With increasing N2O concentration in the gas phase, the intensity of the donor bound exciton increased relative to that of the free excitons.
These observations indicate that oxygen behaves as a shallow donor in GaN. This interpretation is supported by covalent radius
and electronegativity arguments. 相似文献
105.
F.A Harraz 《Electrochimica acta》2002,47(8):1249-1257
The effect of chloride ions (Cl−) during the immersion plating of copper onto porous silicon (PS) from a methanol (MeOH) solution has been studied. The presence of Cl− in the Cu2+ solution was found to slow down the rate of copper deposition, as confirmed by inductively coupled argon plasma emission spectroscopy and X-ray photoelectron spectroscopy measurements. The threshold concentration of Cl− at which the deposition of copper is very severely diminished was found to be 0.1 M. The inhibition effect is discussed on the basis of the rest potential values of PS and polarization curve measurements. They revealed that the rest potential of PS upon dipping in these solutions appears to direct the metal deposition. Current density-potential curves show that at Cl− concentrations higher than 0.1 M, the reduction of Cu ions proceeds in two steps; the reduction of Cu(II) to Cu(I) followed by the reduction of Cu(I) to Cu(0). This suggests that Cu(I) species in MeOH solution can be stable over a certain potential range and this stability of Cu(I) is responsible for the inhibition of metal deposition. Fourier transform infrared spectroscopy and scanning electron microscopy (SEM) were also performed to investigate the structural changes and characterizations of PS samples after the plating process. 相似文献
106.
应用铟源的反应蒸发制备In2O3透明导电膜 总被引:3,自引:0,他引:3
本工作说明,在低压氧气氛中。应用铟源的反应蒸发很容易淀积高质量的In2O3透明导电膜.旦然没有使用锡杂质,但所得膜的性能可以和最好的掺锡的In2O3膜相比.膜电阻率达2~3×10 ̄4Ω·cm,可见光透过率超过90%,并且膜生长速率高达219/min.文章对成膜过程作了分析,报道了膜的最佳淀积条件,对由于偏离最佳淀积参数而导致的异常膜的形成机制也进行了讨论. 相似文献
107.
Journal of Electronic Materials - Low pressure chemical vapor deposition (LPCVD) of tungsten (W) by SiH4 reduction of WF6 on Si(100) surfaces was studied in a single-wafer, cold-wall reactor over a... 相似文献
108.
H. Ebe T. Okamoto H. Nishino T. Saito Y. Nishijima M. Uchikoshi M. Nagashima H. Wada 《Journal of Electronic Materials》1996,25(8):1358-1361
CdTe epilayers were grown directly on (100), (211), and (111) silicon substrates by metalorganic chemical vapor deposition
(MOCVD). The crystallinity and the growth orientation of the CdTe film were dependent on the surface treatment of the Si substrate.
The surface treatment consisted of exposure of the Si surface to diethyltelluride (DETe) at temperatures over 600°C prior
to CdTe growth. Direct growth of CdTe on (100) Si produced polycrystalline films whereas (lll)B single crystals grew when
Si was exposed to DETe prior to CdTe growth. On (211) Si, single crystal films with (133)A orientation was obtained when grown
directly; but produced films with (211)A orientation when the Si surface was exposed to DETe. On the other hand, only (lll)A
CdTe films were possible on (111) Si, both with and without Te source exposure, although twinning was increased after exposure.
The results indicate that the exposure to a Te-source changes the initial growth stage significantly, except for the growth
on (111) Si. We propose a model in which a Te atom replaces a Si atom that is bound to two Si atoms. 相似文献
109.
110.
T. Kawakami Y. Koide N. Teraguchi Y. Tomomura A. Suzuki Masanori Murakami 《Journal of Electronic Materials》1998,27(8):929-935
In order to prepare low resistance ohmic contacts to p-ZnSn by the “deposition and annealing (DA)” technique which has been
extensively used for GaAs and Si-based devices, formation of a heavily doped layer by the p-ZnSe/metal reaction is required.
For p-ZnSe/Ni contacts, Ni and Se reacted preferentially at the ZnSe/Ni interface upon annealing at temperatures higher than
250°C. However, capacitance-voltage measurements showed that the net acceptor concentration (NA-ND) close to the p-ZnSe/Ni interface was reduced upon the Ni/ZnSe reaction, resulting in high contact resistance. For p-ZnSe/Au
contacts, neither Au/ZnSe reaction nor reduction of the acceptor concentration were observed after annealing at temperatures
lower than 300°C. This indicates that although the metal/p-ZnSe reaction is mandatory to prepare a heavily doped layer, the
reaction induced an increase in the compensation donors in the p-ZnSe substrate. In order to increase the acceptor concentration
in the vicinity of the p-ZnSe/metal interface through diffusion from the contact materials, Li or O which was reported to
play the role of an acceptor in ZnSe was deposited with a contact metal and annealed at elevated temperatures. Ni or Ag was
selected as the contact metal, because these metals were expected to enhance Li or O doping by reacting with ZnSe. However,
the current density-voltage characteristics of the Li(N)/Ni and Ag(O) contacts exhibited rectifying behavior, and the contact
resistances increased with increasing annealing temperature. The present results indicated that, even though the acceptor
concentration in the p-ZnSe substrate increased by diffusion of the dopants from the contact elements, an increment of the
compensation donors was larger than that of the acceptors. The present experiments indicated that preparation of low resistance
ohmic contacts by forming a heavily doped intermediate layer between p-ZnSe and metal is extremely difficult by the DA technique. 相似文献