Effect of PEI cathode interlayer on work function and interface resistance of ITO electrode in the inverted polymer solar cells

In this paper, we investigated the effect of PEI cathode interlayer on the work function and the interface resistance of ITO electrode in the inverted polymer solar cells (PSCs) based on PBDTTT-C-T:PC₇₀BM. It is found that a very thin layer of PEI (⩽5.5 nm), either linear PEI (l-PEI) or branched PEI (b-PEI) with different molecular weights, is enough to lower the work function of the ITO electrode and to enhance the photovoltaic performance of the devices. The champion power conversion efficiency (PCE) of the devices with the PEI cathode interlayer is 7.84%, more than doubled of that without the interlayer. However, a thicker PEI interlayer (⩾10 nm) results in abrupt decrease of the PCEs due to the increase of the resistance. Interestingly, for the thicker interlayers, the l-PEI shows high photovoltaic performance than that of b-PEI, which can also be explained by their difference in the resistances. This work supplies an insight into the function of PEI cathode interlayer on improving the work function and resistance of ITO electrode in the inverted PSCs, and provides some instructions on the future design of interlayer materials in PSCs.     

Improved performance of inverted polymer solar cells by utilizing alcohol-soluble oligofluorenes as efficient cathode interlayers

Two star-shaped oligofluorenes with hexakis(fluoren-2-yl)benzene as core are designed and synthesized, namely Tn0 and Tn1. Diethylamino groups are attached to the side chain of fluorene units of Tn0 and Tn1 and enable them alcohol solubility, additional hydrophobic nhexyl chains are grafted on the π-extended fluorene arms of Tn1. Power conversion efficiency (PCE) as high as 8.62% and 8.80% are achieved when utilizing Tn0 and Tn1 as cathode interlayers in inverted polymer solar cells, respectively. The work function of ITO effectively decreased by introducing interlayer, resulting in high Voc of the device, besides, the wetting properties of the interlayers can be tuned by modifying the oligofluorenes with π-extended structure, and the more hydrophobic interlayer will benefit the device performance with enhanced Jsc and FF.     

Fabrication and thermo stability of the SnO2/Ag/SnO2 tri-layer transparent conductor deposited by magnetic sputtering

Using the magnetic sputtering technique, the SnO₂/Ag/SnO₂ tri-layer transparent films were fabricated on float glasses successfully. Compared with the commercial FTO (F-doped SnO₂) film, the SnO₂/Ag/SnO₂ tri-layer films have higher visible-light transmittance and better conductivity. The total thickness of the SnO₂/Ag/SnO₂ films is one third of the commercial FTO film leading to the high visible-light transmittance. The high carrier concentration of the SnO₂/Ag/SnO₂ films contributes to the tri-layer films’ low resistivity. In addition, to further improve the performance of the SnO₂/Ag/SnO₂ tri-layer films, samples were annealed under different temperatures. The results illustrate that the lowest sheet resistance (5.92 Ω/sq) and the highest visible-light transmittance (87.0%) were obtained after annealing at 200 °C. Furthermore, the thermal stability of the films could be enhanced by a multi-step annealing process due to the recrystallization effect.     

Joining of dense Si3N4 ceramics with tape cast Lu-Al-Si-O-N interlayer

Lu-Al-Si-O-N tapes with different thickness were used to join gas pressure sintered Si₃N₄ ceramics. The microstructure of the joints and the influences of the joint thickness and joining temperature on the bonding strength of the as-joined Si₃N₄ ceramics have been investigated. The highest bonding strength about ~ 300 MPa of the joined specimens was achieved by using 450 µm interlayer at 1450 °C. The existence of Si₃N₄ nanowires was beneficial for the improvement of the bonding strength by interweaving the oxynitride glass matrix in the joint region.     

Effects of SiNx interlayer on characterisation of amorphous diamond-like carbon films

The magnetron sputtering amorphous diamond-like carbon film is successfully deposited by SiN_x interlayer approach. The scanning electron microscopy study reveals the creation of high uniform surface micrograph diamond-like carbon films with SiN_x interlayer. For comparison, diamond-like carbon films with different interlayers are also grown. The Raman spectra are analyzed in order to characterize the stressed induce peak shifts of the films. The interactions of C atom with Si(100) and SiN_x surface are studied by density functional theory simulation. The effects of interlayers on the films deposition and the considering deposition mechanism are discussed. It is suggested that the diamond-like carbon and SiN_x bilayer structure can help to render applications in protective coatings and high quality silicon on diamond related radiation tolerance devices.     

