Fatigue crack initiation and growth in solder alloys

In modern electronic packaging, especially surface mount technology (SMT), thermal strain is usually induced between components during processing, and in service, by a mismatch in the thermal expansion coefficients. Since solder has a low melting temperature and is softer than other components in electronic packaging, most of the cyclic stresses and strains take place in the solder. Fatigue crack initiation and fatigue crack propagation are likely to occur in the solder even when the cyclic stress is below the yield stress. It is an objective of this research to study the behaviour of fatigue crack initiation and propagation in both lead‐containing solder (63Sn‐37Pb), and lead‐free solders (Sn‐3.5Ag). The effect of alloying (Cu and Bi addition), frequency, tensile hold time and temperature on low cycle fatigue (LCF) behaviour of the solders is discussed. Mechanisms of LCF crack initiation and propagation are proposed and LCF life prediction, based on the various models, is carried out.     

Re‐calibration of Engelmaier's Model for Leadless,Lead‐free Solder Attachments

In this paper, the solder attachment fatigue model created by Werner Engelmaier is re‐calibrated in order to make it applicable in conjunction with leadless, lead‐free solder attachments. Sn3.8Ag0.7Cu solder attached ball‐grid‐array components are addressed to three thermal cycling test profiles. Based on the results, both physical and statistical parameters are obtained and compared with the values relevant to tin–lead solder assemblies. The validity of the statistical distribution selection (two‐parameter Weibull) is studied. Acceleration factors correlating different test profiles are obtained, and they are found to be only weakly dependent on the test vehicle type. Copyright © 2006 John Wiley & Sons, Ltd.     

新型焊接技术——免清洗焊剂和无铅焊锡膏

鉴于全球电子制造业正向着绿色生产的方向发展,美国、日本、欧洲等一些国家制定了专项法规,保护人居环境。为此,本文重点介绍了绿色焊接材料——免清洗焊剂和无铅焊锡膏的发展历程及其主要性能、特点以及存在的问题。阐述了国内外免清洗焊剂和无铅焊锡膏的研究现状及其在电子组装技术中的应用前景。     

无铅钎料的研究现状及进展

从环保概念出发,介绍了使用无铅钎料的必要性;综述了近几年国内外无铅钎料的研究现状;分析了无铅钎料研究必须解决的几个关键问题,并提出了解决这些问题的思路和建议。     

钎剂中松香等组分与Sn-9Zn/Cu润湿相关性

基于均匀设计方法研究了松香等6种钎剂组分与Sn-9Zn/Cu润湿相关性.在试验中把松香、氯化锌、氯化氨、乙二醇、油酸、乳酸各个变量因子分成3组,每组中各因子分成12个水平.使用UST4.0均匀设计计算机软件,对所测润湿铺展面积进行了逐步地统计回归分析,得到3个多项式方程.结果表明,氯化锌、油酸以及氯化锌和氯化氨的交互作...     

Sn-9Zn-xP无铅焊料合金性能研究

以Sn-9Zn合金为研究对象,考察了P的添加对其性能的影响,并对其机制作了初步探讨。通过二次离子质谱(SIMS)分析发现,P的添加显著降低Sn-9Zn合金中的含氧量,从而提高了合金在Cu上的润湿性。P的改善润湿性的效果不仅有利于其工艺性能,也提高了Sn-9Zn/Cu焊点界面的结合强度,只使其塑性略有下降。同时,微量P的添加不改变Sn-9Zn合金与Cu形成的焊点的界面结构。另外,蠕变强度测试结果表明,P的添加能显著提高合金的抗蠕变性能。     

Implicit integration and consistent tangent modulus of a time‐dependent non‐unified constitutive model

This paper describes the implicit integration and consistent tangent modulus of an inelastic constitutive model with transient and steady strain rates, both of which are time‐ and temperature‐dependent; the transient rate is influenced by the evolution of back stress decomposed into parts, while the steady rate depends only on applied stress and temperature. Such a non‐unified model is useful for high‐temperature structural analysis and is practical owing to the ease in determining material constants. The implicit integration is shown to result in two scalar‐valued coupled equations, and the consistent tangent modulus is derived in a quite versatile form by introducing a set of fourth‐rank constitutive parameters into the discretized evolution rule of back stress. The constitutive model is, then, implemented in a finite element program and applied to a lead‐free solder joint analysis. It is demonstrated that the implicit integration is very accurate if the multilinear kinematic hardening model of Ohno and Wang is employed, and that the consistent tangent modulus certainly affords quadratic convergence to the Newton–Raphson iteration in solving nodal force equilibrium equations. Copyright © 2003 John Wiley & Sons, Ltd.     

62Sn36Pb2Ag钎料中Ag元素对AgCu/SnPbAg/CuBe焊缝性能的影响

分别采用62Sn36Pb2Ag钎料和63Sn37Pb共晶钎料焊接AgCu合金块和CuBe合金片进行试验,对比分析两种钎料形成的焊缝性能和显微组织结构,阐述了62Sn36Pb2Ag钎料中Ag元素的存在对AgCu/SnPbAg/CuBe焊缝性能的影响机制.结果表明,62Sn36Pb2Ag钎料中的Ag元素对于润湿铺展状态的改...     

SnAgCu无铅焊膏可印刷性及焊点微观结构研究

焊膏的印刷质量及焊点的微观结构直接影响产品的最终性能和使用效果.通过对焊膏印刷性能及焊点微观结构的研究,可以制定出合适的印刷和焊接工艺,从而提高产品的最终性能和使用效果.本文以紧耦合气雾化法制备的SnAgCu合金粉末为原料,对不同质量配比下焊膏的流变和塌陷性能以及焊点的微观结构进行研究,采用旋转流变仪和扫描电镜分别对焊...     

单片机控制的电阻钎焊系统

在电阻钎焊基本原理的基础上，介绍了利用AVR单片机设计开发的电阻钎焊控制系统，分析了单片机的软硬件结合。 时给出了利用热电偶放大和数字转换器MAX6675采集和处理温度信号的基本连接电路并分析了其优点。