金刚石圆锯片节块几何形状对磨损机理的影响

本文对目前石材加工领域广泛使用的具有几种典型节块结构的金刚石圆锯片的磨损机理进行了一些分析。讨论了节块几何形状和排列方式对锯片磨损的影响程度,并比较了从外观结构出发制造中凹与单纯从配方的角度制造中凹的优缺点。最后从切削加工的角度对改进金刚石圆锯片的质量提出了一些建议。     

Preparation of flee-standing diamond films for high frequency SAW devices

Free-standing diamond films were prepared by hot filament chemical vapor deposition （HFCVD） method under different conditions. Inter-digital transducers （IDTs） were formed on the nucleation sides of free-standing diamond films by photolithography technique. Then piezoelectric ZnO films were deposited by radio-frequency（RF） reactive magnetron sputtering to obtain the ZnO/diamond film structures. Surface morphologies of the nucleation sides and the IDTs were characterized by means of scanning electron microscopy （SEM）, atomic force microscope （AFM） and optical microscopy. The results indicate that the surfaces of nucleation sides are very smooth and the IDTs are of high quality without discontinuity and short circuit phenomenon. Raman spectra show the sharp diamond feature peak at about 1 334 cmI and the small amount of non-diamond carbon in the nucleation side. X-ray diffraction （XRD） patterns of the structure of ZnO/diamond films show a strong diffraction peak of ZnO （002）, which indicates that as-sputtered ZnO films are highly c-axis oriented.     

镀附钛、钼、钨金刚石与铜基合金结合剂工具的结构性能研究

为了实现金刚石与金属结合剂间的冶金结合,本文用镀Ti、Mo、W的金刚石与含Ni、Co的铜基合金结合剂制成了刀头,通过切割试验和抗折试验,研究了其强度特征和切割性能,并用X射线、扫描电镜和能谱分析对镀层和金刚石、结合剂之间的作用进行了微观分析。结果表明:Ti、Mo、W镀层一方面与金刚石发生界面化学反应形成相应的碳化物,另一方面又与金属结合剂形成化学键合并部分溶入结合剂液相中。这样,由Ti、Mo、W镀层的中介作用实现了铜基金属结合剂与金刚石之间的冶金结合,使金刚石工具的性能大幅度提高。     

Machining characteristics and fracture morphologies in a copper-beryllium (Cu-2Be) alloy

The technology of materials removal is improved greatly by the introduction of advanced cutting tools like cubic boron nitride, ceramics, polycrystalline diamond and the more recent whisker-reinforced materials. In this paper, the influence of cutting temperature on machinability, mechanical properties, microstructure, and fracture morphology of Cu-2Be alloy using a polycrystalline diamond cutter is investigated. The information on machining, microstructure, and fracture morphology of Cu-2Be alloy are very useful to understand their fabrication characteristics and the basic mechanisms of its deformation and fracture. The machinability (in terms of surface finish) of Cu-2Be alloy is evaluated as a function of cutting temperature, resulting from wet and dry cutting. Machining is carried out on a Hardinge Cobra 42 CNC machine (Hardinge Inc., Elmira, NY), and the machining parameters used—cutting speed, depth of cut, and feed rate—are kept constant during both wet and dry cutting. The machined surface finish on Cu-2Be alloy is measured using a surface finish analyzer (Surftest 401, series 178) technique. The machined specimens are examined for their strength and hardness properties using a standard Universal Testing Machine and Rockwell hardness tester, respectively. Wet cutting (using coolants) produced a smooth surface finish when compared with dry cutting of the Cu-2Be alloy. The machined specimens are examined for their microstructural features using a Nikon optical microscope. The specimens are etched using a suitable etchant solution for revealing such microstructure constituents as grain size, phase proportions, and the possible overheated areas (especially in dry cutting). The fractured surfaces from the tensile and impact toughness tests are investigated for their fracture morphologies (dry and wet cutting) using a microprocessor-controlled scanning electron microscope (Jeol Model JSM 5910 LV). A detailed analysis is also made to understand and interpret the basic fracture mechanisms responsible for crack initiation and crack propagation. The Cu-2Be alloy showed relatively higher mechanical properties in wet cutting in comparison to dry cutting operations. Fracture studies demonstrated intergranular and ductile fractures as dominant modes of fracture mechanisms in Cu-2Be alloy.     

