Cubic Phase GaN on Nano‐grooved Si (100) via Maskless Selective Area Epitaxy

A method of forming cubic phase (zinc blende) GaN (referred as c‐GaN) on a CMOS‐compatible on‐axis Si (100) substrate is reported. Conventional GaN materials are hexagonal phase (wurtzite) (referred as h‐GaN) and possess very high polarization fields (～MV/cm) along the common growth direction of <0001>. Such large polarization fields lead to undesired shifts (e.g., wavelength and current) in the performance of photonic and vertical transport electronic devices. The cubic phase of GaN materials is polarization‐free along the common growth direction of <001>, however, this phase is thermodynamically unstable, requiring low‐temperature deposition conditions and unconventional substrates (e.g., GaAs). Here, novel nano‐groove patterning and maskless selective area epitaxy processes are employed to integrate thermodynamically stable, stress‐free, and low‐defectivity c‐GaN on CMOS‐compatible on‐axis Si. These results suggest that epitaxial growth conditions and nano‐groove pattern parameters are critical to obtain such high quality c‐GaN. InGaN/GaN multi‐quantum‐well structures grown on c‐GaN/Si (100) show strong room temperature luminescence in the visible spectrum, promising visible emitter applications for this technology.     

Cl2/BCl3感应耦合等离子体GaN刻蚀侧壁形貌研究

基于感应耦合等离子体干法刻蚀技术,对采用Cl2/BCl3气体组分下GaN刻蚀后的侧壁形貌进行了研究。扫描电镜(SEM)结果表明,一定刻蚀条件下,刻蚀后GaN侧壁会形成转角与条纹状褶皱形貌。进一步实验,观察到了GaN侧壁转角形貌的形成过程;低偏压功率实验表明,高能离子轰击是GaN侧壁转角与条纹状褶皱形貌形成的原因。刻蚀过程中,掩蔽层光刻胶经过高能离子一段时间轰击后,其边缘首先出现条纹状褶皱形貌,并转移到GaN侧壁上,接着转角形貌亦随之出现并转移到GaN侧壁上。这与已公开发表文献认为的GaN侧壁条纹状褶皱仅由于掩蔽层边缘粗糙所引起而非刻蚀过程中形成的解释不同。     

Lightweight,Superelastic Boron Nitride/Polydimethylsiloxane Foam as Air Dielectric Substitute for Multifunctional Capacitive Sensor Applications

Porous polymeric foams as dielectric layer for highly sensitive capacitive based pressure sensors have been extensively explored owing to their excellent flexibility and elasticity. Despite intensive efforts, most of previously reported porous polymer foams still suffer from difficulty in further lowering the attainable density limit of ≈0.1 g cm^?3 while retaining high sensitivity and compressibility due to the limitations on existing fabrication techniques and materials. Herein, utilizing 3D interconnected networks of few‐layer hexagonal boron nitride foams (h‐BNFs) as supporting frameworks, lightweight and highly porous BN/polydimethylsiloxane composite foams (BNF@PDMS) with densities reaching as low as 15 mg cm^?3 and permittivity close to that of air are fabricated. This is the lightest PDMS‐based foam reported to date. Owing to the synergistic effects between BN and PDMS, these lightweight composite foams possess excellent mechanical resilience, extremely high compressibility (up to 95% strain), good cyclic performance, and superelasticity. Being electrically nonconductive, the potential application of BNF@PDMS as a dielectric layer for capacitive sensors is further demonstrated. Remarkably, the as‐fabricated device can perform multiple sensing functions such as noncontact touch sensor, environmental monitoring sensor, and high sensitivity pressure sensor that can detect extremely low pressures of below 1 Pa.     