Diffusion bonding of TiAl based alloy to Ti–6Al–4V alloy using amorphous interlayer

Powder metallurgical TiAl based alloy and Ti–6Al–4V (TC4) alloy were diffusion bonded at 915 °C for 1 h under a pressure of 80 MPa. Single Ti‐based amorphous or Ni‐based amorphous foil was utilized as an interlayer during diffusion bonding process. The tensile mechanical properties of the diffusion bonded joints between TiAl based alloy and TC4 alloy were tested. The fracture surface and microstructure characteristic of these joints were also observed carefully by scanning electron microscope. The TiAl based alloy with a fully lamellar microstructure is more suitable for diffusion bonding to TC4 alloy. Adding a Ti‐based amorphous interlayer is more conducive to the element diffusion, giving rise to the improvement in the mechanical properties of the diffusion bonded joints. Results also show that the diffusion bonded joints form a metallurgical bond and fracture in a brittle manner.     

Fabrication and characterization of in-situ duplex plasma-treated nanocrystalline Ti/AlTiN coatings

Plasma nitriding and plasma-assisted PVD duplex treatment was adopted to improve the load-bearing capacity, fatigue resistance and adhesion of the AlTiN coating. Ion etch-cleaning was applied for better adhesion before plasma nitriding. After plasma nitriding Ti interlayer was in-situ deposited by high power impulse magnetron sputtering (HIPIMS), followed by the AlTiN coating through in-situ deposition by advanced plasma-assisted arc (APA-Arc). The microstructure and properties of the duplex-treated coating were carefully characterized and analyzed. The results show that the thicknesses of the nitriding zone, the γ′-Fe₄N compound layer, the Ti interlayer and the AlTiN top layer with nanocrystalline microstructures are about 60 μm, 2–3 μm, 100 nm and 6.1 μm, respectively. The nitriding rate is about 30 μm/h and the AlTiN coating deposition rate reaches 6.1 μm/h. The interfacial adhesion of the Ti/AlTiN coating is well enhanced by ion etch-cleaning and a Ti interlayer, and the load-bearing capacity is also improved by duplex treatment. In addition, the instinct hardness of the Ti/AlTiN coating reaches 3368HV_0.05 while the wear rate coefficient of 5.394×10⁻⁸ mm⁻³/Nm is sufficiently low. The Ti/AlTiN coating, which possesses a high corrosion potential (E_corr=−104.6 mV) and a low corrosion current density (i_corr=4.769 μA/cm²), shows highly protective efficiency to the substrate.     

Ti-Nb-Cu作缓冲层的TiC金属陶瓷/304不锈钢扩散连接

对TiC金属陶瓷和304不锈钢进行真空扩散连接实验,并采用Ti/Nb/Cu中间层以实现活性连接并缓解接头残余应力的目的。对焊接接头进行详细的组织分析和力学性能测试来评估焊接工艺。分析发现在TiC金属陶瓷和304不锈钢之间形成明显的转变过渡区,界面反应产物为（Ti,Nb）,剩余Nb,剩余Cu以及 Cu（s.s）。连接温度925℃,保温时间20min,压力8MPa下得到的接头剪切强度达84.6MPa,此时脆性断裂发生在靠近界面处的陶瓷内部。结果表明,中间层Ti/Nb/Cu的合理选择能很好的降低金属间化合物对接头性能的有害作用,而且Nb对接头残余应力的改善起到关键作用,有效的提高了接头强度。     

坝基不同倾角软弱夹层的破坏模式及D-C模型参数研究

坝基岩体中的软弱夹层对抗滑稳定影响重大,因此对其破坏模式及本构模型参数的研究具有重要意义。采用软弱夹层重塑样进行三轴压缩试验,下部未泥化部分采用泥化部分土掺入20%水泥代替,上部采用泥化部分土制样,泥化部分与未泥化部分交界面分别制成0°,30°,45°,60°倾斜面并作粗糙处理模拟实际界面特性。试验结果表明:含不同倾角结构面的软弱夹层试样临界角范围为58.3°～61.7°,当结构面倾角介于临界角范围之内时,软弱夹层试样沿结构面破坏,当结构面倾角位于临界角范围之外时,软弱夹层试样在上部泥化部分土中破坏;对软弱夹层试样三轴试验ε((σ_1-σ_3))–ε_1关系曲线进行线性拟合,结果表明,随围压增加,试样初始切线模量及极限破坏强度均增加,根据试验结果得出了相应的D-C模型参数并将其应用于坝基抗滑设计中,取得了良好效果。本研究成果对坝基软弱夹层的抗滑设计及同类软弱夹层工程性质的研究具有一定参考价值。