SiCp/Cu复合材料切削加工性及其加工表面微观结构研究

通过应变测力仪，测量每一组切削用量参数下Cu及SiCp／Cu复合材料的切削力，并用电子显微镜观察分析切削表面的微观结构。研究表明：由于SiC颗粒对位错运动的阻碍，在SiCp／Cu界面处形成位错塞集群，产生应力集中，使SiCp／Cu复合材料切削过程呈典型的脆性分离；切削力随背吃刀量和进给量的增大而增大，随切削速度的增大而减小。     

Effect of the dilation caused by helium bubbles on edge dislocation motion in α-iron: molecular dynamics simulation

Various types of nanometric defects such as voids and helium (He) bubbles produced by high-energy neutron irradiations are known to degrade the mechanical properties of irradiated materials. In this study, we have evaluated the obstacle strength of He bubbles to the mobility of an edge dislocation in α-iron for 2 and 4 nm bubbles with He-to-vacancy (He/V) ratios ranging from 0 to 1 at 300 and 500 K, by molecular dynamics simulation. Results showed that as the He/V ratio increases, the obstacle strength needed for the release of a dislocation from the bubble becomes stronger up to a moderate He/V ratio (0.6 and 0.4 for 2 and 4 nm bubbles, respectively, at both temperatures), and a further increase in the He/V ratio leads to weakening of the obstacle strength. For He/V = 1, the obstacle strengths are 10–30% weaker than those at moderate He/V ratios depending on the bubble size and temperature. The extent of obstacle strength was found to be correlated with the dilation caused by He bubbles depending on the bubble size, He/V ratio, and temperature.     

Impression creep behavior of Al–1.9%Ni–1.6%Mn–1%Mg alloy

In the present study, microstructure and creep behavior of an Al–1.9%Ni–1.6%Mn–1%Mg alloy were studied at temperature ranging from 493 to 513 K and under stresses between 420 and 530 MPa. The creep test was carried out by impression creep technique in which a flat ended cylindrical indenter was impressed on the specimens. The results showed that microstructure of the alloy is composed of primary α(Al) phase covered by a mantle of α(Al)+Ni₃Al intermetallic compound. Mn segregated into Al_xMn_yNi_z or Al₆Mn phases distributed inside the matrix phase. It was found that the stress exponent, n, decreases from 5.2 to 3.6 with increasing temperature. Creep activation energies between 115 kJ/mol and 151 kJ/mol were estimated for the alloy and it decreases with rising stress. According to the stress exponent and creep activation energies, the lattice and pipe diffusion- climb controlled dislocation creep were the dominant creep mechanism.     

盾构隧道纵向结构变形模式及理论模型#br#

盾构隧道在长期运营中极易发生不均匀沉降及纵向结构变形，因而有必要建立隧道纵向结构计算模型，分析隧道纵向变形及内力特征。首先探讨隧道纵向变形模式，将隧道变形归纳为两种模式：①弯曲变形模式；②错台变形模式。其次针对现有纵向结构计算模型进行总结并分析其优缺点，根据模型的简化过程将现有模型归纳为两类：①纵向管片环-接头模型；②纵向等效连续化模型。针对隧道实际剪切错台变形的特点，重点介绍一种基于铁木辛柯梁理论的隧道纵向连续化模型，并通过实例分析其优越性。     

A computational algorithm for catalysts experiencing concentration‐dependent deactivation

Abstract

A computational algorithm is proposed for catalyst pellets or reactors experiencing concentration‐dependent deactivation. In the integration of the deactivation equation in each time interval, the concentration of poison, reactant or/and product is considered to be a constant. The value of concentration is recalculated from the mass balance equation before integrating the deactivation equation. By such an approach, the number of equations is reduced; thus a two‐dimensional problem can be converted to a single‐dimensional one.     

Analysis of cracked layers under transient temperature field

The uncoupled thermoelasticity problem of a homogenous isotropic layer containing a line of temperature discontinuity and a Volterra edge dislocation is solved. The analysis is performed for discontinuity lines with two different directions of parallel and perpendicular to the layer boundary. The solutions for heat flux and stress fields exhibit the familiar Cauchy type singularity. These results are utilized to derive integral equations for the intensity of heat flux and densities of dislocation in a layer weakened by interacting cracks which are parallel and/or perpendicular to the layer boundary. The numerical solution of integral equations is performed and stress intensity factors for cracks are obtained.     