自锐性金刚石树脂砂轮磨削性能的研究

本文通过对比磨削试验，研究了自锐性金刚石(CSD)树脂砂轮的磨削性能。试验结果表明，由于CSD形状小规则，有许多凹入角和粗糙表面，树脂结合剂对CSD的把持力较普通金刚石强，所以在磨削各参数相同的条件下，自锐性金刚石砂轮与普通金刚石砂轮相比，其磨削比提高60％以上。且由于CSD的内部为许多单个亚晶粒所组成的镶嵌的颗粒，因此在应力作用下，只有很小的不规则的碎片崩掉，从而在每个颗粒的表面上留下许多新的小切削刃，故其加工工件的表面粗糙度值较低。     

添加剂硼对纯铁粉末触媒合成金刚石的影响

本义研究了添加剂硼对纯铁粉末触媒合成金刚石的影响。实验中将不同比例的无定形硼粉直接添加到石墨-纯铁粉末体系中并均匀混合，以此方式，将硼掺杂到高温高压合成的金刚石单晶中。实验结果表明，随硼添加比例的不同，合成金刚石的最低压力点也不同；同时，通过不同添加比例的硼合成出金刚石的颜色，可得知该方法对提高金刚石内硼含醚的有效性。实验还发现，当硼添加比例一定时，合成温度对合成金刚石的特性产生了一系列的影响。     

金刚石砂轮和CBN砂轮修整廓形误差的理论和实验研究

用ＧＣ杯形砂轮修整金刚石砂轮和ＣＢＮ砂轮，是一种有效的修整方法，但这种修整方法的修整成形机理和被修整砂轮的廓形精度分析亟待解决。本文提出了新的基于微分学的修整分析模型，导出了不同修整参数下的修整廓形数学表达式，从而阐明了修整误差产生的原因，提出了修整误差定量计算分析的方法，并指导实验取得了在１７ｍｍ宽的砂轮廓形线上直线性误差仅为１ｕｍ的修整结果。     

单源低能离子束辅助沉积类金刚石薄膜结构及性能研究

用单源低能氩离子束辅助沉积（ＩＢＡＤ）法制备了非晶碳薄膜．氩离子能量为４００－１５００ｅＶ．膜面光滑致密，与衬底的结合力较高。用Ｒａｍａｎ，ＦＴＩＲ，ＨＲＴＥＭ，ＴＥＤ，ＳＥＭ，ＥＲＤ及ＲＢＳ研究了薄膜的形貌、结构和组分，测量了膜的电阻率、显微硬度及摩擦系数．薄膜为无定形的类金刚石（ＤＬＣ）．其中含氢约为２０５ａｔ．－％，碳原子与氢原子几乎没有形成Ｃ－Ｈ键．随着离子束能量及束流的增加，显微硬度、摩擦系数增加，电阻率减小．硬度增加是由于薄膜致密度的增加，而电阻率降低是由于膜中金刚石键（ｓｐ~３键）含量减少的缘故．     

硬质合金金刚石涂层工具基体前处理有效方法探讨

利用两种溶液浸蚀硬质合金表面，分别选择性刻蚀WC和Co.这不仅强粗化了硬质合金表面，而且，还能抑制CO在金刚石沉积过程中的负作用，从,而，提高了金刚石薄膜的质量和涂层的附着力。     

Diamond semiconductor and elastic strain engineering

Diamond,as an ultra-wide bandgap semiconductor,has become a promising candidate for next-generation microelec-tronics and optoelectronics due to its numerous advantages over conventional semiconductors,including ultrahigh carrier mo-bility and thermal conductivity,low thermal expansion coefficient,and ultra-high breakdown voltage,etc.Despite these ex-traordinary properties,diamond also faces various challenges before being practically used in the semiconductor industry.This review begins with a brief summary of previous efforts to model and construct diamond-based high-voltage switching diodes,high-power/high-frequency field-effect transistors,MEMS/NEMS,and devices operating at high temperatures.Following that,we will discuss recent developments to address scalable diamond device applications,emphasizing the synthesis of large-area,high-quality CVD diamond films and difficulties in diamond doping.Lastly,we show potential solutions to modulate diamond’s electronic properties by the“elastic strain engineering”strategy,which sheds light on the future development of diamond-based electronics,photonics and quantum systems.