DXDK-70型包装机常见故障分析处理

我公司使用天津华特DXDK-70型包装机4台，在生产中出现的主要问题及解决方法作了详尽阐述，以供同行探讨。     

用于高频谐振器的PbTiO_3基压电陶瓷

传统的PZT压电陶瓷的相对介电常数较大,一般为1 000以上,用于高频谐振器不易与线路匹配;而PbTiO3基压电陶瓷的相对介电常数较小,一般仅为200左右,对于10 MHz以上频率的谐振器,用PbTiO3基压电陶瓷作为压电振子是最佳的选择。本文主要研究用于高频谐振器的MnO2和Nd2O3改性PbTiO3基压电陶瓷的性质。PbTiO3基压电陶瓷的性质的改善是与此种陶瓷的制备工艺,显微结构和电导机制紧密相关的。     

Investigation into polishing process of CVD diamond films

A new technique used for polishing chemical vapor deposition (CVD) diamond films has been investigated, by which rough polishing of the CVD diamond films can be achieved efficiently. A CVD diamond film is coated with a thin layer of electrically conductive material in advance, and then electro-discharge machining (EDM) is used to machine the coated surface. As a result, peaks on the surface of the diamond film are removed rapidly. During machining, graphitization of diamond enables the EDM process to continue. The single pulse discharge shows that the material of the coated layer evidently affects removal behavior of the CVD diamond films. Compared with the machining of ordinary metal materials, the process of EDM CVD diamond films possesses a quite different characteristic. The removal mechanism of the CVD diamond films is discussed.     

微米／纳米技术及其应用

介绍了当前国际上关于微米、纳米技术及其在微型机械、微型机械电子系统以及在专用集成型仪器等方面的应用。     

Formation and growth mechanism of TiC crystal in TiC_p/Ti composites

1　ＩＮＴＲＯＤＵＣＴＩＯＮＰａｒｔｉｃｌｅｓｒｅｉｎｆｏｒｃｅｄｔｉｔａｎｉｕｍａｌｌｏｙｍａｔｒｉｘｃｏｍｐｏｓｉｔｅｓ(ＴＭＣｐ)ｈａｖｅｗｉｄｅａｐｐｌｉｃａｔｉｏｎｆｉｅｌｄｓｆｏｒｔｈｅｉｒａｔｔｒａｃｔｉｖｅｈｉｇｈｓｐｅｃｉｆｉｃｓｔｒｅｎｇ     

辊式拉拔模用于连续拉拔机组的新技术

针对进口连续拉拔机组，独创设计了可配套使用的二连式辊模，并首次很好地解决了惯用模在辊模后的安装问题，是一种很有前途的新技术。     

宽带放大器可靠性问题浅析

叙述了国产高频宽带放大器的质量和可靠性现状，详细介绍了这类产品的质量一致性检验、可靠性摸底试验和现场使用过程中出现的可靠性问题，用统计的方法得出了可靠性特征量，通过对失效样品的失效分析，总结出宽带放大器主要的失效模式和失效机理，并提出了消除和减少失效、提高宽带放大器可靠性的措施和建议。     

Low temperature delamination of plastic encapsulated microcircuits

Plastic encapsulated microcircuits (PEMs) are increasingly being used in applications requiring operation at temperatures lower than the manufacturer’s recommended minimum temperature, which is 0°C for commercial grade components and −40°C for industrial and automotive grade components. To characterize the susceptibility of PEMs to delamination at these extreme low temperatures, packages with different geometries, encapsulated in both biphenyl and novolac molding compounds, were subjected to up to 500 thermal cycles with minimum temperatures in the range −40 to −65°C in both the moisture saturated and baked conditions. Scanning acoustic microscopy revealed there was a negligible increase in delamination at the die-to-encapsulant interface after thermal cycling for the 84 lead PQFPs encapsulated in novolac and for both 84 lead PQFPs and 14 lead PDIPs encapsulated in biphenyl molding compound. Only the 14 lead novolac PDIPs exhibited increased delamination. Moisture exposure had a significant effect on the creation of additional delamination.     

青霉素发酵过程的智能优化控制

本文在分析青霉素发酵补糖工艺的要求和存在的问题基础上,设计出智能控制算法,采用集散系统实现在线优化控制,经实际应用,效果明显。