High Hole Mobility of GaSb Relaxed Epilayer Grown on GaAs Substrate by MOCVD through Interfacial Misfit Dislocations Array

The structural property of GaSb epilayers grown on semi-insulator GaAs (001) substrate by metalorganic chemical vapor deposition (MOCVD) using Triethylgallium (TEGa) and trimethylantimony (TMSb),was investigated by variation of the Sb:Ga (V/III) ratio.An optimum V/III ratio of 1.4 was determined in our growth conditions.Using transmission electron microscopy (TEM),we found that there was an interfacial misfit dislocations (IMF) growth mode in our experiment,in which the large misfit strain between epilayer and substrate is relaxed by periodic 90 deg.IMF array at the hetero-epitaxial interface.The rms roughness of a 300 nm-thick GaSb layer is only 2.7 nm in a 10 μm×10 μm scan from atomic force microscopy (AFM) result.The best hole density and mobility of 300 nm GaSb epilayer are 5.27×10 6 cm 3 (1.20×10 6) and 553 cm 2 ·V 1 ·s 1 (2340) at RT (77 K) from Hall measurement,respectively.These results indicate that the IMF growth mode can be used in MOCVD epitaxial technology similar to molecular beam epitaxy (MBE) technology to produce the thinner GaSb layer with low density of dislocations and other defects on GaAs substrate for the application of devices.     

Dislocation slip and twinning in Ni-based L12 type alloys

We report theoretical results on dislocation slip and twinning in Ni₃ (Al, Ti, Ta, Hf) compositions with L1₂ crystal structures utilizing first-principles simulations. The lattice parameters of Ni₃Al, Ni₃Al_0.75Ta_0.25, Ni₃Al_0.5Ta_0.5, Ni₃Ta, Ni₃Ti and Ni₃Al_0.75Hf_0.25 are calculated, and the crystal structures with lower structural energies are determined. We established the Generalized Stacking Fault Energy (GSFE) and Generalized Planar Fault Energy (GPFE), and calculated stacking fault energies APB (anti-phase boundary) and CSF (complex stacking fault) matched other calculations and experiments. Based on the extended Peierls–Nabarro model for slip and the proposed twin nucleation model, we predict slip and twinning stress and the results show a general agreement with available experimental data. The results show that in the studied intermetallic alloys, twinning stress is lower than slip stress; Ta and Hf ternary addition are substantial to increase flow stress in Ni₃Al. The models proposed in the paper provide quantitative understanding and guidelines for selecting optimal precipitate chemistry and composition to obtain higher mechanical strength in Shape Memory Alloys.     

Effects of particle arrangement and particle damage on the mechanical response of metal matrix nanocomposites: A numerical analysis

The spatial distribution of reinforcement particles has a significant effect on the mechanical response and damage evolution of metal matrix composites (MMCs). It is observed that particle clustering leads to higher flow stress, earlier particle damage, as well as lower overall failure strain. In recent years, experimental studies have shown that reducing the size of particles to the nanoscale dramatically increases the mechanical strength of MMCs even at low particle volume fractions. However, the effects of particle distribution and particle damage on the mechanical response of these metal matrix nanocomposites, which may be different from that observed in normal MMCs, has not been widely explored. In this paper, these effects are investigated numerically using plane strain discrete dislocation simulations. The results show that non-clustered random and highly clustered particle arrangements result in the highest and lowest flow stress, respectively. The effect of particle fracture on the overall response of the nanocomposite is also more significant for non-clustered random and mildly clustered particle arrangements, in which particle damage begins earlier and the fraction of damaged particles is higher, compared to regular rectangular and highly clustered arrangements.     

SPD技术对锆及锆合金力学行为影响研究现状

综述了锆及锆合金剧烈塑性变形(SPD)后性能变化的研究进展,系统阐述了锆及锆合金经剧烈塑性变形后显微硬度、拉伸/压缩性能、高低周疲劳性能,重点介绍了SPD技术在纯锆、Zr-Nb系合金中的应用。经过剧烈塑性变形后,锆及锆合金的抗拉强度及屈服强度均显著提升,但依据剧烈塑性成形轨迹、合金成分、第二相分布、热处理制度不同,其提升程度存在一定的差别。位错滑移是锆及锆合金高周疲劳的主要损伤机制,位错运动(包括位错滑移及位错攀移)是锆及锆合金低周疲劳的主要损伤机制。文章最后指出现阶段锆及锆合金SPD技术的发展趋势及应用前景。