新型低压片状模塑料增稠方法的研究

研究了低压片状模塑料的3种单一增稠体系，讨论了各种增稠剂用量对不饱和聚酯树脂增稠性能的影响情况。分析对比了各种增稠剂在增稠过程中的优缺点，从而采用联合增稠剂的方法，即将碱金属氧化物或氢氧化物(一般用氧化镁)与结晶树脂、端异氰酸酯基化合物与结晶树脂联合增稠不饱和聚酯树脂体系。研究表明，联合增稠剂的增稠效果比单一增稠剂的增稠效果要好，更加符合低压模塑的粘度和工业化生产的低成本要求。     

PZT/Fe3O4复合薄膜的制备及磁性和铁电性研究

用溶胶-凝胶方法制备了Pb（Zr0.5Ti0.5）O3-Fe3O4复合薄膜。XRD研究表明，Pb（Zr0.5Ti0.5）O3呈完全（100）取向，而Fe3O4颗粒则呈完全随机取向。在室温下探测到了共存的磁性和铁电性。铁电性测试结果表明，在9V的测试电压下，薄膜的Pr值为1．5／μc／cm^2。而磁性测量的结果表明，在1．5 T的外磁场作用下，薄膜的剩余磁化强度和饱和磁化强度分别为0．67emu／cm^3和3．5emu／cm^3。通过铁电材料Pb（Zr0.5Ti0.5）O3与磁性纳米Fe3O4粒子的复合获得了室温共存的铁电性和磁性。     

复合土工膜在除险加固工程中的应用

土工合成材料是一种新型工程材料.通过结合除险加固工程实例,对复合土工膜防渗原理、施工工艺及应用效果作了论述,并介绍了施工体会.     

复合催化剂在合成酯生产中的应用研究

研究了钛酸酯和锌酸盐复合而成的催化剂在合成酯（油酸多元醇酯）中的应用，实验结果表明，复合催化剂在合成酯生产中有良好的催化活性，可使酯化反应时间大大缩短，收率明显提高。     

PDMS基质微型管萃取-热解析-GC 联用测定水中有机物

选用聚二甲基硅氧烷(PDMS)基质微型管为固相微萃取的萃取介质,研究与考察了其与热解析-GC联用对水中痕量有机物的萃取解析特性与快速分析方法.在最佳萃取解析条件下,PDMS基质微型管对5 mL水样中痕量萘、联苯和菲的萃取性能良好,热解析完全.方法的线性范围为30～1000μg/L,线性度高(r＞0.992),最低检测限＜3 μg/L.雨水样品中萘、联苯和菲(100 μg/L)的加标回收率为70%～85%,RSD(n=3)为3%～14%.结果表明:该方法具有萃取效率高,简单快速、基质影响小,费用低廉等优点.     

阻燃防鼠型90°CPVC电缆护套料配方研究

本文分析了电缆用阻燃防鼠型90°CPVC护套料防鼠性能及阻燃性能分别与防鼠剂用量及阻燃剂用量的关系,阻燃防鼠PVC护套料物理机械性能及电气性能与树脂、增塑剂、稳定剂、抗氧剂、填充剂等添加剂之间的关系,介绍了阻燃防鼠90°CPVC护套料配方的研制过程及配方性能。     

Parameters on the LC alignment of organosilicon compound films

Abstract— The aligning properties of a set of organosilicon compounds (OSC) were examined. The aligning films of the OSC were obtained. Pretilt angles and the polar and azimuthal anchoring energy of the LC materials on the OSC films were measured by optical and voltage‐capacity methods. The influence of both OSC and LC molecular structure on the results obtained was analyzed and discussed.     

纳米铝酸锂粉体制备方法的研究

介绍了铝酸锂(LiAlO2)粉体的物理化学性能以及其目前的主要应用,特别是对LiAlO2粉体的多种合成方法进行了全面详细的介绍,比较了各种合成方法对粉体粒径及其分布、比表面积以及相组成等的影响,并展望了LiAlO2的潜在应用和发展.     

elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging

In flip chip technology, Al/Ni(V)/Cu under-bump metallization (UBM) is currently applicable for Pb-free solder, and Sn−Ag−Cu solder is a promising candidate to replace the conventional Sn−Pb solder. In this study, Sn-3.0Ag-(0.5 or 1.5)Cu solder bumps with Al/Ni(V)/Cu UBM after assembly and aging at 150°C were employed to investigate the elemental redistribution, and reaction mechanism between solders and UBMs. During assembly, the Cu layer in the Sn-3.0Ag-0.5Cu joint was completely dissolved into solders, while Ni(V) layer was dissolved and reacted with solders to form (Cu_1−y,Ni_y)₆Sn₅ intermetallic compound (IMC). The (Cu_1−y,Ni_y)₆Sn₅ IMC gradually grew with the rate constant of 4.63 × 10⁻⁸ cm/sec^0.5 before 500 h aging had passed. After 500 h aging, the (Cu_1−y,Ni_y)₆Sn₅ IMC dissolved with aging time. In contrast, for the Sn-3.0Ag-1.5Cu joint, only fractions of Cu layer were dissolved during assembly, and the remaining Cu layer reacted with solders to form Cu₆Sn₅ IMC. It was revealed that Ni in the Ni(V) layer was incorporated into the Cu₆Sn₅ IMC through slow solid-state diffusion, with most of the Ni(V) layer preserved. During the period of 2,000 h aging, the growth rate constant of (Cu_1−y,Ni_y)₆Sn₅ IMC was down to 1.74 × 10⁻⁸ cm/sec^0.5 in, the Sn-3.0Ag-1.5Cu joints. On the basis of metallurgical interaction, IMC morphology evolution, growth behavior of IMC, and Sn−Ag−Cu ternary isotherm, the interfacial reaction mechanism between Sn-3.0Ag-(0.5 or 1.5)Cu solder bump and Al/Ni(V)/Cu UBM was discussed and proposed.     

完全半双解析函数的一些性质

给出了完全半双解析函数的概念,讨论了它与完全半解析函数、双解析函数之间的关系,并对其性质进行了初步研究,得到了完全半双解析函数的线性性质、积分性质以及调和性质.