Shear analysis of rice husk ash (RHA) reinforced tin-0.7-copper composite solders on electroless nickel/immersion silver (ENIAg) surfaces

In this study, the mechanical performance of the rice husk ash-reinforced tin-0.7 copper composite solder was investigated. 0.01 wt.%, 0.05 wt.% and 0.1 wt.% of rice husk ash (RHA) were added to the solder matrix to prepare the composite solders. In order, to replace the costly electroless nickel immersion gold surface finish on the copper substrate, the effect of electroless nickel immersion silver (ENIAg) as the surface finish was studied. The differential scanning calorimetry (DSC) analysis showed that the composite solder exhibited lower melting temperature relative to the plain solder owing to the inclusion of rice husk ash. Shear strength analysis was carried out to investigate the influence of rice husk ash and electroless nickel immersion silver surface finish on the shear strength of the developed composite solders. The results proved that the rice husk ash failed to enhance the shear strength of tin-0.7 copper lead-free solder with the plain solder exhibiting the highest shear strength.     

工业气氛下电流场辅助Ni-ZrO2陶瓷扩散焊

目的 研究电流驱动下金属Ni向ZrO2陶瓷的定向扩散以及界面化学反应,实现两者在工业气氛下的快速连接。方法 在1 200 ℃下采用独特的电流场耦合扩散焊连接系统制备Ni-ZrO2扩散偶样品。利用扫描电子显微镜(SEM)、能谱仪(EDS)对不同直流电参数(电流密度0~5.09 mA/mm²)下制备的样品界面焊缝形貌以及原子分布进行观察和解析;测试Ni-ZrO2扩散偶的剪切强度,并结合不同样品的界面微观结构演变初步揭示电流场辅助Ni-ZrO2的连接机制。结果 电流场有效地促进了工业气氛下金属-陶瓷界面的交互作用,当电子流由金属Ni指向ZrO2陶瓷时,界面反应层厚度随着电流密度的增大而持续增大;样品接头的连接强度随着电流强度的增大呈先升高后降低的趋势,在1 200 ℃下通电(电流密度为3.82 mA/mm²)5 min时得到最佳剪切强度164 MPa。结论 施加直流电场引发的金属电迁移效应和固体电解质陶瓷中氧离子的定向运动是促进界面互扩散以及化学反应的重要原因,而局部的过度“失氧”容易导致陶瓷结构和功能特性丧失。与高真空环境相比,在工业气氛下界面附近较高的氧浓度抑制了陶瓷变质,使焊接接头在电流强度较大时仍然保持了较高的剪切强度。     

浅析高冰镍氯气浸出制取镍电解初液

氯气浸出工艺是当前世界上先进的高镍锍精炼工艺之一,在镍的回收率、生产率、产品质量及工作环境等方面具有较突出的优势.氯化湿法冶金由于具有高反应速率、高浸出率、以及灵活的金属提取工艺组合等优点,成为一项重要的湿法冶金新技术,以往制备镍电解初液的工艺都采用硫酸常压选择性浸出-加压浸出工艺,这样的工艺具有浸出效率低、工艺设备复杂、流程长、作业强度高、生产成本高等缺点.为了解决这些不利的因素,现在学者都在探索氯化浸出工艺替代硫酸选择性浸出工艺.本文就氯气浸出生产镍电解初液的工艺原理、试验过程、试验结果及其优点进行了充分的阐述.     

广西钴镍锰矿的湿法冶金

广西钴镍锰矿资源丰富，可采用低成本的湿法冶金技术处理。某钴镍锰矿石加热、酸浸，钴、镍、锰浸出率达98％以上，用常规的硫化钠沉钴、镍，次氯酸钠分离钴、镍，最终获取钴镍锰盐。     

A Granular Inorganic Cation-Exchanger Selective to Cesium

The investigation results on the structure, sorptive-selective properties and exchange reversibility of the adsorbent selective to cesium cations are presented in this paper. A trade mark of this adsorbent is Termoxid-35. The composition of Termoxid-35 is the “mixed” nickel ferrocyanide distributed over zirconium hydroxide as an inorganic carrier. The structure of the cation-exchanger was studied by the infrared spectroscopy and the X-ray diffraction, differential-thermal and thermo-gravimetric analyses. The adsorbent is the double-phase system consisting of a highly-dispersed amorphous phase of zirconium hydroxide and a micro-crystalline phase of mixed nickel ferrocyanide. The isotherms of cesium cation adsorption in the pH region of 6.2 to 9.6 in the presence of 1 mol/l NaCl are presented. The distribution coefficient for cesium in the Henry region increases with the pH of the solution and reaches 6.5 x 10⁵ cm³/g at pH = 9:6. The distribution coefficient for cesium is more than 1.0 x 10⁴ cm³/g with the concentration of the cation in the solid phase of 0.1 mmol/g. The cesium cation sorption on the ion-exchanger is irreversible.     

Ausmelt炉镍熔炼合理渣型的研究

金川集团公司沉降电炉弃渣有价金属含量高且熔化温度高。采用SEM-EDS与XRD确定了镍和铜在渣中的主要损失形式为夹杂或悬浮。测定了以Ausmelt熔炼渣为基础的半合成渣的熔化温度,研究了Fe/SiO2及CaO含量对半合成渣熔化温度的影响。结果表明,当Fe/SiO2=0.9～1.0且CaO含量为6%～10%时,渣的熔化温度明显降低,为Ausmelt炉镍熔炼工艺参数的优化提供参考。     

我国NiBR催化聚合技术发展的分析

总结燕化公司合成橡胶了ＮｉＢＲ催化聚合技术的发展过程，分析了技术进步的原因，提出了改进我国ＮｉＢＲ催化聚合技术的意见。     

利用含镍废丝生产硫酸镍

本文介绍了用电子管中含镍废丝为原料，生产硫酸镍的工艺流程。产品质量达到部颁标准。     

Mathematical modelling of the MCFC cathode

Different models for the NiO cathode have been compared with respect to their abilities to predict polarization curves and the influence of the amount of electrolyte on the electrode performance. It has been shown that the agglomerate model for the MCFC cathode gives more reasonable results when the exterior agglomerate surface area is specifically taken into account. In the cathode only the outermost layer of nickel oxide particles in the agglomerate is utilized for the electrochemical reaction. The pseudohomogeneous approach is questionable for these agglomerates since the individual particles constituting the agglomerate are of the same size as the reaction zone thickness. A thin-film model with a roughness factor for the electrode surface appears to be as good a model as the agglomerate model. A model based on a chain of spherical agglomerates and the partially drowned agglomerate model are physically more realistic models than the homogeneous agglomerate model for the prediction of the influence of electrolyte fill on the electrochemical performance.     

MICROBRIDGE TESTING OF YOUNG''''S MODULUS AND RESIDUAL STRESS OF NICKEL FILM ELECTROPLATED ON SILICON WAFER

Microbridge testing is used to measure the Young's modulus and residual stresses ofmetallic films. Nickel film microbridges with widths of several hundred microns arefabricated by Microelectromechanical Systems. In order to measure the mechanicalproperties of nickel film microbridges, special shaft structure is designed to solve theproblem of getting the load--deflection curves of metal film microbridge by Nanoin--denter XP system with normal Berkovich probe. Theoretical analysis of the micro--bridge load--deflection curve is proposed to evaluate the Young's modulus and residualstress of the films simultaneously. The calculated results based on the experimentalmeasurements show that the average Young's modulus and residual stress are around190GPa and 175MPa respectively, while the Young's modulus measured by Nano-hardness method on nickel film with silicon substrate is 186.8±7.34GPa.