Si_3N_4在BaTiO_3基低阻高性能PTCR陶瓷材料中的作用

要同时保证 PTCR材料和元件具有低室温电阻率和较高的 PTC特性 ,有较大难度。研究了添加 Si3N4作为烧结助剂 ,对 PTCR材料的显微结构和电学性能的影响。同添加 Si O2 作为烧结助剂相比 ,添加 1.0 %的 Si3N4的 PTCR材料更易同时满足低阻高性能要求。     

Trisneopentylgallium as a precursor for atomic layer epitaxy of GaAs

We report the use of a new precursor, trisneopentylgallium (NPG) for the growth of GaAs by atomic layer epitaxy (ALE). In contrast to most other alkyl gallium precursors such as triethylgallium, which decompose via a β-hydride elimination mechanism, this compound undergoes homolysis similar to that of trimethylgallium (TMGa), the normal choice as an ALE precursor. Clear self-limiting growth behavior similar to that of TMGa was observed over a reasonably wide range of growth conditions (430–500°C). Carbon incorporation was not significantly reduced compared with TMGa suggesting that the adsorbed neopentyl radicals undergo decomposition to result in a methyl terminated surface identical to that obtained for growth with TMGa.     

超薄氮氧叠层栅介质的金属栅pMOS电容的电学特性

研究了高质量超薄氮化硅/氮氧化硅(N/O)叠层栅介质的金属栅pMOS电容的电学特性,制备了栅介质等效厚度小于2nm的N/O复合叠层栅介质,该栅介质具有很强的抗硼穿通能力和低的漏电流.实验表明这种N/O复合栅介质与优化溅射W/TiN金属栅相结合的技术具有良好的发展前景.     

碳氮纳米管薄膜及其场致电子发射特性

利用微波等离子体增强化学气相沉积技术,在玻璃衬底上600℃～650℃的低温下制备出了碳氮纳米管薄膜,氮含量为12％,采用扫描电子显微镜(SEM)、X射线光电子谱(XPS)和Raman光谱等测试手段对所制备薄膜的表面形貌、微结构和成分进行了分析,并研究了其场致电子发射特性,阈值电场为3．7V／μm。当电场为8V／μm时,电流密度为413．3μA／cm^2,实验表明该薄膜具有优异的场发射性能,而且用这种方法制备的薄膜将大大简化平板显示器件的制作工艺。     

MCM用氮化铝共烧多层陶瓷基板的研究

通过实验优化AlN(氮化铝)瓷料配方及排胶工艺,对共烧W(钨)导体浆料性能及AlN多层基板的高温共烧工艺进行了研究,并对AlN多层基板的界面进行了扫描电镜分析。采用AlN流延生瓷片与W高温共烧的方法,成功地制备出了高热导率的AlN多层陶瓷基板,其热导率为190 W/(m·K),线膨胀系数为4.6106℃1(RT~400℃),布线层数9层,W导体方阻为9.8 m,翘曲度为0.01 mm/50 mm,完全满足高功率MCM的使用要求。     

Effects of CH2F2 and H2 flow rates on process window for infinite etch selectivity of silicon nitride to ArF PR in dual-frequency CH2F2/H2/Ar capacitively coupled plasmas

The process window for the infinite etch selectivity of silicon nitride (Si₃N₄) layers to ArF photoresist (PR) and ArF PR deformation were investigated in a CH₂F₂/H₂/Ar dual-frequency superimposed capacitive coupled plasma (DFS-CCP) by varying the process parameters, such as the low frequency power (P_LF), CH₂F₂ flow rate, and H₂ flow rate. It was found that infinitely high etch selectivities of the Si₃N₄ layers to the the ArF PR on both the blanket and patterned wafers could be obtained for certain gas flow conditions. The H₂ and CH₂F₂ flow rates were found to play a critical role in determining the process window for infinite Si₃N₄/ArF PR etch selectivity, due to the change in the degree of polymerization. The preferential chemical reaction of hydrogen with the carbon in the hydrofluorocarbon (CH_xF_y) layer and the nitrogen on the Si₃N₄ surface, leading to the formation of HCN etch by-products, results in a thinner steady-state hydrofluorocarbon layer and, in turn, in continuous Si₃N₄ etching, due to enhanced SiF₄ formation, while the hydrofluorocarbon layer is deposited on the ArF photoresist surface.