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101.
102.
An investigation of crack closure and the propagation of semi-elliptical fatigue cracks in Q1N (HY80) pressure vessel steel 总被引:1,自引:0,他引:1
The results of an experimental investigation of the effect of crack closure on the propagation of semi-elliptical fatigue cracks are presented. Load-shedding fatigue threshold tests were carried out at stress ratios of 0.2, 0.35, 0.5 and 0.7. Crack closure was measured at the surface and depth positions using backface strain gauges, near-tip gauges, and a clip gauge. Differences between the surface and depth growth behaviour are explained by considerations of the effects of the transition from plane stress conditions at the surface to plane strain conditions at the depth. The effects of stress ratios are attributed largely to differences in the crack opening displacement, which result in asperities coming into contact to induce roughness-induced crack closure. 相似文献
103.
Forty-three lines of barley, including ancestral (wild), landraces, Middle Eastern lines, and modern cultivars, were grown under two different sets of environmental conditions. Hordenine production in barley roots was determined at the one-leaf stage by HPLC analysis and, in two lines only, over a period of 35 days. Forty-two of the 43 lines produced significant amounts of hordenine, although there was no variation among groups. Middle Eastern lines had the highest production with 327 µg/g on a dry weight basis. Production was, however, determined more by environmental conditions during growth than by genetic factors. Hordenine production was up to seven times higher in plants grown under lower light intensities. 相似文献
104.
This paper deals with a new boundary element method for analysis of the quasistatic problems in coupled thermoelasticity. Through some mathematical manipulation of the Navier equation in elasticity, the heat conduction equation is transformed into a simpler form, similar to the uncoupled-type equation with the modified thermal conductivity which shows the coupling effects. This procedure enables us to treat the coupled thermoelastic problems as an uncoupled one, A few examples are computed by the proposed BEM, and the results obtained are compared with the analytical ones available in the literature, whereby the accuracy and versatility of the proposed method are demonstrated. 相似文献
105.
S. H. Ahmad 《Polymer International》1992,28(4):291-294
Measurement of the flow stress of high density polyethylene (HDPE) and nylon 66 at strain rates of 103 s?1 using a split Hopkinson pressure bar technique is discussed. The flow stress at a strain of 10% has been determined for both polymers at 20°C. The intrinsic errors involved in this technique are briefly reviewed. The results indicate that the flow stress of HDPE and nylon 66 were 50MPa and 150MPa, respectively, at strain rates of about 103s?1. 相似文献
106.
Takashi Ishikawa Sunao Sugimoto Masamichi Matsushima Yoichi Hayashi 《Composites Science and Technology》1995,55(4):349-363
Compression-after-impact (CAI) tests have been conducted for quasi-isotropic thick plates with 48 plies by using the NASA method and on plates with 32 plies by using the SACMA method. Specimens are made of CF/PEEK (APC-2) and conventional CF/epoxy for the NASA plates and CF/epoxy for the SACMA plates. In the NASA CAI tests, the sequence of delamination buckling and its propagation is clearly revealed through various experimental techniques. One major technique is moiré topography, and the other is thermo-mechanical stress analysis with a high-accuracy infrared sensor. The arrest of delamination propagation just before catastrophic failure due to high fracture toughness is clearly captured by the moiré camera. This behavior provides good CAI values of CF/PEEK. The initial buckling properties of the delaminated region by the impact are then extensively discussed. Numerical predictions of initial buckling stress have been obtained by modelled geometry of the delaminated region simplified from its precise structure clarified by ultrasonic C-scanning. They agree fairly well with the experimental results. The in-plane stress distribution in the delaminated region before initial buckling is measured by an infrared stress graphic system. This compared favorably with finite element predictions. Two types of symmetric buckling modes with respect to the central plate surface, twin and single peak ones, are experimentally captured. 相似文献
107.
T. MANN B. W. TVEITEN G. HÄRKEGÅRD 《Fatigue & Fracture of Engineering Materials & Structures》2006,29(2):113-122
The fatigue life of a welded aluminium T‐joint made from beams with rectangular hollow section (RHS) has been predicted using a crack propagation analysis and compared with experimental results from joints with different residual stress levels. To include the effect of the residual stresses, the stress ratio was calculated at the weld toe and, via Walker's equation, introduced into the analysis. How to obtain the Walker exponent has been discussed in detail. The introduction of a stress ratio at the weld toe provides good agreement between the experimentally and analytically found S–N curves. The effect of the residual stress was successfully included in the analysis. 相似文献
108.
The technology of trailing peening is a kind of promisingly bran-new technology which can be used to control weldingstress and distortion of Ti alloy thin plate. Control of TC4 Ti alloy thn plate welding stress and distortion underthe condition of convent 相似文献
109.
主要论述了采用图像边缘检测和图像跟踪算法对采集的关节镜图像进行图像处理和分析的过程。在图像处理的基础上,系统自动测量出指定目标的形状参数,实现了系统的测量要求。本研究为实现关节镜手术过程图像的保存和手术的准确性提供了可行的方法。 相似文献
110.
Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints.
IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported
that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method
can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to
study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni
immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening
the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress. 相似文献