宽度和长度缩减对体硅和SOI nMOSFETs热载流子效应的影响

针对标准体硅在CMOS和PD SOI CMOS两种工艺下的nMOSFETs,研究了沟道长度和宽度缩减对热载流子效应的影响。实验结果表明,在两种工艺下,热载流子的退化均随着沟道长度的减小而增强;然而,宽度的减小对两种工艺热载流子退化的影响却截然不同：体硅工艺的热载流子退化随宽度的减小而增强,SOI工艺的热载流子退化随宽度的减小而减小。基于界面态对热载流子效应的影响深入分析了长度减小导致两种工艺下热载流子退化均加重的原因;同时基于边缘电场分布对热载流子效应的影响解释了宽度减小导致两种工艺下热载流子退化规律截然相反的现象。研究结果对于实际深亚微米工艺下,集成电路设计中器件工艺尺寸和版图结构的选择具有一定指导意义。     

Loss of Curing Agent During Thin Film (Droplet) Curing of Thermoset Material

Recently, it has been reported by our group and others^1.2 that loss of curing agent is encountered during the curing of small droplets or thin films of amine cured epoxies. In our earlier study³ results were reported on loss of curing agent in small droplets used in conducting the rnicrobond, single fiber test for determination of interfacial shear strength (ISS). It was reported that use of a volatile curing agent (meta-phenylene diamine (m-PDA) with DGEBA resin) resulted in increasing amounts of curing agent being lost (as measured by T₈ of the cured droplets) with decreasing droplet size during the processing procedure. Droplets smaller than 150 micrometers were seen to lose up to 40% of the curing agent leading to alteration of the mechanical properties of the droplet and, therefore, causing measured values of ISS to be exceedingly low. Use of a less volatile curing agent (Jeffamine 700, a polyether diamine, Texaco Specialty Chemicals) in combination with DGEBA resin produced results which indicated that loss of curing agent was not occuring. This study was undertaken to show the relationships between film (or droplet) size and the amount of curing agent lost (during the processing) for three different aminecured epoxy systems.     

Effects of core machining configuration on the debonding toughness of foam core sandwich panels

Core machining is often applied to improve the formativeness of foam core and the manufacturing effectiveness of sandwich panels. This paper investigates the effects of core machining configuration on the interfacial debonding toughness of foam core sandwich panels fabricated by vacuum-assisted resin transfer molding process. Several machining configurations are conducted to foam core, and skin–core debonding toughness of fabricated sandwich panels is evaluated using double-cantilever-beam tests. The sandwich panels with core cuts exhibited higher apparent fracture toughness than the panels without core cut, specifically in the case of perforated core. The relationship between core machining configuration and measured fracture toughness is discussed based on the experimental observations and the numerical analyses of energy release rates.     

茶生物质/聚丙烯复合材料的制备与性能研究

为高值化利用茶产业剩余物资源,以废弃茶生物质(Tea biomass,TB)为填料,聚丙烯(Polypropylene,PP)为基体,采用密炼-注塑工艺制备了TB/PP复合材料,考察了茶生物质填料种类、处理方式及其添加量对复合材料结构、形态及性能的影响。实验结果显示,以茶树枝为生物质填料制备的复合材料力学性能最佳,茶梗次之,茶叶最差;茶梗填料经水煮和马来酸酐接枝聚丙烯增容处理后,复合材料的拉伸强度、弯曲强度、拉伸模量及弯曲模量分别提高了23.4%、9.0%、16.9%和13.9%。SEM图片显示茶梗填料与基体界面相容性提高。随茶梗填料用量的增加,复合材料的拉伸模量、弯曲模量逐渐增大,而拉伸强度及断裂伸长率缓慢下降,吸水率增加,热性能得到改善。当TS添加量为30%(质量分数)时,复合材料的拉伸强度比PP减小7.3%,但弯曲强度、弯曲模量及拉伸模量则分别提高11%、86.1%和54.7%。浸水80h后吸水率为0.89%。     

Simplified Perovskite Solar Cell with 4.1% Efficiency Employing Inorganic CsPbBr3 as Light Absorber

Perovskite solar cells with cost‐effectiveness, high power conversion efficiency, and improved stability are promising solutions to the energy crisis and environmental pollution. However, a wide‐bandgap inorganic–semiconductor electron‐transporting layer such as TiO₂ can harvest ultraviolet light to photodegrade perovskite halides, and the high cost of a state‐of‐the‐art hole‐transporting layer is an economic burden for commercialization. Here, the building of a simplified cesium lead bromide (CsPbBr₃) perovskite solar cell with fluorine‐doped tin oxide (FTO)/CsPbBr₃/carbon architecture by a multistep solution‐processed deposition technology is demonstrated, achieving an efficiency as high as 4.1% and improved stability upon interfacial modification by graphene quantum dots and CsPbBrI₂ quantum dots. This work provides new opportunities of building next‐generation solar cells with significantly simplified processes and reduced production costs.     

（RbCl）108离子簇均相成核的分子动力学研究

分子动力学模拟测得熔融（RbCl)108离子簇在300K至600K温度时凝固的成核速率大于10^35m^-3s^-1,用均相成核的经典理论加以分析,估算得氯化铷离子簇的固液界面自由能σalT^1.4,用Grunasy提出的扩散界面理论加以分析,估算得扩展界面厚度约为0．195nm,σalT^0.97,2个理论在实验温度范围内没有明显判别,且均能较好地分子动力学模型的结果,但预测的较高温度下的成核速率有比较显著区别,因此进一步地研究将有助于鉴别它们。     

Predicting Interfacial Loads between the Prosthetic Socket and the Residual Limb for Below-Knee Amputees – A Case Study

Abstract:  In this study, an artificial neural network (ANN) was deployed as a tool to determine the internal loads between the residual limb and prosthetic socket for below-knee amputees. This was achieved by using simulated load data to validate the ANN and captured clinical load data to predict the internal loads at the residual limb–socket interface. Load/pressure was applied to 16 regions of the socket, using loading pads in conjunction with a load applicator, and surface strains were collected using 15 strain gauge rosettes. A super-position program was utilised to generate training and testing patterns from the original load/strain data collected. Using this data, a back-propagation ANN, developed at the University of the West of England, was trained. The input to the trained network was the surface strains and the output the internal loads/pressure. The system was validated and the mean square error (MSE) of the system was found to be 8.8% for 1000 training patterns and 8.9% for 50 testing patterns, which was deemed an acceptable error. Finally, the validated system was used to predict pressure-sensitive/-tolerant regions at the limb–socket interface with great success.     

马氏体相变的界面吸引子模型

从经典的马氏体相界面运动方程出发,利用相平面分析,证明具有界面摩擦的马氏体相界面是吸引子,与理想的马氏体相界面的孤立子特征不同.通过对非线性方程解的分析,得到发生应力诱发马氏体相变的相界面趋向为焦点型定常吸引子,而热诱发相变的马氏体相界面趋向为结点型定常吸引子,因此考虑界面摩擦后相界面的运动与理想相界面的运动具有不同的非线性特征.