Study on interfacial structure and strength of Si_3N_4/Ti/Cu/Ti/Si_3N_4 PTLP bonding

0IntroductionRecently,the development of bonding technique ofhigh temperature structure ceramic Si3N4becomes a hottopic in the field of ceramic bonding[1].Partial transientliquid phase bonding(PTLP)has been applied in the fieldof high temperature ceramic bonding and made some pro-gress.The selection of interlayer materials is key to PTLPbonding.Since Bender discovered that Ag-based brazingmaterial including Ti could wet ceramic in1954,morestudies have shown that Ti has good wetting prope…     

SiC／Ti基复合材料界面反应的热力学研究

通过建立热力学可能反应模型，分别计算了SCS－6 SiC长纤维增强Ti3Al和TiAl金属间化合物基复合材料界面反应的Gibbs函数变值△rG，并用△rG判据推测了界面反应产物并与透射电镜实验结果进行了对比分析。研究表明，由于TiAl中原子结合力较强，因而SCS－6 SiC/TiAl复合材料的界面反应较轻。所研究的2种复合材料界面反应的二元反应产物为TiC,Ti5Si3和Ti3Si,Ti-Si相图中的其它二元硅化物不可能形成。     

热处理对铸铁基多孔陶瓷复合材料组织与性能的影响

研究了热处理对铸铁基多孔陶瓷复合材料组织与性能的影响，结果表明，热处理正火，淬火均可不同程度地提高该复合材料的整体强度与耐磨性，而不影响铸铁－陶瓷的界面结构及材料的透气性。     

Mechanism of laser beam welding for SiCp／6063Al composite

The laser beam welding technique was used to process SiC particles/6063A1 alloy matrix composite, the influence of laser power and welding speed on the properties of joint was studied. Decreasing the laser beam power with same welding speed can make the quantity and size of A14C3 decreased, and the interactive mechanism of the reinforcing particles and the matrix in the joint and the causes for joint strength reduction were analyzed.Increasing welding speed properly can improve the distribution of energy and restrain the interfacial reaction in the molten pool, and measures for improving were proposed.     

Effect of bismuth on the growth kinetics of intermetallic compounds in Sn-3.5Ag solder joints: A growth kinetic model

The effect on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints, caused by adding Bi to eutectic Sn-3.5Ag solder alloy, was examined at the aging temperatures of 150°C and 180°C. The Cu₆Sn₅ layer growth was significantly enhanced, but the Cu₃Sn layer growth was slightly retarded by the addition of Bi, resulting in significant growth enhancement of the total (Cu₆Sn₅+Cu₃Sn) IMC layer with increasing Bi addition. The IMC layer growth in the Bi-containing solder joints was accompanied by the accumulation of Bi ahead of the Cu₆Sn₅ layer that resulted in the formation of a liquid layer at the Cu₆Sn₅/solder interface. A kinetic model was developed for the planar growth of the Cu₆Sn₅ and Cu₃Sn layers in the solder joints, accounting for the existence of interfacial reaction barriers. Predictions from the kinetic model showed that the experimental results could be well explained by the hypothesis that the formation of a Bi-rich liquid layer at the Cu₆Sn₅/solder interface reduces the interfacial reaction barrier at the interface.     

EXTRACTl0NKINETICS0FYTTRIUMWITHPURIFIEDCYANEX923FROMNITRATEMEDIUM

Mass transfer and extraction kinetics of yttrium with the purified Cyanex 923 in nheptane from nitrate medium have been investigated by using a constant interfacial cell with laminar flow at 298 K. The interfacial adsorption properties of purified Cyaner 923-heptane-0.2 mol/L (H,Na)NO3 were studied at 298 K. The experimental results show that the mass transfer is controlled by diffusion and the chemical reactions are carried out in the interfacial zone. The extraction rates of yttrium were measured at different chemical compositions by varying ionic strength, pH valused and the purified Cyane 923 concentrations. the initial extraction rate equations were obtained.     

Equivalent heat transfer coefficient at casting/Cu mould interface and temperature field simulation

1　INTRODUCTIONThesolidifiedmicrostructuresofalloysdependontheirsolidifyingprocesswhoseprimarycharacteristicsarethetemperaturedropofthesuperheatedmeltandthere leaseofthelatentheat.Sothestudyontheheattransferduringthesolidificationprocessistheessentialprobleminthesolidificationtheorystudy .Theresearchersworkingonthenumericalsimulationofthesolidificationprocessallknowthattheinterfacialheattransfercoefficientatthecasting/mouldisavariablechangingwithtime .Thusthedeterminationoftheinterfacialh…     

Gd0.8Sr0.2CoO3阴极的甘氨酸-硝酸盐法制备及性能研究

为探索适于中温条件下使用的固体氧化物燃料电池的阴极材料,用甘氨酸-硝酸盐法(GNP法)制备了Gd0.8Sr0.2CoO3(GSC)阴极粉体,用X-ray衍射考察了GSC的成相温度.采用丝网印刷法将GSC沉积在(Sm2O3)0.2(CeO2)0.8(SDC)圆片上,制成对称阴极,在不同温度下烧结.用交流阻抗谱从500℃到750℃测量了GSC阴极和SDC电解质之间的界面电阻.结果表明,用甘氨酸-硝酸盐法制备的GSC粉体的成相温度比传统固相法降低了400℃～500℃;700℃时,GSC阴极的界面电阻仅为0.26 Ω·cm2.     

铸铁中石墨及石墨—基体界面近区力学行为

在SEM下原位观察铁素体基铸铁在拉伸时的形变和石墨-基体(G—M)界面断裂微观过程,结果表明,铸铁中石墨不应视为孔隙;石墨未造成缺口应力集中对石墨对铸铁强度的影响作出新的解释     

Interfacial reaction between cubic boron nitride and Ti during active brazing

Thermodynamic and reaction process analyses were performed to understand the joining characteristic during high temperature brazing between cubic boron nitride (CBN) grit and a silver-base filler alloy containing Ti as an active element. Experimental information on the microstructure of the brazed joint, the composition of the interface, and the shape of the compounds formed on the surface of the grit was obtained by scanning electron microscopy, energy-dispersive x-ray, and x-ray diffraction. The results indicate that Ti in the molten filler alloy facilitated good wetting between the solid CBN crystals and braze filler alloy. The transition layer formed by the interaction of TiN and TiB₂ was one of the key factors in joining the CBN and steel substrate.